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ITRS Spring Conference 2007 Annecy France 1 2008 International Technology Roadmap for Semiconductors Radio Frequency and Analog/Mixed-Signal Technologies.

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Presentation on theme: "ITRS Spring Conference 2007 Annecy France 1 2008 International Technology Roadmap for Semiconductors Radio Frequency and Analog/Mixed-Signal Technologies."— Presentation transcript:

1 ITRS Spring Conference 2007 Annecy France International Technology Roadmap for Semiconductors Radio Frequency and Analog/Mixed-Signal Technologies for Wireless Communications Working Group April Koenigswinter, Germany

2 ITRS Spring Conference 2007 Annecy France Update Plan In discussion –Some roadmap reflect prototype capable device, not all in production, lack of application drivers –Generate matrix of applications vs technologies, including emerging applications (like medical and security etc) CMOS –Performance Analog CMOS continue linkage to LSTP CMOS with 1 year lag –mmWave CMOS continue linkage to HP CMOS, may increase lag (current 2 yr) –Consider dropping partial nodes for RF? –Review 1/f noise, fmax and matching requirements with publsihed data, in particular as device move to HighK/Metal gate and double gate –XTWG with ERD Wireless provide target key RF parameters (device and block level). ERD benchmark current published RF performance. –XTWG with PIDS –I/O device offering options for planar SOI and FinFETs

3 ITRS Spring Conference 2007 Annecy France 3 Bipolar –Delay in Ft/Fmax and modify Ft/Fmax ratio in high speed NPN roadmap. –Synchronize HV NPN Ft/Fmax with HF device and review BVCEO. –Update PA NPN parameter to reflect today performance. Power Amplifier –Handset : HBT & FET, III-V and Si Increase "foundry" PA participation. Update end of life battery parameter. Consider adding semiconductor switch in 2009 roadmap. RFMEMS –Expand membership. –Stay with device choice (1) BAW, (2) Resonator, (3) switch - capacitive contact, and (4) switch - metal contact. –Include more specific requirement parameters for switch and BAW. –Prepare specific design tools requirements for XTWG discussion with Design. –XTWG with Assy&Pkg & test Provide MEMS package issues, required physical dimension and list of components in SiP module. In-line test for MEMS package (Qual package only, no inline test needed?) 2008 Update Plan


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