1 ECE 551: Digital System Design & Synthesis Spring 2003 Lecture Materials Prepared by: Charles Kime, Kewal Saluja and Michael Schulte.

Slides:



Advertisements
Similar presentations
FPGA (Field Programmable Gate Array)
Advertisements

TOPIC : SYNTHESIS DESIGN FLOW Module 4.3 Verilog Synthesis.
Sistemas Digitais I LESI - 2º ano Lesson 1 - Introduction U NIVERSIDADE DO M INHO E SCOLA DE E NGENHARIA Prof. João Miguel Fernandes
Introduction to Programmable Logic John Coughlan RAL Technology Department Electronics Division.
ECOE 560 Design Methodologies and Tools for Software/Hardware Systems Spring 2004 Serdar Taşıran.
Introduction to Digital Electronics. Suplementary Reading Digital Design by - John F. Wakerly – - you will find some solutions at this site.
EELE 367 – Logic Design Module 2 – Modern Digital Design Flow Agenda 1.History of Digital Design Approach 2.HDLs 3.Design Abstraction 4.Modern Design Steps.
Ch.3 Overview of Standard Cell Design
Programmable Logic Devices
Graduate Computer Architecture I Lecture 15: Intro to Reconfigurable Devices.
CMPT150, Ch 3, Tariq Nuruddin, Fall 06, SFU 1 Ch3. Combinatorial Logic Design Modern digital design involves a number of techniques and tools essential.
Copyright 2001, Agrawal & BushnellDay-1 PM Lecture 4a1 Design for Testability Theory and Practice Lecture 4a: Simulation n What is simulation? n Design.
Combinational Circuits
FPGA chips and DSP Algorithms By Emily Fabes. 2 Agenda FPGA Background Reasons to use FPGA’s Advantages and disadvantages of using FPGA’s Sample VHDL.
Spring 08, Jan 15 ELEC 7770: Advanced VLSI Design (Agrawal) 1 ELEC 7770 Advanced VLSI Design Spring 2007 Introduction Vishwani D. Agrawal James J. Danaher.
Spring 07, Jan 16 ELEC 7770: Advanced VLSI Design (Agrawal) 1 ELEC 7770 Advanced VLSI Design Spring 2007 Introduction Vishwani D. Agrawal James J. Danaher.
Digital Design: Chapters Chapter 1. Introduction Digital Design - Logic Design? Analog versus Digital Once-analog now goes digital –Still pictures.
Computer Engineering 222. VLSI Digital System Design Introduction.
February 4, 2002 John Wawrzynek
ECE 551 Digital Design And Synthesis Spring 2006 Course Introduction Review.
ECE Lecture 1 1 ECE 3561 Advanced Digital Design Department of Electrical and Computer Engineering The Ohio State University.
ELEN468 Lecture 11 ELEN468 Advanced Logic Design Lecture 1Introduction.
VLSI Lab References I am grateful for the contributions from SEMATECH, the Austin Community College, and MKS Instruments. For further reading, I especially.
(1) Introduction © Sudhakar Yalamanchili, Georgia Institute of Technology, 2006.
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John Sebastian Smith, Addison Wesley, 1997 Chapter 1 Introduction.
Introduction to Digital Design
Charles Kime & Thomas Kaminski © 2004 Pearson Education, Inc. Terms of Use (Hyperlinks are active in View Show mode) Terms of Use Lecture 12 – Design Procedure.
Chap. 1 Overview of Digital Design with Verilog. 2 Overview of Digital Design with Verilog HDL Evolution of computer aided digital circuit design Emergence.
CAD for Physical Design of VLSI Circuits
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John Sebastian Smith, Addison Wesley, 1997 Chapter 4 Programmable.
ASIC/FPGA design flow. FPGA Design Flow Detailed (RTL) Design Detailed (RTL) Design Ideas (Specifications) Design Ideas (Specifications) Device Programming.
ECE Advanced Digital Systems Design Lecture 12 – Timing Analysis Capt Michael Tanner Room 2F46A HQ U.S. Air Force Academy I n t e g r i.
CSE 494: Electronic Design Automation Lecture 2 VLSI Design, Physical Design Automation, Design Styles.
Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.
J. Christiansen, CERN - EP/MIC
Flip-Flops and Registers
COE 405 Design and Modeling of Digital Systems
1/8/ L20 Project Step 8 - Data Path Copyright Joanne DeGroat, ECE, OSU1 State Machine Design with an HDL A methodology that works for documenting.
Field Programmable Gate Arrays (FPGAs) An Enabling Technology.
EE 466/586 VLSI Design Partha Pande School of EECS Washington State University
Fall 2004EE 3563 Digital Systems Design EE 3563 VHSIC Hardware Description Language  Required Reading: –These Slides –VHDL Tutorial  Very High Speed.
ECE 551 Fall /6/2001 ECE Digital System Design & Synthesis Lecture 2 - Pragmatic Design Issues Overview  Classification of Issues oThree-State.
Spring 2007 W. Rhett Davis with minor editing by J. Dean Brock UNCA ECE Slide 1 ECE 406 – Design of Complex Digital Systems Lecture 1: Introduction.
Anurag Dwivedi. Basic Block - Gates Gates -> Flip Flops.
An Overview of Hardware Design Methodology Ian Mitchelle De Vera.
IMPLEMENTATION OF MIPS 64 WITH VERILOG HARDWARE DESIGN LANGUAGE BY PRAMOD MENON CET520 S’03.
1 Copyright  2001 Pao-Ann Hsiung SW HW Module Outline l Introduction l Unified HW/SW Representations l HW/SW Partitioning Techniques l Integrated HW/SW.
EE 5900 Advanced Algorithms for Robust VLSI CAD, Spring 2009 Combinational Circuits.
Introduction to ASIC flow and Verilog HDL
04/26/20031 ECE 551: Digital System Design & Synthesis Lecture Set : Introduction to VHDL 12.2: VHDL versus Verilog (Separate File)
Greg Alkire/Brian Smith 197 MAPLD An Ultra Low Power Reconfigurable Task Processor for Space Brian Smith, Greg Alkire – PicoDyne Inc. Wes Powell.
ECE 551: Digital System Design & Synthesis Motivation and Introduction Lectures Set 1 (3 Lectures)
Introduction to Field Programmable Gate Arrays Lecture 1/3 CERN Accelerator School on Digital Signal Processing Sigtuna, Sweden, 31 May – 9 June 2007 Javier.
03/31/031 ECE 551: Digital System Design & Synthesis Lecture Set 8 8.1: Miscellaneous Synthesis (In separate file) 8.2: Sequential Synthesis.
Teaching Digital Logic courses with Altera Technology
9/4/2001 ECE 551 Fall ECE Digital System Design & Synthesis Lecture 1 - Introduction  Overview oCourse Introduction oOverview of Contemporary.
EECE 320 L8: Combinational Logic design Principles 1Chehab, AUB, 2003 EECE 320 Digital Systems Design Lecture 8: Combinational Logic Design Principles.
Introduction to ASICs ASIC - Application Specific Integrated Circuit
Programmable Logic Devices
ASIC Design Methodology
Introduction to Programmable Logic
ECNG 1014: Digital Electronics Lecture 1: Course Overview
VHDL Introduction.
HIGH LEVEL SYNTHESIS.
Combinational Circuits
THE ECE 554 XILINX DESIGN PROCESS
數位IC設計 Pei-Yin Chen, 陳培殷.
H a r d w a r e M o d e l i n g O v e r v i e w
Combinational Circuits
THE ECE 554 XILINX DESIGN PROCESS
Presentation transcript:

