Front-End electronics for CALICE Calorimeter review Hamburg

Slides:



Advertisements
Similar presentations
Jeudi 19 février 2009 Status of SPIROC chips Michel Bouchel, Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin-Chassard, Christophe de La.
Advertisements

SKIROC New generation readout chip for ECAL M. Bouchel, J. Fleury, C. de La Taille, G. Martin-Chassard, L. Raux, IN2P3/LAL Orsay J. Lecoq, G. Bohner S.
18/05/2015 Calice meeting Prague Status Report on ADC LPC ILC Group.
Second generation Front-end chip for H-Cal SiPM readout : SPIROC DESY Hamburg – le 13 février 2007 M. Bouchel, F. Dulucq, J. Fleury, C. de La Taille, G.
Integrated electronic for SiPM KOBE – 29 June ‘07 M. Bouchel, F. Dulucq, J. Fleury, C. de La Taille, G. Martin-Chassard, N. Seguin, L. Raux, S. Blin, P.
08/10/2007Julie Prast, LAPP, Annecy1 The DHCAL DIF and the DIF Task Force Julie Prast, LAPP, Annecy.
EUDET FEE status C. de LA TAILLE. EUDET annual meeting 6 oct 08 cdlt : FEE statrus 2 EUDET module FEE : main issues 2 nd generation ASICs –Self triggering.
Front-End electronics for Future Linear Collider calorimeters C. de La Taille IN2P3/LAL Orsay on behalf of the CALICE and EUDET collaborations
Front-End electronics for Future Linear Collider calorimeters C. de La Taille IN2P3/LAL Orsay On behalf of the CALICE collaboration
ASIC development foreseen at IHEP/ORSAY C. de La Taille.
EUDET JRA3 ECAL and FEE C. de La Taille (LAL-Orsay) EUDET status meeting DESY 10 sep 2006.
Organization for Micro-Electronics desiGn and Applications HARDROC 3 for SDHCAL OMEGA microelectronics group Ecole Polytechnique CNRS/IN2P3, Palaiseau.
SPIROC : second generation of Silicon PM Readout ASIC Michel Bouchel, Stéphane Callier, Frédéric Dulucq, Julien Fleury, Jean-Jacques Jaeger, Gisèle Martin-
EUDET JRA3 Front-End electronics in 2007 C. de La Taille IN2P3/LAL Orsay HaRDROCSKIROCSPIROC.
EASIROC, an easy & versatile ReadOut device for SiPM
Vendredi 18 décembre 2015 Status report on SPIROC chips Michel Bouchel, Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin- Chassard, Christophe.
L.Royer– Calice LLR – Feb Laurent Royer, J. Bonnard, S. Manen, P. Gay LPC Clermont-Ferrand R&D pole MicRhAu dedicated to High.
SPIROC update Felix Sefkow Most slides from Ludovic Raux HCAL main meeting April 18, 2007.
Second generation Front-End ASICs for CALICE LCWS07 Hamburg C. de La Taille IN2P3/LAL Orsay On behalf of the CALICE collaboration HaRDROCSKIROCSPIROC.
Front-End electronics for Future Linear Collider calorimeters C. de La Taille IN2P3/LAL Orsay On behalf of the CALICE collaboration
CSNSM SPIROC : Silicon PM Readout ASIC Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin-Chassard, Christophe de La Taille, Ludovic Raux.
14 jan 2010 CALICE/EUDET FEE status C. de LA TAILLE.
HARDROC: Readout Chip for CALICE/EUDET Digital Hadronic calorimeter Nathalie Seguin-Moreau.
HaRDROC performance IN2P3/LAL+IPNL+LLR R. GAGLIONE, I. LAKTINEH, H. MATHEZ IN2P3/IPNL LYON M. BOUCHEL, J. FLEURY, C. de LA TAILLE, G. MARTIN-CHASSARD,
ILC/EUDET developments at LAL Scientific council 23/9/05 B. Bouquet, J. Fleury, C. de La Taille, G. Martin-Chassard LAL Orsay.
12/09/2007Julie Prast, LAPP, Annecy1 The DIF Task Force and a focus on the DHCAL DIF Remi Cornat, Bart Hommels, Mathias Reinecke, Julie Prast.
