First UCSB TEC Module (Pictures)

First UCSB TEC Module (Bias Ring) Due to angle and height differences, it is difficult to bond the bias return between PA and sensor. Nearby channel #512 bond limits bonding space

First UCSB TEC Module (Noise) Faults Two sensor opens Channel 27 PH sensor DB Channel 408 PH due to bonding Bonding fixture needs slight fine tuning to hold securely Channel 302 Open APV-PA One Sensor opens Channel 306 Noisy Channels 407,409 Due to PH in bonding Grade B (1.1% bad channels)

First UCSB TEC Module (Charge Injection)

First UCSB TEC Module (IV) Slightly than higher bias current due to pinhole formed during bonding