1. Slide 1US silicon group meeting 5/6/2003 Hybrid Testing Status 10 new hybrids brought by Lenny all tested à 9 tested with no flaws à 1 had 1 chip + 1 wirebond smashed –Looks like smashed by a finger –Probably occurred during taping down for shipping 10 new hybrids just arrived from FNAL à Visually inspected –One foot lift between hybrid-APV (long bond) à Test to keep up with production

2. Slide 2US silicon group meeting 5/6/2003 Ladder Testing Status 8 modules bonded so far à 1 st module had 3 opens between PA-sensor (unbondable) and 2 opens added between sensor-sensor for testing –Removed all bonds from problems found in sensor probing –Two channels found to have high noise which increase with voltage (3.5  5.0 ADC) Damage found on sensor à 2 nd -4 th module had bias return bonds missing –Damage to bulk unrepairable Draw ~80  A, ~600  A, ~800  A –2 opens between APV-PA found in one module, otherwise no other bonding problems –Will turn into x-calibration pieces with shorts and pinholes added on purpose à 5 th and 6 th modules perfect –Three channels have high noise which increases with voltage (1.5  1.9 ADC) and (1.7  9.0 ADC) Damage found on sensor à 7 th module had wirebond damage on ~40 channels between APV and PA –Not clear how or when à 8 th module had no bonding problems –Channels found bad in sensor probing pulled –2 channels has increasing noise vs. voltage (1.5  3.0 ADC) Neighbors of pinhole found in probing

3. Slide 3US silicon group meeting 5/6/2003 High noise channels

4. Slide 4US silicon group meeting 5/6/2003 Ladder Testing Summary LadderBias CurrentSensor Bad Channels Bonding Bad Channels Testing Bad Channels Total % Bad Channels GradeComments 8761090 nA1.5+2311.4%B 2 channels with high noise not in sensor probing 0018-P1 613  A 1.5 Bulk damage 5.51.4%F Missing bias bonds, turn into x- calibration piece 0019-P1 758  A 1.5 Bulk damage 9.52.1%F Missing bias bonds, turn into x- calibration piece 0024-P1 89  A 4.5 Bulk damage+2 1.51.2%F Missing bias bonds, turn into x- calibration piece; 2 opens during APV- PA bonding 877930 nA0 (1??)000.0%A One channel has increasing noise with voltage; sensor damage seen 8781100 nA0 (2??)000.0%A Two channels have increasing noise with voltage; sensor damage seen 879 ~ 40 smashed wirebonds APV- PA, reconverable 880720 nA2(+2??)000.3%A Neighbors of pinhole noisy @ 550 V

5. Slide 5US silicon group meeting 5/6/2003 Summary 4 of 8 bonded modules good à 3 had bias return bonds missing à 1 has ~40 APV-PA bonds smashed –Can be repaired Of 4 good modules à All have channels with increasing noise vs. voltage –2 channels on 1 ladder due to inherit pinhole –5 channels total on 3 ladders due to lithographic errors in sensor production Not seen in wafer probing