SKIROC2 Silicon Kalorimeter Integrated Read-Out Chip Stéphane CALLIER, Christophe DE LA TAILLE, Frédéric DULUCQ, Gisèle MARTIN-CHASSARD, Nathalie SEGUIN-MOREAU.
PArISROC Photomultiplier Array Integrated in Sige Read Out Chip Selma Conforti Frédéric Dulucq Christophe de La Taille Gisèle Martin-Chassard Wei
SPIROC : Silicon PM Readout ASIC Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin-Chassard, Christophe de La Taille, Ludovic Raux IN2P3/OMEGA-LAL.
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
1 Second generation Front-end chip for H-Cal SiPM readout : SPIROC Réunion EUDET France – LAL – jeudi 5 avril 2007 M. Bouchel, F. Dulucq, J. Fleury, C.
June 13rd, 2008 HARDROC2. June 13rd, 2008 European DHCAL meeting, NSM 2 HaRDROC1 architecture Variable gain (6bits) current preamps (50ohm input) One.
Front-end Electronic for the CALICE ECAL Physic Prototype Christophe de La Taille Julien Fleury Gisèle Martin-Chassard Front-end Electronic for the CALICE.
CALICE/EUDET FEE status C. de LA TAILLE. 31 aug 2009 EUDET SC meeting Status of JRA3 Front End Electronics 2 ILC front-end ASICs : the ROC chips SPIROC.
CSNSM Orsay Micro-Electronics Groups Associated P. Barrillon, S. Blin, S. Callier, S. Conforti, F. Dulucq, J. Fleury, C. de La Taille, G. Martin- Chassard,
SPIROC ADC measurements S. Callier, F. Dulucq, C. de La Taille, M. Faucci, R. Poeschl, L. Raux, J. Rouenne, V. Vandenbussche.
11 may 2010 Performance of 2 nd generation ASICs for CALICE/EUDET C. de LA TAILLE OMEGA-LAL Orsay.
CALICE/EUDET FEE status C. de LA TAILLE. 16 jun 2009 TB meeting FNAL ASICs for CALICE/EUDET 2 First generation ASICs Readout of physics prototypes (ECAL,
CALICE/EUDET developments in electronics C. de La Taille IN2P3/LAL Orsay.
SKIROC status Calice meeting – Kobe – 10/05/2007.
SOCLE Meeting Dec Roman Pöschl LAL Orsay On behalf of the groups performing Electronics R&D - Introduction - SKIROC2 – Handling the large Dynamic.
Understanding of SKIROC performance T. Frisson (LAL) On behalf of the SiW ECAL team Special thanks to the electronic and DAQ experts: Stéphane Callier,
STATUS OF SPIROC measurement
3-bit threshold adjustment
Orsay Micro-Electronics Groups Associated P. Barrillon, S. Blin, S
ECAL front-end electronic status
ASIC PMm2 Pierre BARRILLON, Sylvie BLIN, Selma CONFORTI,
HR3 status.
Status of ROC chips C. De La Taille for the OMEGA group
R&D activity dedicated to the VFE of the Si-W Ecal
R&D on large photodetectors and readout electronics FJPPL KEK/Orsay JE Campagne, S. Conforti, F. Dulucq, C. de La Taille, G. Martin-Chassard,, A.
SKIROC2 Silicon Kalorimeter Integrated Read-Out Chip
FKPPL Front-End Electronics for CALICE/EUDET calorimeters C
Second generation Front-end chip for H-Cal SiPM readout : SPIROC
C. de La Taille IN2P3/LAL Orsay
Electronics for Si-W calorimeter
CALICE COLLABORATION LPC Clermont LAL Orsay Samuel MANEN Julien FLEURY
CALICE/EUDET Electronics in 2007
EUDET – LPC- Clermont VFE Electronics
02 / 02 / HGCAL - Calice Workshop
STATUS OF SKIROC and ECAL FE PCB
ECAL Electronics Status
HARDROC STATUS 6-Dec-18.
SKIROC status Calice meeting – Kobe – 10/05/2007.
HaRDROC status: (Hadronic RPC Detector Read Out Chip for DHCAL)
HARDROC STATUS 17 mar 2008.
HaRDROC status: (Hadronic RPC Detector Read Out Chip for DHCAL)
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
Signal processing for High Granularity Calorimeter
AIDA KICK OFF MEETING WP9
Presentation transcript:

