1. Silicon Wafer Europe TC Chapter Werner Bergholz, Jacobs University Bremen Friedrich Passek, Siltronic AG Peter Wagner
Updated September 14, 2015

2. Task Forces with European Participation
Int. Advanced Wafer Geometry (AWG) TF
Leaders: N. Poduje, SMS, J. Sinha, S. Akiyama, Raytex, F. Passek, Siltronic AG/F. Riedel, Siltronic AG
Int. Advanced Surface Inspection (ASI) TF
Leaders: K. Haller, KLA-Tencor, Y. Tamaki, F. Riedel, Siltronic AG
Int. Terminology TF
Leaders: M. Bullis, Materials & Metrology, T. Nakai, Sumco, P. Wagner
Int. Test Methods TF
Leaders: D. Gupta, STA, R. Takeda, P. Wagner
Int. Polished Wafer TF
Leaders: Mike Goldstein, John Valley - Sun Edison, T. Takenaka, Consultant, K. Matsukawa, Renesas, K. Izunome, GlobalWafers F. Riedel, Siltronic AG

3. Meeting Information Last meeting in Europe Next meeting
October 7-8, 2014
SEMICON Europa
Grenoble, France
Next meeting
Oct 7, 2015
Dresden, Germany
Check for latest update

4. Leadership Changes
None.

5. Ballot results
Doc. 5403: Withdrawal of SEMI MF , Test method for bow of silicon wafers
Passed as balloted
Doc. 5604: Line Item Revision to SEMI M specifications for polished single crystal silicon wafers and SEMI M practice for establishing a wafer coordinate system (Notchless 450 mm)
Doc. 5702: Line Item Revision to SEMI M , practice for determining wafer near-edge geometry from a measured height data array using a curvature metric, zdd
Passed with editorial changes

6. Ballots to be reviewed
Doc. 5737, Revision of SEMI MF (Reapproved 0912), Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption
Doc. 5804, Revision of SEMI M , Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Monodisperse Reference Spheres on Unpatterned Semiconductor Wafer Surfaces
Doc. 5859, Line Item Revisions of SEMI MF , Guide for Estimating the Power Spectral Density Function and Related Finish Parameters from Surface Profile Data

7. Int. Advanced Wafer Geometry TF
Leaders: N. Poduje, SMS, J. Sinha,S. Akiyama, Raytex, F. Passek, Siltronic AG/F. Riedel, Siltronic AG
Meeting at SEMICON Europa 2014
Doc. #5403 – Withdrawal of SEMI MF , Test Method for Bow of Silicon Wafers
The document was approved.
Doc. #5702 – Line Item Revision to M , Practice for Determining Wafer Near-Edge Geometry from a Measured Height Data Array using a Curvature Metric, ZDD
This document was approved.

8. Int. Advanced Surface Inspection TF
Leaders: K. Haller, KLA-Tencor, Y. Tamaki, F. Riedel, Siltronic AG
Meeting at SEMICON Europa 2014
No new regional activity

9. Int. Terminology TF
Leaders: M. Bullis, Materials & Metrology, T. Nakai, Sumco, P. Wagner
No meeting in Europe for a while

10. Int. Test Methods TF D. Gupta, STA, R. Takeda, P. Wagner
Meeting at SEMICON Europa 2014
Contributions to NA and Japan TF

11. Int. Polished Wafer TF Meeting at SEMICON Europa 2014
Leaders: Mike Goldstein, John Valley-Sun Edison, T. Takenaka, Consultant, K. Matsukawa, Renesas, K. Izunome, GlobalWafers F. Riedel, Siltronic AG
Meeting at SEMICON Europa 2014
Doc #5604: Line Item Revision to SEMI M specifications for polished single crystal silicon wafers and SEMI M practice for establishing a wafer coordinate system (Notchless 450 mm)
Passed as balloted

12. Questions? Contact James Amano (jamano@semi.org)/HQ
Kevin Nguyen