1. Silicon Wafer Committee Europe Werner Bergholz, Jacobs University Bremen Friedrich Passek, Siltronic AG Peter Wagner
Updated October 23, 2014

2. Task Forces with European Participation
Int. Advanced Wafer Geometry (AWG) TF
Leaders: N. Poduje, SMS, J. Sinha, KLA-Tencor,,S. Akiyama, Raytex, F. Passek, Siltronic AG/F. Riedel, Siltronic AG
Int. Advanced Surface Inspection (ASI) TF
Leaders: K. Haller, KLA-Tencor, Y. Tamaki, F. Riedel, Siltronic AG
Int. Terminology TF
Leaders: M. Bullis, Materials & Metrology, T. Nakai, Sumco, P. Wagner
Int. Test Methods TF
Leaders: D. Gupta, STA, R. Takeda, P. Wagner
Int. Polished Wafer TF
Leaders: M. Bullis, Materials & Metrology, T. Takenaka, Consultant, K. Matsukawa, Renesas, K. Izunome, GlobalWafers F. Riedel, Siltronic AG

3. Meeting Information Last meeting in Europe Next meeting
October 7-8, 2014
SEMICON Europa
Grenoble, France
Next meeting
Oct, 2015
Dresden, Germany
(An additional Spring meeting in Europe is possible; details will be posted if confirmed)
Check for latest update

4. Leadership Changes
None.

5. Ballot results
Doc. 5500, New Standard: Specifications for Polished Single Crystal Silicon Wafers for Gallium Nitride-On-Silicon Applications
Passed as standard SEMI M in April 2014
Doc. 5403: Withdrawal of SEMI MF , Test method for bow of silicon wafers
Passed as balloted
Doc. 5604: Line Item Revision to SEMI M specifications for polished single crystal silicon wafers and semi m practice for establishing a wafer coordinate system
Doc. 5702: Line Item Revision to SEMI M , practice for determining wafer near-edge geometry from a measured height data array using a curvature metric, zdd
Passed with editorial changes

6. New SNARFs Int. Polished Wafer TF Int. Advanced Wafer Geometry TF
11/18/2018
New SNARFs
Int. Polished Wafer TF
No new SNARFs
Int. Advanced Wafer Geometry TF

7. Int. Advanced Wafer Geometry TF
Leaders: N. Poduje, SMS, J. Sinha, KLA-Tencor,,S. Akiyama, Raytex, F. Passek, Siltronic AG/F. Riedel, Siltronic AG
Meeting at SEMICON Europa 2014
Doc. #5403 – Withdrawal of SEMI MF , Test Method for Bow of Silicon Wafers
The document was balloted in Si Wafer Cycle 5 and unanimously accepted
Doc. #5702 – Line Item Revision to M , Practice for Determining Wafer Near-Edge Geometry from a Measured Height Data Array using a Curvature Metric, ZDD
This document was balloted and passed. Ballot rejects were withdrawn.

8. Int. Advanced Surface Inspection TF
Leaders: K. Haller, KLA-Tencor, Y. Tamaki, F. Riedel, Siltronic AG
Meeting at SEMICON Europa 2014
No new regional activity

9. Int. Terminology TF
Leaders: M. Bullis, Materials & Metrology, T. Nakai, Sumco, P. Wagner
No meeting in Europe for a while
Contributions to on-going activities regarding SEMI M59, Terminology for Silicon Technology. Goal is to collect all definitions and acronyms in M59 and to remove them subsequently from the originating standards

10. Int. Test Methods TF D. Gupta, STA, R. Takeda, P. Wagner
Meeting at SEMICON Europa 2014
Discussion about revision of: Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry  Draft of SNARF available

11. Int. Polished Wafer TF Meeting at SEMICON Europa 2014
Leaders: M. Bullis, Materials & Metrology, T. Takenaka, Consultant, K. Matsukawa, Renesas, K. Izunome, GlobalWafers F. Riedel, Siltronic AG
Meeting at SEMICON Europa 2014
Doc #5604: Line Item Revision to SEMI M specifications for polished single crystal silicon wafers and semi m practice for establishing a wafer coordinate system
Passed as balloted

12. International 450 mm Wafer Task Force
No meeting at SEMICON Europa
New Activity
Approval of SNARF # 5794: New Standard: Specification Of Developmental 450mm Diameter Polished Single Crystal Notchless Silicon Wafers With Back Surface Fiducial Marks

13. Questions? Contact James Amano (jamano@semi.org)/HQ
Kevin Nguyen
Andrea Busch