1 ECE 551: Digital System Design & Synthesis Spring 2003 Lecture Materials Prepared by: Charles Kime, Kewal Saluja and Michael Schulte

1/16/2003 ECE 551 Spring ECE 551: Digital System Design & Synthesis  Lecture Set 1: oIntroduction oOverview of Contemporary Digital Design oPragmatics 1

1/16/2003 ECE 551 Spring ECE Digital System Design & Synthesis Lecture Introduction  Overview oCourse Purpose oCourse Topics oCourse Tools oCourse Info

1/16/2003 ECE 551 Spring Course Purpose  To provide knowledge and experience in performing contemporary logic design based on oHardware description languages (HDLs) oHDL simulation oAutomated logic synthesis oTiming analysis  With consideration for oPractical design and test issues oChip layout issues oDesign reuse for system-on-a-chip (SoC)

1/16/2003 ECE 551 Spring Course Topics  Pragmatics of Digital Design  Hardware Modeling with the Verilog HDL  Event-Driven Simulation and Testbenches  Verilog Language Constructs and Delay  Behavioral Descriptions in Verilog  An Overview of VHDL  Logic Synthesis and Timing  Physical Design and Design Reuse

1/16/2003 ECE 551 Spring Course Tools  Modelsim HDL Simulation Tools (Mentor)  Design Analyzer Synthesis Tools (Synopsys)  G11 Technology Library (LSI Logic)

1/16/2003 ECE 551 Spring Course Information  Course Conduct Course Conduct  Standard Reference Standard Reference  The above plus all other course material can be found at et/ece/551/kime/ et/ece/551/kime/  Be familiar with all!

