Silicon Wafer Committee Europe Werner Bergholz, Jacobs University Bremen Friedrich Passek, Siltronic AG Peter Wagner Updated October 23, 2014

Task Forces with European Participation Int. Advanced Wafer Geometry (AWG) TF Leaders: N. Poduje, SMS, J. Sinha, KLA-Tencor,,S. Akiyama, Raytex, F. Passek, Siltronic AG/F. Riedel, Siltronic AG Int. Advanced Surface Inspection (ASI) TF Leaders: K. Haller, KLA-Tencor, Y. Tamaki, F. Riedel, Siltronic AG Int. Terminology TF Leaders: M. Bullis, Materials & Metrology, T. Nakai, Sumco, P. Wagner Int. Test Methods TF Leaders: D. Gupta, STA, R. Takeda, P. Wagner Int. Polished Wafer TF Leaders: M. Bullis, Materials & Metrology, T. Takenaka, Consultant, K. Matsukawa, Renesas, K. Izunome, GlobalWafers F. Riedel, Siltronic AG

Meeting Information Last meeting in Europe Next meeting October 7-8, 2014 SEMICON Europa Grenoble, France Next meeting Oct, 2015 Dresden, Germany (An additional Spring meeting in Europe is possible; details will be posted if confirmed) Check www.semi.org/standards for latest update

Leadership Changes None.

Ballot results Doc. 5500, New Standard: Specifications for Polished Single Crystal Silicon Wafers for Gallium Nitride-On-Silicon Applications Passed as standard SEMI M84-0414 in April 2014 Doc. 5403: Withdrawal of SEMI MF534-0707, Test method for bow of silicon wafers Passed as balloted Doc. 5604: Line Item Revision to SEMI M1-0414 specifications for polished single crystal silicon wafers and semi m20-1110 practice for establishing a wafer coordinate system Doc. 5702: Line Item Revision to SEMI M68-1109, practice for determining wafer near-edge geometry from a measured height data array using a curvature metric, zdd Passed with editorial changes

New SNARFs Int. Polished Wafer TF Int. Advanced Wafer Geometry TF 11/18/2018 New SNARFs Int. Polished Wafer TF No new SNARFs Int. Advanced Wafer Geometry TF

Int. Advanced Wafer Geometry TF Leaders: N. Poduje, SMS, J. Sinha, KLA-Tencor,,S. Akiyama, Raytex, F. Passek, Siltronic AG/F. Riedel, Siltronic AG Meeting at SEMICON Europa 2014 Doc. #5403 – Withdrawal of SEMI MF534-0707, Test Method for Bow of Silicon Wafers The document was balloted in Si Wafer Cycle 5 and unanimously accepted Doc. #5702 – Line Item Revision to M68-1109, Practice for Determining Wafer Near-Edge Geometry from a Measured Height Data Array using a Curvature Metric, ZDD This document was balloted and passed. Ballot rejects were withdrawn.

Int. Advanced Surface Inspection TF Leaders: K. Haller, KLA-Tencor, Y. Tamaki, F. Riedel, Siltronic AG Meeting at SEMICON Europa 2014 No new regional activity

Int. Terminology TF Leaders: M. Bullis, Materials & Metrology, T. Nakai, Sumco, P. Wagner No meeting in Europe for a while Contributions to on-going activities regarding SEMI M59, Terminology for Silicon Technology. Goal is to collect all definitions and acronyms in M59 and to remove them subsequently from the originating standards

Int. Test Methods TF D. Gupta, STA, R. Takeda, P. Wagner Meeting at SEMICON Europa 2014 Discussion about revision of: Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry  Draft of SNARF available

Int. Polished Wafer TF Meeting at SEMICON Europa 2014 Leaders: M. Bullis, Materials & Metrology, T. Takenaka, Consultant, K. Matsukawa, Renesas, K. Izunome, GlobalWafers F. Riedel, Siltronic AG Meeting at SEMICON Europa 2014 Doc #5604: Line Item Revision to SEMI M1-0414 specifications for polished single crystal silicon wafers and semi m20-1110 practice for establishing a wafer coordinate system Passed as balloted

International 450 mm Wafer Task Force No meeting at SEMICON Europa New Activity Approval of SNARF # 5794: New Standard: Specification Of Developmental 450mm Diameter Polished Single Crystal Notchless Silicon Wafers With Back Surface Fiducial Marks

Questions? Contact James Amano (jamano@semi.org)/HQ Kevin Nguyen (knguyen@semi.org)/HQ Andrea Busch (abusch@semi.org)/Europe