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EU Silicon Wafer Committee Liaison Report

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Presentation on theme: "EU Silicon Wafer Committee Liaison Report"— Presentation transcript:

1 EU Silicon Wafer Committee Liaison Report
Updated November 2, 2010

2 Event, Venue information
Meeting Information Last Meeting October 20, 2010 in conjunction with SEMICON Europa, Dresden, Germany Next Meeting To be determined, check calendar of event for latest update 11/23/2018 Event, Venue information

3 EU Silicon Wafer Committee
Committee Co-chairs W. Bergholz, Jacobs University Bremen P. Wagner 11/23/2018 Event, Venue information

4 Task Forces with European Participation
Int. Advanced Wafer Geometry (AWG) TF Leaders: P. Langer, N. Poduje, W. Baylies, S. Akiyama, Raytex, M. Yoshise, KLA-Tencor, F. Passek, Siltronic AG Int. Advanced Surface Inspection (ASI) TF Leaders: J. Stover, TSW, G. Kren, KLA-Tencor, H. Ohta, Hitachi Terminology TF Leaders: M. Bullis, Materials & Metrology, T. Nakai, Sumco Test Methods TF Leaders: D. Gupta, STQ, M. Watanabe, NuFlare Technology, P. Wagner 11/23/2018 Event, Venue information

5 Int. Advanced Wafer Geometry TF
Meeting in Dresden on October 20, 2010 3335D, Guide for Determining Nanotopography Published as SEMI M Current activities Doc 4813, Revision to M49, addition of new technology generations and ERO metrics, on ballot Presentation by T. Fukuda, Fujitsu: Impact of edge profile on wafer breakage Presentation by J. Hager, KT: 450 Transition Considerations F. Passek, Siltronic AG: QFD regarding the ranking of criteria for 450 mm flatness measurement New: Questionnaire regarding EE for ERO metrics for 450 mm wafers 11/23/2018 Event, Venue information 5

6 Event, Venue information
Int. 450 mm Wafer TF Meeting in Dresden, October 20 Leaders: M. Goldstein, Intel, M. Watanabe, NuFlare Si industry update: inspection tools coming on-line , wafer geometry: Kuroda, Kobelco, E&H 450 mm wafers benchmarking: LLS (Nanophotonics, > 90 nm), SIRD (JenaWave), wafer shape, SFQR, surface metals (Balasz) Supply line in good shape 11/23/2018 Event, Venue information 6

7 Event, Venue information
Int. Terminology TF No meeting in Dresden Contributions to on-going activities regarding SEMI M59, Terminology for Silicon Technology. Goal is to collect all definitions and acronyms in M59 and to remove them subsequently from the originating standards 11/23/2018 Event, Venue information 7

8 Event, Venue information
Int. Test Methods TF No Meeting in Dresden 11/23/2018 Event, Venue information 8

9 Event, Venue information
Int. ASI TF No Meeting in Dresden 11/23/2018 Event, Venue information 9

10 PV Committee - EU PV Silicon Materials TF
Leader: Peter Wagner Several PV silicon producers, represented by the European Photovoltaic Industry Association (EPIA) support the activity: Dow Corning, Elkem Solar, Hemlock, PV Crystalox Solar Silicon, Wacker Chemie, REC, Siliken and Sunicon. Charter: Develop and maintain standards regarding specifications for bulk silicon materials used in manufacturing solar cells. Identify missing standardized test methods for PV Silicon Materials Define and develop common understanding of terms used in PV industry Educate industry about new standards Current Activity: Doc. 4805B Specification For Virgin Silicon Feedstock Materials For Photovoltaic Applications (To be balloted in cycle 1-11 for review at PV Fab Managers Forum March, 2011) 11/23/2018 Event, Venue information

11 Event, Venue information
Contact For more information, please contact Kevin Nguyen at 11/23/2018 Event, Venue information


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