SPIROC update Felix Sefkow Most slides from Ludovic Raux HCAL main meeting April 18, 2007.

Slides:



Advertisements
Similar presentations
Jeudi 19 février 2009 Status of SPIROC chips Michel Bouchel, Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin-Chassard, Christophe de La.
Advertisements

6 Mar 2002Readout electronics1 Back to the drawing board Paul Dauncey Imperial College Outline: Real system New VFE chip A simple system Some questions.
SKIROC New generation readout chip for ECAL M. Bouchel, J. Fleury, C. de La Taille, G. Martin-Chassard, L. Raux, IN2P3/LAL Orsay J. Lecoq, G. Bohner S.
20 Feb 2002Readout electronics1 Status of the readout design Paul Dauncey Imperial College Outline: Basic concept Features of proposal VFE interface issues.
1 H-Cal front-end ASIC Status LAL Orsay J. Fleury, C. de la Taille, G. Martin, L. Raux.
ECAL electronics Guido Haefeli, Lausanne PEBS meeting 10.Jan
Preliminary Design of Calorimeter Electronics Shudi Gu June 2002.
L.Royer– Calice DESY – July 2010 Laurent ROYER, Samuel MANEN, Pascal GAY LPC Clermont-Ferrand R&D LPC Clermont-Fd dedicated to the.
Reports from DESY Satoru Uozumi (Staying at DESY during Nov 11 – 25) Nov-21 GLDCAL Japan-Korea meeting.
Second generation Front-end chip for H-Cal SiPM readout : SPIROC DESY Hamburg – le 13 février 2007 M. Bouchel, F. Dulucq, J. Fleury, C. de La Taille, G.
CALICE Meeting DESY ITEP&MEPhI status report on tile production and R&D activities Michael Danilov ITEP.
MR (7/7/05) T2K electronics Beam structure ~ 8 (9?) bunches / spill bunch width ~ 60 nsec bunch separation ~ 600 nsec spill duration ~ 5  sec Time between.
Integrated electronic for SiPM KOBE – 29 June ‘07 M. Bouchel, F. Dulucq, J. Fleury, C. de La Taille, G. Martin-Chassard, N. Seguin, L. Raux, S. Blin, P.
Readout ASIC for SiPM detector of the CTA new generation camera (ALPS) N.Fouque, R. Hermel, F. Mehrez, Sylvie Rosier-Lees LAPP (Laboratoire d’Annecy le.
AHCAL – DIF Interface EUDET annual meeting – Paris Oct M. Reinecke.
7 Nov 2007Paul Dauncey1 Test results from Imperial Basic tests Source tests Firmware status Jamie Ballin, Paul Dauncey, Anne-Marie Magnan, Matt Noy Imperial.
AHCAL electronics. Status and Outlook Peter Göttlicher for the AHCAL developers CALICE meeting UT Arlington, March 11th, 2010.
AHCAL Electronics. Status and Outlook Mathias Reinecke CALICE collaboration meeting Cambridge, UK March 16th-19th, 2012.
EUDET FEE status C. de LA TAILLE. EUDET annual meeting 6 oct 08 cdlt : FEE statrus 2 EUDET module FEE : main issues 2 nd generation ASICs –Self triggering.
Front-End electronics for Future Linear Collider calorimeters C. de La Taille IN2P3/LAL Orsay on behalf of the CALICE and EUDET collaborations
P. Baron CEA IRFU/SEDI/LDEFACTAR Meeting Santiago de Compostela March 11, A review of AFTER+ chip Its expected requirements At this time, AFTER+
Features of the new Alibava firmware: 1. Universal for laboratory use (readout of stand-alone detector via USB interface) and for the telescope readout.
L.ROYER – TWEPP Oxford – Sept The chip Signal processing for High Granularity Calorimeter (Si-W ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy.
Hold signal Variable Gain Preamp. Variable Slow Shaper S&H Bipolar Fast Shaper 64Trigger outputs Gain correction (6 bits/channel) discriminator threshold.
Organization for Micro-Electronics desiGn and Applications HARDROC 3 for SDHCAL OMEGA microelectronics group Ecole Polytechnique CNRS/IN2P3, Palaiseau.
Vendredi 18 décembre 2015 Status report on SPIROC chips Michel Bouchel, Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin- Chassard, Christophe.
L.Royer– Calice LLR – Feb Laurent Royer, J. Bonnard, S. Manen, P. Gay LPC Clermont-Ferrand R&D pole MicRhAu dedicated to High.
