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L.ROYER – TWEPP Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy.

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Presentation on theme: "L.ROYER – TWEPP Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy."— Presentation transcript:

1 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The chip Signal processing for High Granularity Calorimeter (Si-W Ecal @ ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy Mic roelectronics Rh ône- Au vergne Group – IN2P3

2 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 2 The International Linear Collider (Credit: Greg Stewart, SLAC) Time structure of the ILC:  Bunchtrains of 2820 bunches spaced 337 ns  Each bunch train is about 1 ms long  No beam during about 199 ms Activity of the Very Front End Electronics:  During the beam activity:  analog signal processing (1ms)  A the end of the beam activity:  A-to-D signal conversion (.5ms max)  data transfer (.5ms max)  Idle mode during 198ms    about 99% of the time with no activity for electronics on detectors ILC BEAM STRUCTURE ILC “could be the next big adventure in particle physics” “It would complement the LHC at CERN and shed more light on the discoveries scientists are likely to make there in the coming years.” [http://www.linearcollider.org/] Analog electronics busy 1ms (.5%) A/D conv..5ms (.25%) DAQ.5ms (.25%) IDLE MODE 198ms (99%)

3 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 3 Challenges for the Si-W Ecal  Sandwich structure of thin wafers of silicon diodes & tungsten layers  Embedded Very Front End (VFE) electronics  Deeply integrated electronics  Minimal cooling available  High granularity : diode pad size of 5x5 mm 2  High segmentation : ≈ 30 layers  ≈ 100.10 6 channels  Large dynamic range of the input signal (≈ 15 bits) « Tracker electronics with calorimetric performance » ILC Calorimeters

4 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 Readout Electronics for the Si-W Ecal 4  Specifications of the readout electronics of Ecal:  Dynamic range of the signal delivered by a Si-diode : from MIP (4 fC) to 2500 MIPs (10 pC)  Level of noise limited to 1/10 MIP  SNR ≈ 10  Error of Linearity:  < 0.1 % up to 10 % of the dynamic range (1 pC)  < 1% from 10 % and 100 % of the dynamic range (10 pC)  Power budget limited to 25µW per channel  Power Pulsing must be implemented

5 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 First prototype readout channel 5  Some results:  Global Linearity better than 0.1 % (10 bits) up to 9.5 pC (2375 MIP).  ENC = 1.8 fC (0.5 MIP) with a single gain stage  Power consumption with power pulsing estimated to 25µW  Results published in IEEE TNS (ISSN : 0018-9499) CSA  Axes of development @ MicRhAu:  Synchronous/clocked (with beam) analog signal processing: reseted-CSA, shaping with Gated Integrators including the analog memory, latched comparators  Fully differential architecture, except for the Charge Sensitive Amplifier (CSA)  One low-power ADC attached to each channel (12-bit cyclic ADC)  Use of a pure CMOS technology, no bipolar transistors (low cost AMS CMOS 0.35 techno.) Cyclic ADC

6 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 The CALOrimetry Readout Integrated Circuit (1/4) 6 Low noise CSA Low-gain shaper 12-bits cyclic ADC ADC 4  Based on the previous validated prototype, a new chip designed  Technology AMS CMOS 0.35 µm  Architecture of CALORIC based on the previous channel tested, with some improvements:  Reduction of the power consumption of the CSA  Reduction of the noise of the amplifier of the Gated Integrator  Increase of the analog memory depth to 16  Chip fully power pulsed

7 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 7  A High-Gain (about x 20) channel added to improve the SNR at low energy  A discriminator indicates the dynamic range of the signal  select the signal to be converted Low noise CSA Low-gain shaper 12-bits cyclic ADC ADC 4 x16 The CALOrimetry Readout Integrated Circuit (2/4) High-gain shaper Gain discri. x16 Threshold

8 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 8 Low noise CSA Low-gain shaper 12-bits cyclic ADC ADC High-gain shaper 4 Gain discri. Analog part High-gain shaper Amplifier x5 Trigger discri. x16  A Trigger channel added to auto-select events over the MIP  The trigger signal determinates if the active memory cell is reset or the signal kept into memory The CALOrimetry Readout Integrated Circuit (3/4) Threshold

9 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 9 Digital Block (State Machine) 12 Output data Control of the channel Low noise CSA Low-gain shaper 12-bits cyclic ADC ADC High-gain shaper 4 Amplifier x5 Gain discri. Trigger discri. Thresholds Analog part x16  A digital block controls the chip The CALOrimetry Readout Integrated Circuit (4/4)

