NanoFab Simulator Update Nick Reeder, May 31, 2012.

Slides:

Advertisements

Similar presentations

NanoFab Trainer Update Nick Reeder, January 18, 2013.

Advertisements

FABRICATION PROCESSES

Process Flow : Overhead and Cross Section Views ( Diagrams courtesy of Mr. Bryant Colwill ) Grey=Si, Blue=Silicon Dioxide, Red=Photoresist, Purple= Phosphorus.

Adhesive bonding Ville Liimatainen Contents Introduction – Adhesive bonding – Process overview – Main features Polymer adhesives Adhesive.

Advanced Manufacturing Choices

Photoresist Characterization Spin Speed vs. Thickness Nate Hamm, Steve Kelly, Brian MacFarland, John Yarbrough, Jeff Flint.

PowerPoint Tutorial 2 Adding Media and Special Effects

Tutorial 3 Derek Wright Wednesday, February 2 nd, 2005.

1 After completing this lesson, you will be able to: Add a header and footer to a worksheet. Change margins and center a worksheet. Change the orientation.

This tutorial is a PowerPoint ® file which includes recorded narration. Automatic slide sequencing is coupled to the sound track. For the most effective.

Chris A. Mack, Fundamental Principles of Optical Lithography, (c) Figure 5.1 Resist parameters A and B as a function of wavelength measured with.

Overview of Nanofabrication Techniques Experimental Methods Club Monday, July 7, 2014 Evan Miyazono.

Fabrication of p-n junction in Si Silicon wafer [1-0-0] Type: N Dopant: P Resistivity: Ω-cm Thickness: µm.

Macros Tutorial Week 20. Objectives By the end of this tutorial you should understand how to: Create macros Assign macros to events Associate macros with.

The Deposition Process

NanoFab Trainer Update Nick Reeder, April 11, 2014.

NanoFab Trainer Update Nick Reeder, March 14, 2014.

Rochester Institute of Technology - MicroE © REP/LFF 8/17/2015 Metal Gate PMOS Process EMCR201 PMOS page-1  10 Micrometer Design Rules  4 Design Layers.

Lecture 4 Photolithography.

NanoFab Simulator Update Nick Reeder, April 20, 2012.

Micro-fabrication.

CS/EE 6710 CMOS Processing. N-type Transistor + - i electrons Vds +Vgs S G D.

Fabrication of Active Matrix (STEM) Detectors

NanoFab Trainer Update Nick Reeder, April 5, 2013.

Chris A. Mack, Fundamental Principles of Optical Lithography, (c) Figure 1.1 Diagram of a simple subtractive patterning process.

User Experience with iPads/Mobile Devices and VitalSource eBooks NOTE: all screenshots in this presentation were taken on an iPad 2.

VisiMix Pipe Line VisiMix Ltd, PO Box 45170, Jerusalem, 91450, Israel Tel: Fax:

Nano/Micro Electro-Mechanical Systems (N/MEMS) Osama O. Awadelkarim Jefferson Science Fellow and Science Advisor U. S. Department of State & Professor.

I.C. Technology Processing Course Trinity College Dublin.

II-Lithography Fall 2013 Prof. Marc Madou MSTB 120

ECE484: Digital VLSI Design Fall 2010 Lecture: IC Manufacturing

SEMINAR PRESENTATION ON IC FABRICATION PROCESS

Virtual NanoFab A Silicon NanoFabrication Trainer

NanoFab Simulator Layout Nick Reeder, Dec 16, 2011.

Introduction to Wafer fabrication Process

Top Down Manufacturing

PTC Proposal Seongjin Jang September 09, Submit Application To PTC All the users should submit their process-related information to Process Technology.

NanoFab Trainer Nick Reeder June 28, 2012.

Introduction EE1411 Manufacturing Process. EE1412 What is a Semiconductor? Low resistivity => “conductor” High resistivity => “insulator” Intermediate.

Spencer/Ghausi, Introduction to Electronic Circuit Design, 1e, ©2003, Pearson Education, Inc. Chapter 3, slide 1 Introduction to Electronic Circuit Design.

NanoFab Trainer Update Nick Reeder, February 28, 2014.

IC Processing. Initial Steps: Forming an active region Si 3 N 4 is etched away using an F-plasma: Si3dN4 + 12F → 3SiF 4 + 2N 2 Or removed in hot.

NanoFab Simulator Update Nick Reeder, May 17, 2012.

