1. Japan PI&C Committee Liaison Report
North America PI&C Committee
30th March, 2011

2. <Region> <Committee>
Outline
Leadership
Organization Chart
Meeting Information
Ballot Results/Upcoming Ballots
New TFOF/SNARF
TF reports
STEP
<Month> <Year>
<Region> <Committee>

3. <Region> <Committee>
Leadership
Committee Co-chairs
Shoji Komatsu (Acteon)
Tsuyoshi Nagashima (Miraial)
Tsutomu Okabe (TDK)
Technical Architect
Takao Nojima(Intel)
<Month> <Year>
<Region> <Committee>

4. Current Japan PI&C Committee Structure
Physical Interfaces & Carriers Committee
C: Shoji Komatsu / Acteon
C: Tsuyoshi Nagashima / Miraial
C: Tsutomu Okabe / TDK
TA: Takao Nojima / Intel
Global PI&C Standards
Maintenance TF
JA: Shoji Komatsu / Acteon NA: John Davies / TD Systems
Int’l PI&C 450mm TF
JA: Shoji Komatsu / Acteon
NA: Mutaz Haddadin/Intel
Int’l 450mm Shipping Box TF
(under Japan Si Wafer Committee)
Yasuhiro Shimizu/ Consultant
Shoji Komatsu / Acteon
<Month> <Year>
<Region> <Committee>

5. <Region> <Committee>
Meeting Information
Last meeting
December 3th, 2010
SEMICON Japan, Makuhari Messe, Chiba
Next meeting
April 8th, 2011
SEMI Japan Tokyo Office
The meeting date is subject to change due to consequences of the earthquake in Japan.
<Month> <Year>
<Region> <Committee>

6. Recently Published Documents
None
<Month> <Year>
<Region> <Committee>

7. Ballot Results/ Upcoming Ballot
Doc.5108, NEW AUXILIARY INFORMATION: Overview Guide to SEMI Standard for 450mm Wafers
Was developed by the 450mm IPIC Task Force
Will be adjudicated at the next Japan PI&C Committee
<Month> <Year>
<Region> <Committee>

8. <Region> <Committee>
New TFOF/SNARF
None
<Month> <Year>
<Region> <Committee>

9. <Region> <Committee>
450mm IPIC Task Force
Shoji Komatsu (Acteon)
Current activity
Wafer plane measurement method
450 standards map AUX
Doc.5108, NEW AUXILIARY INFORMATION: Overview Guide to SEMI Standard for 450mm Wafers
Will be adjudicated at the next Japan PI&C Committee
Wafer set-down volume and wafer extraction volume
Hold down feature applies to all carriers
<Month> <Year>
<Region> <Committee>

10. Global PIC Standards Maintenance Task Force
Shoji Komatsu (Acteon)
Current activity
The Task Force did not meet.
<Month> <Year>
<Region> <Committee>

11. The 2nd STEP/450 held on Dec. 3rd SEMICON Japan 2010
Agenda
Opening Remarks
Shoji Komatsu, Acteon Corporation
ISMI 450mm Semiconductor Manufacturing Transition
Eddy Bass, ISMI
Overall concepts of 450mmSEMI Standards
Explanations for 450mm Wafer (M74, M76)
Masaharu Watanabe, NuFlare Technology, Inc.
Explanations for 450mm FOUP (E158)
Akira Kashimoto, Shin-Etsu Polymer Co., Ltd.
Explanations for 450mm FOUP/ FOSB Load Port
Tsutomu Okabe, TDK Corporation
Explanations for 450mm Stocker I/F (E156)
Kenji Yamagata, DAIFUKU CO., LTD.
Explanations for MAC and Developmental status of 450mm FOSB
Yasuhiro Shimizu, Consultant
Closing Remarks
The 2nd STEP/450 was attended with over 50 concurrent attendees.
(The 1st STEP/450 held on 16th September 2010 was attended with over 70 attendees. )
<Month> <Year>
<Region> <Committee>

12. Regional Staff Contact Information
Name
Hiro’fumi Kanno
Phone
Office Address
Kudan-minami, Chiyoda-ku, Tokyo Japan
Committees
In charge
Japan PIC Committee
<Month> <Year>
<Region> <Committee>