1/16/2003 ECE 551 Spring Lecture 1.2 – Contemporary Digital Design  Overview oLayout Lite oApplication Specific Integrated Circuit (ASIC) Technologies oIC Costs oASIC Design Flows  The Role of HDLs and Synthesis  The Role of IP Cores and Reuse  The Role of Physical Design oSummary

1/16/2003 ECE 551 Spring Layout Lite - 1  IC are produced from masks that correspond to geometric layouts produced by the designer or by EDA tools.  In CMOS, a typical IC cross-section: Substrate Oxide Transistor Metal 3 Metal 2 Metal 1 Polysilicon Diffusion Channel

1/16/2003 ECE 551 Spring Layout Lite - 2  The layout corresponding to the cross-section: oThe transistor is outlined in broad yellow lines. oEverything else is interconnect. Channel Transistor

1/16/2003 ECE 551 Spring IC Implementation Technologies STANDARD IC FULL CUSTOM SEMI - CUSTOM FIELD PROGRAMMABLE STANDARD CELL GATE ARRAY, SEA OF GATES ASICFPGAPLD

1/16/2003 ECE 551 Spring Distinguishing Features of IC Technologies - 1  Implementation technologies are distinguished by: oThe levels of the layout 1) transistors and 2) interconnect that are:  Common to distinct IC designs (L1)  Different for distinct IC designs (L2) oThe use of predesigned layout cells  Predesigned cells are used (P1)  Predesigned cells are not used (P2)

1/16/2003 ECE 551 Spring Distinguishing Features of IC Technologies - 2  Implementation technologies are distinguished by: oMechanism used for instantiating distinct IC designs:  Metallization (M)  Fuses or Antifuses (F)  Stored Charge (C)  Static Storage (R)

1/16/2003 ECE 551 Spring Technologies in Terms of Distinguishing Features - 1  Full Custom – P2, M oTransistors – L2, Interconnects – L2  Standard Cell – P1, M oTransistors – L2, Interconnects – L2  Gate Array, Sea of Gates – P1, M oTransistors – L1, Interconnects – L2

1/16/2003 ECE 551 Spring Technologies in Terms of Distinguishing Features - 2  FPGA – P1, F or R oTransistors – L1, Interconnects – L1  PLD – P1, F or C oTransistors – L1, Interconnects – L1

1/16/2003 ECE 551 Spring Technologies in Terms of Shared Fabrication Steps  Custom Fabricated Layers oFull Custom and Standard Cells – all layers are custom fabricated oGate Arrays and Sea of Gates – only interconnect (metallization) layers custom fabricated oFPGAs and PLDs – nothing is custom fabricated  Consequences due to economy-of-scale: oFab costs reduced for Gate Arrays and Sea of Gates oFab costs further reduced for FPGAs and PLDs

1/16/2003 ECE 551 Spring Layout Styles - 1  Technologies in terms of layout styles: Adjustable Spacing Megacells Standard Cell Gate Array - Channeled … … Fixed Spacing Base Cell

1/16/2003 ECE 551 Spring Layout Styles - 2  Technologies in terms of layout styles: … Base Cell Gate Array - Channel-less (Sea of Gates) Gate Array - Structured … … Fixed Embedded Block

1/16/2003 ECE 551 Spring IC Costs - 1  An example: 10,000 gate circuit [1] oFixed costs  Standard Cell - $146,000  Gate Array - $86,000  FPGA - $21,800 oVariable costs  Standard Cell - $8 per IC  Gate Array - $10 per IC  FPGA - $39 per IC

1/16/2003 ECE 551 Spring IC Costs - 2  An example: 10,000 gate circuit

1/16/2003 ECE 551 Spring IC Costs – 3  Why isn’t FPGA cheaper per unit due to economy-of-scale? oThe chip area required by each of the successive technologies from Full Custom to FPGAs increases for a fixed-sized design. oThe larger the chip area, the poorer the yield of working chips during fabrication oAlso, due to increased sales, FPGA prices have declined since the mid-90’s much faster than the other technologies.

1/16/2003 ECE 551 Spring Draw Datapath Schematics * ASIC Design Flow - Traditional Write Specifications Define System Architecture Partition - Data- path &Control Define State Diag/Tables Draw Control Schematics * Integrate Design* Do Physical Design* Implement* * Steps followed by validation and refinement

1/16/2003 ECE 551 Spring Traditional Flow Problems  Schematic Diagrams oLimited descriptive power  State Diagrams and Algorithmic State Machines oLimited portability oLimited complexity oDifficult to describe parallelism oLimited complexity  Time-Intensive and Hard to Update

1/16/2003 ECE 551 Spring How about HDLs Instead of Diagrams? - 1  Hardware description languages (HDLs) oComputer-based programming languages oModel and simulate the functional behavior and timing of digital hardware oSynthesizable into a technology-specific netlist  Two main HDLs used by industry oVerilog HDL (C-based, industry-driven) oVHSIC HDL or VHDL (Ada-based, defense/industry/university-driven).