10 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 Global State Machine 10 IDLE Analog signal processing Analog signal processing WAIT for 198 ms No power WAIT for 198 ms No power 1 ms max. Up to 16 events stored 1 ms max. Up to 16 events stored Time conversion < 1 ms A/D conversion x events stored End of the bunch trains DAQ (not implemented) DAQ (not implemented) All events converted Bunch Crossing Wake Up Master clock of 20 MHz (period of 50 ns) At the end of idle time, digital state machine wakes up and is ready to manage new events. Analog electronics busy 1ms (.5%) A/D conv..5ms (.25%) DAQ.5ms (.25%) IDLE MODE 198ms (99%)

11 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 + 350 ns: ready to process next event 11 Timing of the analog processing t = 0 ns: bunch crossing (event synchronous w/ beam) + 200 ns: activation of the trigger comparator + 250 ns: activation of the gain comparator + 300 ns: end of integration: reset or memorization Output signal of the CSA Output signal of the trigger channel Output signal of high-gain channel Output signal of the low-gain channel Signal delivered by the Si-diode Bunch period = 350 ns

12 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 Layout of CALORIC_1ch 12 Gated Integrator and the 2x16 memory cells CSA, trigger channel and comparators The cyclic ADC The digital block Channel area in AMS 350nm : 1.2 mm²

13 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 13 Main Performance of Caloric_1ch  Most functionalities are validated: charge is collected, converted to voltage, amplified, filtered, memorized and digitally converted; the digital block manages well the sequencing of the signal processing  Trigger channel non-functional  signal dominated by noise (digital signals) and too large offset  Bug on the routing of power pulsing signal  ENC (rms value) with C D =30 pF: 0.6 fC (3750 e-)  MIP-to-noise ratio 6  Integral Non-Linearity:  < 0.2% up to 0.4 pC  < 1% from 1 pC to 6 pC  Gain dispersion for 16 memory cells :  1.5% (rms value) the low-gain  2.5% for the high-gain  Results published in IEEE TNS (ISSN : 0018-9499) ENC= 0.6 fC

14 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 Power consumption of Caloric_1ch 14 CSA Trigger channel Low Gain channel High Gain channel  Evaluation using power pulsing with the ILC duty cycle: 43 µW/channel

15 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 15  4-channel chip designed  Power pulsing bug corrected  New amplifier for the trigger channel less sensitive to process& mismatch fluctuations  Gated integrator: Time-variant system  Noise simulations performs both with transient noise and periodic noise tools from Cadence  Results in accordance (difference < 10%)  MIP/noise=10 for trigger channel Caloric_4ch (1/3) Threshold voltage Simulated noise: MIP/10 Output signal of the trigger channel on MIP event vs process/mismatch fluctuation Spectral density of the noise for the trigger channel

16 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 16  Shapers & ADC fully differential to reduce sensitivity to common-mode noise  Few “common sense rules” implemented for the layout to minimize noise coupling:  Analog and digital blocks isolated from one another with free-space and p+ guard rings  Analog and digital blocks with own independent power supply  Complementary signals for clock to minimize injection to analog signals  Several Pads per each power supply to reduce the inductance of bounding wiring  On-chip decoupling capacitors  Sensitive analog signal lines far away from perturbing lines  Digital pads with high toggle rate placed far from analog domain  Package have to be carefully chosen Minimizing noise coupling from the digital part to the analog part  MIP/10 = 0.4fC equivalent to a voltage step of 3.3V on a 0.12 fF capacitor !! Caloric_4ch (2/3)

17 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 17 (2.7 x 2.7) mm 2 Submission to the next AMS run in November Channel 1 Channel 4 Channel 2 Channel 3 Decoupling capacitors Caloric_4ch (3/3)

18 L.ROYER – TWEPP 2012 @ Oxford – Sept. 2012 Conclusion  We have designed a pure CMOS–differential-synchronous readout electronics dedicated to the Si-W Ecal of ILC.  All the functionalities have been tested and most are validated: amplification, filtering, memorizing, A-to-D conversion, global state machine for sequencing.  But two main functionalities are missing: the auto-triggering and the power pulsing. They will be tested with Caloric-4ch.  This work shows the difficulties to detect and process very small charge (<1fC) inside a mixed analog/digital chip. A technology with higher resistivity substrate (BFMOAT with 130nm IBM RF technology) should be better suited for mixed-signal design.  Power consumption must be divided by a factor 2 to reach requirements of ILC. It is not a trivial issue but improvements must be focused on the amplifiers.  This development provides us successful experiences in the design of low noise CSA, time-variant filtering, A-to-D converters, mixed chip, ….  This experience will be useful for the present and future projects @ MicRhAu. 18 THANK YOU !


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