Dry Etch and Thin films & Process Integration April 28th, 2015 NNfC monthly admin committee meeting.

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Presentation transcript:

Dry Etch and Thin films & Process Integration April 28th, 2015 NNfC monthly admin committee meeting

Tool status Update April 2015 RIE -Cl The system is up and running after replacing the 5V power supply and AMU stepper motors. Root cause: The 5V power supply was damaged by arcs and sparks in RF box which was caused by faulty thermocouple. The faulty 5V power supply degraded the AMU stepper motors with voltage drop, misled the auto matching unit and finally the stepper motors were completely dead on Jan 30 th Discussion with Oxford on 28 th April, to optimise cleaning recipes and housekeeping to address GaN process drift/ Preventive maintenance for tool. RIE-F No issues Tool back up(RIE-Cl) configuration discussion ongoing. PECVD Working on SiO2 and Si3N4 recipes with low precursor gas flow rates, lower N2O consumption. Optimise the wet etch rate for oxide and nitride films, optimise clean recipe, initiate discussion with Oxford Team.

Tool status Update April 2015 DRIE System is optimized and released to users for high coil power(4500 W) also. Planning the AMC for DRIE in June once we received the new HF-RF generator. RF-Sputter TechPort No issues. Working on AMC E-Beam evaporator Working on AMC 20% Reduction in “gold” consumption by changing from rotating platen to fixed platen. Working on additional 20% “gold”consumption by reducing the distance between crucible and substrate holder. 50% discount for “gold”users in place.