1/16/2003 ECE 551 Spring How about HDLs Instead of Diagrams? - 2  Advantages of HDLs oHighly portable (text) oDescribes multiple levels of abstraction oRepresents parallelism oProvides many descriptive styles  Structural  Register Transfer Level (RTL)  Behavioral oServe as input for synthesis

1/16/2003 ECE 551 Spring How about Synthesis instead of Manual Design?  Increased design efficiency  Reduces verification/validation problem  Ability to explore more of overall design space  Are there disadvantages?  Potential for better optimization

1/16/2003 ECE 551 Spring HDL/Synthesis Design Flow - 1 Pre-Synthesis Sign-Off Verification: Functional Design Specification Design Partition Design Entry: HDL Behavioral Integration To next page Verification: Functional Synthesis and Technology Map

1/16/2003 ECE 551 Spring HDL/Synthesis Design Flow - 2 Extract Parasitics Test Generation & Fault Simulation Verification: Post-Synthesis Timing Verification: Post-Synthesis Physical Design From prior page Verification: Physical & Electrical Design Sign-Off

1/16/2003 ECE 551 Spring An Example from Industry  A G3 wireless processor was designed using the following methodology: oEntire processor modeled and tested using VHDL and C-based test programs oProcessor functionality verified by synthesizing to an FPGA and running 3G wireless applications at 25 MHz oProcessor timing and design feasibility verified by synthesizing to a standard cell library and running applications at 500 MHz. oFinal version of processor implemented using a mix of standard cell and custom logic to achieve low- power and 800 MHz clock speed.

1/16/2003 ECE 551 Spring Newer Technologies and Design Flows - SOC  System-on-a-Chip (SoC) oDesigners use (Intellectual Property – IP) cores  RISC Core, DSP, Microcontroller, Memory  The main function is to glue many cores and generate/design only those components for which cores and designs may not be available  Used in ASIC as well as custom design environment  The issues relevant to this will be discussed near the end of the course

1/16/2003 ECE 551 Spring Synthesis and Technology Map Contemporary Design Flow - 1 Pre-Synthesis Sign-Off Design Specification Design Partition Verification: Functional To HDL/Synth Design Flow -2 Integration & Verification: Functional Select IP Cores Design Entry: HDL Behavioral Preliminary Phys. Design

1/16/2003 ECE 551 Spring Lecture 1.2 Summary  Application Specific Integrated Circuit (ASIC) Technologies oProvides a basis for what we will design  IC Costs oGives a basis for technology selection  ASIC Design Flows oShows the role of HDLs and synthesis oProvides a structure for  what we will learn  What we will do

1/16/2003 ECE 551 Spring References 1) Smith, Michael J. S., Application-Specific Integrated Circuits, Addison-Wesley, 1997.

1/16/2003 ECE 551 Spring Lecture 1.3 Pragmatics 1  Pragmatics refers to practical design choices and techniques  Topics oCell Libraries oAsynchronous Circuits oThree-State Logic and Hi-Z State

1/16/2003 ECE 551 Spring Cells and Cell Libraries  What is a cell?  What is a cell library?  What appears in the cell library for each ASIC cell?

1/16/2003 ECE 551 Spring What is a Cell?  Cells are the building blocks for digital designs  Come in different sizes, shapes and functions varying from transistors to large memory arrays or even a processor  Typically cells: oSmall Scale: AND, OR, NAND, NOR, NOT, AOI, OAI, Flip-Flops, Latches oMedium Scale: Multiplexers, Decoders, Adders oLarge Scale: Memories, Processors  Provided by ASIC vendors

1/16/2003 ECE 551 Spring What is a Cell Library?  A database specifying and describing the target technology in the form of pre- designed objects called cells. Synthesis target technology.  In-Class Discussion: What are typical components in the database for each cell?