AHCAL Electronics. SPIROC2 and HBU measurement results Mathias Reinecke CALICE main meeting Univ. HASSAN II, Casablanca, Morocco Sept. 23rd, 2010.
L.Royer – Calice Manchester – Sept A 12-bit cyclic ADC dedicated to the VFE electronics of Si-W Ecal Laurent ROYER, Samuel MANEN LPC Clermont-Ferrand.
Slide 1Turisini M. Frontend Electronics M.Turisini, E. Cisbani, P. Musico CLAS12 RICH Technical Review, 2013 June Requirements 2.Description of.
11 October 2002Paul Dauncey - CDR Introduction1 CDR Introduction and Overview Paul Dauncey Imperial College London.
Organization for Micro-Electronics desiGn and Applications Ludovic Raux OMEGA microelectronics group Ecole Polytechnique & CNRS IN2P3
Front-End electronics for Future Linear Collider calorimeters C. de La Taille IN2P3/LAL Orsay On behalf of the CALICE collaboration
CSNSM SPIROC : Silicon PM Readout ASIC Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin-Chassard, Christophe de La Taille, Ludovic Raux.
VMM Update Front End ASIC for the ATLAS Muon Upgrade V. Polychronakos BNL RD51 - V. Polychronakos, BNL10/15/131.
HaRDROC performance IN2P3/LAL+IPNL+LLR R. GAGLIONE, I. LAKTINEH, H. MATHEZ IN2P3/IPNL LYON M. BOUCHEL, J. FLEURY, C. de LA TAILLE, G. MARTIN-CHASSARD,
PArISROC Photomultiplier Array Integrated in Sige Read Out Chip Selma Conforti Frédéric Dulucq Christophe de La Taille Gisèle Martin-Chassard Wei
SPIROC : Silicon PM Readout ASIC Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin-Chassard, Christophe de La Taille, Ludovic Raux IN2P3/OMEGA-LAL.
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
1 Second generation Front-end chip for H-Cal SiPM readout : SPIROC Réunion EUDET France – LAL – jeudi 5 avril 2007 M. Bouchel, F. Dulucq, J. Fleury, C.
June 13rd, 2008 HARDROC2. June 13rd, 2008 European DHCAL meeting, NSM 2 HaRDROC1 architecture Variable gain (6bits) current preamps (50ohm input) One.
Front-end Electronic for the CALICE ECAL Physic Prototype Christophe de La Taille Julien Fleury Gisèle Martin-Chassard Front-end Electronic for the CALICE.
CALICE/EUDET FEE status C. de LA TAILLE. 31 aug 2009 EUDET SC meeting Status of JRA3 Front End Electronics 2 ILC front-end ASICs : the ROC chips SPIROC.
Study of the MPPC for the GLD Calorimeter Readout Satoru Uozumi (Shinshu University) for the GLD Calorimeter Group Kobe Introduction Performance.
SPIROC ADC measurements S. Callier, F. Dulucq, C. de La Taille, M. Faucci, R. Poeschl, L. Raux, J. Rouenne, V. Vandenbussche.
Front end electronics for the Tile HCAL prototype Felix Sefkow DESY CALICE Collaboration ECFA workshop Durham September 1, 2004.
SKIROC status Calice meeting – Kobe – 10/05/2007.
Organization for Micro-Electronics desiGn and Applications HGCAL Front-End Electronics Christophe de LA TAILLE, Marcello MANNELLI sept 2015.
STATUS OF SPIROC measurement
Front-end Electronic for a neutrino telescope : a new ASIC SCOTT
ASIC PMm2 Pierre BARRILLON, Sylvie BLIN, Selma CONFORTI,
CTA-LST meeting February 2015
HR3 status.
R&D activity dedicated to the VFE of the Si-W Ecal
L. Ratti, M. Manghisoni Università degli Studi di Pavia INFN Pavia
R&D on large photodetectors and readout electronics FJPPL KEK/Orsay JE Campagne, S. Conforti, F. Dulucq, C. de La Taille, G. Martin-Chassard,, A.
Second generation Front-end chip for H-Cal SiPM readout : SPIROC
TDC at OMEGA I will talk about SPACIROC asic
Front-End electronics for CALICE Calorimeter review Hamburg
Scintillator HCAL readout
Felix Sefkow CALICE/EUDET electronics meeting CERN, July 12, 2007
02 / 02 / HGCAL - Calice Workshop
STATUS OF SKIROC and ECAL FE PCB
SPIROC Status : Last developments for SPIROC
ECAL Electronics Status
SKIROC status Calice meeting – Kobe – 10/05/2007.
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
Signal processing for High Granularity Calorimeter
AIDA KICK OFF MEETING WP9
Scintillator HCal Prototype
Presentation transcript:

