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Traceability Japan TC Chapter Liaison Report

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Presentation on theme: "Traceability Japan TC Chapter Liaison Report"— Presentation transcript:

1 Traceability Japan TC Chapter Liaison Report
October 27, 2015 R0.1 To: North America Fall 2015 Meetings

2 Traceability Japan TC Chapter
Outline Leadership Organization Chart Meeting Information Document Review Summary Approved SNARF Upcoming Ballot TF reports Fall 2015 Traceability Japan TC Chapter

3 Traceability Japan TC Chapter
Leadership Committee Co-chairs Yoichi Iga (Self) Hirokazu Tsunobuchi (Keyence) Fall 2015 Traceability Japan TC Chapter

4 Traceability Japan TC Chapter Organization Chart
Traceability Committee Yoichi Iga (Self) Hirokazu Tsunobuchi (keyence) Japan PV Traceability TF Yoichi Iga (Self) Hirokazu Tsunobuchi (Keyence) 5 Year Review TF Kazuhiro Tsunobuchi (Keyence) Fiducial Mark Interoperability TF I&C Committee: M. Matsuda (Hitachi Kokusai Electric) PI&C Committee: S. Mashiro (Tokyo Electron) Silicon Wafer Committee: T. Nakai (SUMCO) Packaging Committee: S. Masuchi (DISCO) Traceability Committee: H. Tsunobuchi (KEYENCE) Fall 2015 Traceability Japan TC Chapter

5 Traceability Japan TC Chapter
Meeting Information Last meeting December 5, 2014 in conjunction with SEMICON Japan 2014 Tokyo Big Sight Conference Tower, Tokyo, Japan Next meeting December 18, 2015 in conjunction with SEMICON Japan 2015 Fall 2015 Traceability Japan TC Chapter

6 Approved SNARF by GCS on June 30, 2015
Doc # Description TF 5890 Revision to SEMI T “Specification for back surface marking of double-side polished wafers with a two-dimensional matrix code symbol” Fiducial Mark Interoperability TF Fall 2015 Traceability Japan TC Chapter 6

7 Traceability Japan TC Chapter
Ballots to be reviewed at Japan Standards Winter 2015 Meetings in conjunction with SEMICON Japan 2015 Cycle Doc # Description TF 5890 Revision to SEMI T “Specification for back surface marking of double-side polished wafers with a two-dimensional matrix code symbol” Fiducial Mark Interoperability TF Fall 2015 Traceability Japan TC Chapter 7

8 Traceability Japan TC Chapter
Task Force Updates [1/3] 5 years review Task Force Leader Hirokazu Tsunobuchi (KEYENCE) Current activity T12, T13 and T19 to be reviewed for 5-Year-Review at the next meeting of Traceability Japan TC Chapter on December 18, 2015 Fall 2015 Traceability Japan TC Chapter

9 Traceability Japan TC Chapter
Task Force Updates [2/3] Japan PV Traceability TF Co-leaders Yoichi Iga (Self) Hirokazu Tsunobuchi (KEYENCE) Charter The objective is to define and elaborate several standards to unify PV traceability from the sliced wafer to the end of PV cell life-cycle. Scope The activities of the task force will result in the development of several industry standards where equipment suppliers, cell manufacturers, PV module manufacturers, PV users and other involved parties can find conformity, in any technical field of PV traceability. Initial work will focus on Marking of ID to identify a product Means to identify as a right product Security countermeasure to realize other Traceability depending on need Anti-Counterfeiting Activity TF decided to discontinue Doc. 5594, New Standard: Guide for Smart Label for PV Traceability, which was reported at Traceability Japan TC Chapter meeting on Dec. 6 in conjunction with SEMICON Japan 2013 Fall 2015 Traceability Japan TC Chapter

10 Traceability Japan TC Chapter
Task Force Updates [3/3] Fiducial Mark Interoperability TF T7 issues Traceability Japan TC Chapter assigned following up the activity for T7 to Fiducial Mark Interoperability TF Section 2.1 (T7 adoption of non-silicon materials) Figure 3 small modification M20 coordinate system (based on negative to 5752 [withdrawn]) TF decided to delete all position specifications from SEMI T7 because position specifications are also described on SEMI M1 and other related Silicon Standard. SNARF was approved by GCS. (SNARF 5890) Document 5890 was submitting to Cycle 7. To be adjudicated at the next Japan TC Chapter meeting of Traceability Global TC in conjunction with SEMICON Japan 2015. Others Silicon: Give up to develop new Standard for 450mm Development Wafer with fiducial Mark Assembly and Packaging: Discussing backend alignment issues with introducing fiducial mark wafer. Fall 2015 Traceability Japan TC Chapter

11 Traceability Japan TC Chapter Liaison Report Thank You!
End of Traceability Japan TC Chapter Liaison Report Thank You! For more information, please contact Chie Yanagisawa at SEMI Japan Fall 2015 Traceability Japan TC Chapter 11


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