1/16/2003 ECE 551 Spring Asynchronous Techniques  Delay-dependent design  Combinational hazards  Combinational hazard prevention  Asynchronous design

1/16/2003 ECE 551 Spring Delay-Dependent Design 1 LA PA A A LA PA Example: Level-to-Pulse Converter(Delay-Based)

1/16/2003 ECE 551 Spring Delay-Dependent Design 2  Sometimes useful  But should be avoided  Time delays vary and so may: oFail oProduce variable results, e. g. pulse length

1/16/2003 ECE 551 Spring Delay-Dependent Design 3 LA PA D QC Clock  Level on LA must be longer than a clock period and must not rise close to the positive clock edge. Ideally, synchronous with Clock.  Level to Pulse Converter (Synchronous)

1/16/2003 ECE 551 Spring Combinational Hazards 1  Example - Hazard in a Multiplexer A C F B 1 1 B F

1/16/2003 ECE 551 Spring Combinational Hazards - 2  A circuit has a hazard if there exists an assignment of delays such that an unwanted signal transition (glitch), can occur.  Types of changes on combinational circuit inputs : oSingle-input change (SIC) oMultiple-input change (MIC)  A SIC static hazard exists on a circuit output if in response to a SIC, the output momentarily changes to the opposite value. oStatic 1-hazard – output value to remain at 1 oStatic 0-hazard – output value to remain at 0

1/16/2003 ECE 551 Spring Combinational Hazards - 3  Classification of Combinational Hazards oStatic – SIC/MIC – output changes when it should remain fixed - output value within the “transition region of input changes is fixed. oDynamic – SIC/MIC – output changes three or more times when it should change only once. oEssential – MIC – output changes when it should remain fixed – output value within the “transition region” of input changes not fixed.

1/16/2003 ECE 551 Spring Combination Hazards - 4  In-class Example: Illustration of static, dynamic and essential hazards

1/16/2003 ECE 551 Spring Combinational Hazards - 5  Consequences of Hazards oSignals with hazards within or entering asynchronous circuits (note that a flip-flop is an asynchronous circuit with respect to its clock signal!) oCause incorrect state behavior  Extra state changes  Incorrect state changes  In-Class Example: Prevention of Hazards oRedundant Logic oDelay Dependence

1/16/2003 ECE 551 Spring Asynchronous Design - 1  Which of the following sequential circuits involve asynchronous design? oA circuit that has no global clock signal involved in its operation – state changes occur in response to input changes only. oA D flip-flop circuit oA circuit using clock gating on flip-flop clock inputs oA circuit with a clock which uses the clear and preset inputs on the flip-flops for other than initialization.

1/16/2003 ECE 551 Spring Asynchronous Design - 2  Because of the difficulty of eliminating hazards, it is very difficult to insure correct operation under all timing possibilities  Design must be done manually or by use of very specialized synthesis tools.  Therefore, avoid it if you can!  If you truly need it, investigate some of the more contemporary approaches[1] which avoid some of the many difficulties.

1/16/2003 ECE 551 Spring Three-State and Other Hi-Z States  Three-state conflicts  Floating three-state nets and inputs  Pull-ups and Pull-downs  Bus keepers

1/16/2003 ECE 551 Spring Three-State Conflicts - 1  What are they and what are their effects? oStatic – Chip damage or static power consumption oDynamic – Dynamic or static power consumption D0 D1 E0 E1 OUT E0 E1 E0 E

1/16/2003 ECE 551 Spring Three-State Conflicts - 2  How can conflicts be avoided? oStatic – Decoded enable signals oDynamic – Delay control D0 D1 E0 E1 OUT E0 E1 E0 E

1/16/2003 ECE 551 Spring Floating Inputs and Three- State Nets - 1  Floating input values on gates can cause: ostatic power dissipation ohigh-frequency switching that induces power supply noise  Floating input values arise from: oGate inputs, e. g., for example on exterior of IC, that are not connected oLines driven by 3-state buffer or gate outputs, all of which are in the Hi-Z state.

1/16/2003 ECE 551 Spring Floating Inputs and Three- State Nets – 2  How can floating inputs and nets be avoided? oUse a pull-up or pull-down resistor or transistor with a fixed gate voltage value.  Advantage – simple  Disadvantages – static power dissipation and loading of node oOn internal lines, particularly buses, use a bus keeper (weak buffer)

1/16/2003 ECE 551 Spring Non-D flip-flops  D Flip-Flops oUnique characteristic – the typical master-slave DFF is also functionally an edge-triggered DFF.  Non- D Flip-Flops (JK, T, etc.) oIn the cell libraries, these flip-flop may be full-custom designs or may simply consist of a DFF with added logic. oIf it is just a DFF with added logic, you might as well design for a DFF to give the logic optimization software more flexibility.

1/16/2003 ECE 551 Spring References [1] Chris J. Myers, Asynchronous Circuit Design, John Wiley & Sons, Inc., New York, 2001.