SPIROC update Felix Sefkow Most slides from Ludovic Raux HCAL main meeting April 18, 2007

Felix SefkowSpiroc update 2 Topics: ASIC overview Noise level requirements Trigger schemes Readout options

Felix SefkowSpiroc update3 IN test ns Gain selection 4-bit threshold adjustment 10-bit DAC 15ns DAC output HOLD Slow Shaper Fast Shaper Time measurement Charge measurement Fast ramp 300ns 12-bit Wilkinson ADC Trigger Depth 16 Common to the 36 channels 8-bit DAC 0-5V Low gain Preamplifier High gain Preamplifier Analog memory 15pF 1.5pF 0.1pF-1.5pF Conversion 80 µs READ Variable delay 0.1pF-1.5pF IN Discri Gain FlagTdc

Felix SefkowSpiroc update 4 SPIROC : Photoelectron response simulation High gain Preamplifier response Low gain Preamplifier response Fast shaper High gain Slow shaper Low gain Slow shaper Tp=15ns Tp=50ns Noise/pe ratio = 25 Noise/pe ratio = 11 Noise/pe ratio = 3 1mV/pe 10mV/pe 120mV/pe Simulation obtained with SiPM gain = 10 6 _ 1 pe = 160 fC Ludovic Raux

Felix SefkowSpiroc update 5 Comparison of different Multipixel Geiger Photo Diods (MGPD) MGPD were illuminated with Y11 (green) and scintillator (blue) light Efficiency was normalized to MPPC one. Noise frequency Misha Danilov

Felix SefkowSpiroc update 6 Noise limits Gain can be as small as 0.2*10 6 Noise can be so low that threshold at 1.5 p.e is possible Trigger mode: – limit given by occupancy:  T > 4-5 σ( Noise) –Noise must be below 1/5 * 1.5 * 0.2 * 10 6 e  N/p.e.> 17 High gain mode: –Limit given by separation of single p.e. peaks  G > 3-4 σ (Noise) –Noise must be below 1/4 * 0.2 * 10 6 e  N / p.e. > 20  Low gain mode: –Limit given by MIP resolution dominated by Poisson statistics: σ(Noise) < 1/3 σ( Poisson) –Noise must be below 0.2 * 10 6 e  N / p.e > 5  High gain (“calibration”) mode most challenging –Gain some factor with higher impedance of r/o lines

Felix SefkowSpiroc update 7 Experience with MPPCs Operated at 2.something V  gain * 10 6 (~ SiPM) –Just works Keep an eye on dynamic range Actually no saturation seen so far in DESY 6 GeV e beam N oise= 40 ADC (calib mode) Gain = 150 ADC MPPC noise Satoru Uozumi B.Lutz

Felix SefkowSpiroc update 8 SiPM readout SPIROC: Data volume: –36 channels, ADC + TDC + time stamp = 948 bits / event –16 time slices: 15 kbit Readout speed: –5 MHz: 3-4 ms / chip if RAM full –1 MHz: ms / chip ILC: 200 ms max readout time –5 MHz: max 50 VFE / FE, 1 MHz: max 10 VFE / FE –HCAL layer 2000 channels / 36/chip = 60 chips  1 FE –Faster with parallel readout or faster clock Test beam: –Asymptotic rate: 16 / ms = Hz Test beam layer: 1 m 2  only 2x faster

Felix SefkowSpiroc update 9 SiPM buffer depth: ILC case ILC mode: 3 MHz bunch crossing rate for 1 ms (3000 bx/train) –300 Hz – 3 kHz noise from SiPM above ½ MIP threshold : 0.3 to 3 hits per train Buffer depth of 16 ok for individual trigger –.OR. of 36 channels: trigger rate of 10 – 100 kHz Buffer of 16 slices fills up in 0.16 – 1.6 ms Not sufficient for ILC cycle Independent of physics topology, because noise and not physics induced –Full channel-by-channel zero suppression only in 3 rd generation ASICs (like ECAL)

Felix SefkowSpiroc update 10 SiPM buffer depth: test beam Testbeam mode –Need to adjust readout cycle to noise rate and buffer depth –Shorten r/o cycle to 0.1 ms? –Asymptotic rate stays the same: 80 Hz for 200 ms r/o –BUT: –Without external trigger read mainly noise Physics fraction = beam rate / noise rate ~ 1/10 … 1/100 Effective rate for 1 kHz beam –only 1 or few Hz for.OR.ed auto-trigger –Order of 50 Hz for individual trigger

Felix SefkowSpiroc update 11 Fast timing 1 In present system shaping acts as latency – and is too short –Would like to go from 200 ns to, say, 400 ns SiPM shaping in physics mode is shorter ( ns)  need to decouple shaping and latency, store charge in- between See next slide

Felix SefkowSpiroc update 12 Timing 10ns 50 ns5000 ns hold beam clock start stop TDC validate reset 300 ns External trigger drive

Felix SefkowSpiroc update 13 Fast timing 2 Timing scheme takes care of difference between shaping time = hold delay and latency for validation If validation in next clock cycle, loose data –Dead-time = latency / clock (in test beam only) –Long cycle (50000 ns): < 10%, no problem

Felix SefkowSpiroc update14

Felix SefkowSpiroc update 15 Readout options New DAQ A prototype DIF –Hopefully using the same protocols and software standards The old CRCs? –In principle possible –But only for amplitudes (Charge) –Possibility to read TDC being invastifgated, but adds complication and risk Need better understanding of schedules to make most practical choice

SCA T SCA Q HG SCA Q LG 50ns TDC Ramp Digital Block Start_ramp_TDC 16 Shaper high gain Shaper low gain OR36 Channel Discri 50ns 16 50ns 16 Hold RazRangNb OR36 Channel Discriminator ValidHoldAnalogb Ramp signal Discri signal 50ns

Felix SefkowSpiroc update 18 Summary ASIC design in full swing, presently working on simulation and analysis Signal over noise levels nominally OK even for lower MPPC gain ILC mode of operation can be tested External trigger scheme for test beam implemented, to protect against SiPM noise Functionality with old DAQ possibly restricted (no TDC?) Submission in June