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20 Feb 2002Readout electronics1 Status of the readout design Paul Dauncey Imperial College Outline: Basic concept Features of proposal VFE interface issues.

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Presentation on theme: "20 Feb 2002Readout electronics1 Status of the readout design Paul Dauncey Imperial College Outline: Basic concept Features of proposal VFE interface issues."— Presentation transcript:

1 20 Feb 2002Readout electronics1 Status of the readout design Paul Dauncey Imperial College Outline: Basic concept Features of proposal VFE interface issues Power and grounding scheme More questions than answers!

2 20 Feb 2002Readout electronics2 Basic concept Want to run close to “TESLA mode”: Learn how to operator at collider Looks like innovative LC R&D; more chance of funding Operate according to “bunch trains”: Timing set by TESLA parameter; not necessarily related to beam timing Store digitised data near front end and read out after train; demonstrate untriggered running

3 20 Feb 2002Readout electronics3 Basic concept (2) TESLA train is 2820 bunches, 337 ns apart @ 5Hz 337 ns is ~ 3 MHz –Readout ADC’s will sample at this rate –Particle signal appears for one sample only –Maximum clock needed is 16 x 3 MHz = 48 MHz 2820 bunches is ~ 1ms –Readout allows up to 4096 bunches –Would a maximum of 2048 bunches (~ 0.7 ms) be a significant issue? Ignor 5 Hz repetition rate

4 20 Feb 2002Readout electronics4 Overview of readout Front end card (FEC) connects to VFE chip Link interface card (LIC) does electrical- optic conversion “on-detector” Back end card (BEC) interfaces to PC.

5 20 Feb 2002Readout electronics5 Front end card (FEC) One FEC handles 3 silicon wafers = 7 VFE chips = 108 channels (has 112 = 7x16 channels). Results in 90 FEC’s in total. VFE chips mounted on daughterboard(s); need to think about interface here (later) All power and ground routed through FEC.

6 20 Feb 2002Readout electronics6 Front end card (2) Features ADC’s sample VFE output at 12 MHz to allow for up to four gain ranges to be used Large memory stores raw data and small memory stores data after threshold cut; either or both can be read out. On-board DAC to generate calibration pulse All timing adjustments software configurable to a 48 MHz scale (21 ns).

7 20 Feb 2002Readout electronics7 Link interface card (LIC) One LIC handles 15 FEC’s (5 layers). Results in 6 LIC’s in total Clock and control on uplink sent to all 15 FEC’s; data from same FEC’s on downlink. Power and ground routed through LIC.

8 20 Feb 2002Readout electronics8 Back end card (BEC) Not so well defined: Functionally simple –To uplink: clock (from fast control) and StartTrain or PC commands to FEC’s –From downlink: data from FEC’s to memory and then to PC Implementation not so obvious –Several options being considered –Sketch out one; VME system where this functionality is split over two physical cards

9 20 Feb 2002Readout electronics9 BEC driver One BEC driver handles all 6 LIC’s. Clock and control distributed from here Interfaces to fast control and VME for PC control

10 20 Feb 2002Readout electronics10 BEC receiver One BEC receiver handles 30 FEC’s = 2 LIC’s. Results in 3 BEC receivers in total. Buffers readout data until read by VME Checks FEC’s are still synchronised after train

11 20 Feb 2002Readout electronics11 BEC options Other possibilities are: CompaqPCI crate rather than VME –Similar but maybe cheaper; can this be combined with HCAL readout? Implement on PCI cards –Plug into PC bus directly; no crate –Restricted by small size; need to rethink data handling as memories will not fit Interface BEC’s directly to network –TPC/IP interface; send data to disk as IP packets.

12 20 Feb 2002Readout electronics12 Data readout rates Noise above threshold ~ 0.1% (3  ) ~ 10 channels per sample ~ 30000 per train Showers ~ 1800 samples per shower ~ 7 kBytes Readout mainly limited by VME ~ 25 MBytes/s Shower readout at ~kHz should be possible. How much data do we expect? TBytes?

13 20 Feb 2002Readout electronics13 VFE daughterboard interface Important to be sure we agree at VFE-FEC. We assume the VFE daughterboard needs: Sample-and-hold clock and gain range clock Power and ground Calibration signals We assume it gives out: Differential analog signal per channel; what are the voltage levels?

14 20 Feb 2002Readout electronics14 VFE daughterboard interface (2) Clocks; send differential digital, suggest LVDS: 3 MHz sample-and-hold clock 12 MHz gain range clock; max of 4 gains Phase of these (and ADC’s) adjustable to 21 ns Power and ground: Power for VFE chips themselves; what voltages and power consumption? Bias voltage for silicon diodes; ditto? Separate analog and digital power and ground?

15 20 Feb 2002Readout electronics15 VFE daughterboard interface (3) Calibration: Will calibration pulses go to diodes, VFE inputs or both? Multiple capacitors? Selectable? Channel selection, digital TTL. What granularity; any possible combination of channels? 16-bit configurable DAC on FEC; sets constant analog level; same for all channels on FEC. Differential; what voltage range and polarity? Time of single pulse set by digital signal; LVDS. Configurable to a 48 MHz tick; fine enough?

16 20 Feb 2002Readout electronics16 VFE daughterboard interface (4) Pin count seems reasonable: Analog signals = 32 pins/VFE chip Calibration selection = 16 pins/VFE chip Calibration analog voltage = 2 pins Clocks and calibration time = 6 pins Power and ground = 8 pins (?) Implies 64-pin connector per VFE chip: All 7 VFE chips on one daughterboard? Each VFE chip on its own daughterboard?

17 20 Feb 2002Readout electronics17 Power and grounding This scheme routes all power out, and grounds back, in a “tree” configuration: Power supply (who buys this?) to all 6 LIC’s Each LIC to 15 FEC’s Each FEC to 7 VFE chips and 3 wafers Requires no grounding of diodes or VFE chips elsewhere to avoid ground loops: Must have no electrical contact to carbon fibre support structure; is this possible/desirable?

18 20 Feb 2002Readout electronics18 Summary We think we have a feasible system: –Need to firm it up over next few weeks to submit proposal –After that, major system changes will be very difficult (unless cheaper!) We need a lot of information (soon) to cost it properly: –How and when do we get the answers we need? –Are some of them known already?

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