NanoFab Trainer Update Nick Reeder, March 1, 2013.

XP Tutorial 8 New Perspectives on Microsoft Windows XP 1 Microsoft Windows XP Object Linking and Embedding Tutorial 8.

Introducing Dreamweaver. Dreamweaver The web development application used to create web pages Part of the Adobe creative suite.

1 12&13/05/2005 Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL LTM contribution to SP3-WP6 Two tasks: 1.Thermal characterization of ultra thin.

NanoFab Trainer Update Nick Reeder, April 25, 2014.

UFCFY5-30-1Multimedia Studio Scripting for Interactive Media Times Table Quiz This will contribute towards your online portfolio for this module.

XP New Perspectives on Microsoft Office Access 2003, Second Edition- Tutorial 6 1 Microsoft Office Access 2003 Tutorial 6 – Creating Custom Forms.

Fab - Step 1 Take SOI Wafer Top view Side view Si substrate SiO2 – 2 um Si confidential.

Side ViewTop View Beginning from a silicon wafer.

Sputtering. Why? Thin layer deposition How? Bombarding a surface with ions which knocks out molecules from a target which in turn will redeposit onto.

How To Create A Digital Story Using Windows Live Movie Maker.

MOSCAP Characterization of SNF ALD

Lecture 2 State-of-the art of CMOS Technology

Process integration 2: double sided processing, design rules, measurements

Wisconsin Center for Applied Microelectronics

Microsoft PowerPoint Illustrated

Lecture 4 Fundamentals of Multiscale Fabrication

1) Wafer Cleaning Oxidizing – Field Oxide

NanoFab Simulator Update

VLSI System Design LEC3.1 CMOS FABRICATION REVIEW

Silicon Wafer cm (5’’- 8’’) mm

LITHOGRAPHY Lithography is the process of imprinting a geometric pattern from a mask onto a thin layer of material called a resist which is a radiation.

NanoFab Trainer Update

MACROS MUST BE ENABLED FOR THIS FILE TO WORK

Photolithography.

1) Wafer Cleaning Oxidizing – Field Oxide (~130 nm)

Presentation transcript:

NanoFab Simulator Update Nick Reeder, May 31, 2012

Update to Scales Changed vertical and horizontal scales on display, and added menu option to make scales equal or not. – Question: Vertical scale’s max value is 2  m, but most of our photoresists spin to coats thicker than 2  m. Should we eliminate all but the thinnest viscosities?

Updates to Dialog Boxes User now specifies: – Power, pressure, and time for Sputter. – Voltage, current, and time for Evaporate. – Pressure, temperature, and time for CVD. Need look-up tables to interpolate deposition rates based on user-supplied parameters. (Currently rate = 0.1  m/sec for all of these processes.) Question: – For each of the above, what limits should we impose on the values that the user can enter?

Updates to Plasma Etch Code User now specifies power and pressure (as well as time), and the code adjusts etch rate accordingly. Questions: – What limits should we impose on the power and pressure values that the user can enter? – On next slide, do curves for etch-scale-factor versus pressure look right?

Etch Scale Factor vs Pressure

Related Questions – For spin coat, what are reasonable max/min values for rpm? – For implant, max/min values for dose and ion energy? – For bake, max/min values for temperature?

New Code: Bake Began coding Bake model based on Need values of S 0 and  for our photoresists.

To-Do List Fix spin-coat code so that resist does not adhere to underside of horizontal surfaces. Implement look-up tables to compute deposition rates for evaporate, CVD, and sputter based on user-supplied parameters. Fix oxidize, develop, polish dialog boxes to ask user for correct parameters, and write code to compute depth from these values. Continue writing bake code; need values for S 0 and . In expose code, implement diffraction of UV in air and absorption within resist, with dependence on solvent content from bake code. Fix etch code so that (for photoresist) etch rates depend on solvent content from bake code. Write new code for – Lift-off – Clean – Profilometer Write time-cost-quality code for all operations. Write online help text. Produce videos, photos, text for Tutorial tab.

ActivityNot startedPartialComplete Simulation coding CleanX Spin coatX BakeX Mask/Expose/DevelopX EvaporateX Thermal oxidationX CVDX SputterX Wet etchX Plasma etchX Lift offX PolishX ImplantX Track time, cost, quality of each processX User -interface coding History with option to revertX Save/open history filesX Edit colorsX User-defined materialsX ProfilometerX Producing embedded media (videos, photos, etc.)X TestingX DocumentationX