Front-End electronics for CALICE Calorimeter review Hamburg HaRDROC SKIROC SPIROC Front-End electronics for CALICE Calorimeter review Hamburg C. de La Taille IN2P3/LAL Orsay On behalf of the CALICE collaboration

CALICE Testbeam at CERN SPS TCMT AHCAL (3 000 ch) W-Si ECAL (6 000 ch) HCAL SiPM ASIC Imaging calorimetry @ CERN FLCPHY3 ASIC Common DAQ 16 000 ch 31 may 2007 C. de La Taille front-end electronics for CALICE

FLC_PHY3 readout ASIC [LAL] Amp OPA G1 G10 1 channel Dual gain low noise charge preamps Multiplexed analog output Dynamic range > 12 bits linear (0.1%) range : 2.5V = 500 MIPS @ Cf = 1.6 pF 14 layers, 2.1 mm thick 70 boards made in Korea 31 may 2007 C. de La Taille front-end electronics for CALICE

C. de La Taille front-end electronics for CALICE Results with detector ©G. Gayken (LLR) Testbeam at DESY (jan 05) and at CERN (2006) Calorimeter complete in depth (24 X0, 8000 channels) MIP/noise = 8 => clean cut at ½ MIP Calibration done with cosmics Noise, MIP 31 may 2007 C. de La Taille front-end electronics for CALICE

SiPM readout ASIC [LAL] ©L. Raux (LAL) Readout AHCAL (DESY) SiPM detector (MEPHI ) >3000 channels : first large scale use G ~ 106 e ~10% HV ~ 50 V FLC_SiPM readout ASIC 18 channel variable gain preamp and shaper Dynamic range : 13 bits (2 gains) 8 bit DAC for SiPM gain adjustment 1000 chips produced in 2004 Power consumption : ~200mW (supply : 0-5V) Technology : AMS 0.8 m CMOS Chip area : ~10mm² Package : QFP-100 Single photoelectron spectrum © E. Popova 31 may 2007 C. de La Taille front-end electronics for CALICE

DCAL chip for DHCAL [FNAL] ©J Repond (ANL) 64 channle ASIC 0.25µm → prototyped (40 chips in hand) → extensively tested at Argonne → tests complete → ordered 25 + 40 additional chips Reads 64 pads Has 1 adjustable threshold Provides Hit pattern Time stamp (100 ns) Operates in External trigger or Triggerless mode 31 may 2007 C. de La Taille front-end electronics for CALICE

C. de La Taille front-end electronics for CALICE DCAL chip performance DCAL2 Testing I: Internal pulser Good performance for both RPC and GEMS : ready for production Threshold scans… All channels OK, except Channels #31/32 show some anomalies (understood, no problem) 31 may 2007 C. de La Taille front-end electronics for CALICE

C. de La Taille front-end electronics for CALICE DCAL2 Testing III: External pulser Linear up to ~300 fC Range up to ~700 fC (RPC: Q = 100 fC ÷ 10 pC) Corresponds to zero charge (Offset in charge) Q(fC) = 1.91·ADC - 39.9 100 hits per point Average threshold defined as ε=50% point 31 may 2007 C. de La Taille front-end electronics for CALICE

Next steps : technological prototypes HaRDROC (2006) FLC_PHY3 (2003) 31 may 2007 C. de La Taille front-end electronics for CALICE

Technological prototype : “EUDET module” Front-end ASICs embedded in detector Very high level of integration Ultra-low power with pulsed mode Target 0.35 µm SiGe technology All communications via edge 4,000 ch/slab, minimal room, access, power small data volume (~ few 100 kbyte/s/slab) « Stitchable motherboards » Minimal conncections between boards Elementary motherboard ‘stitchable’ 24*24 cm ~500 ch. ~8 FE ASICS 31 may 2007 C. de La Taille front-end electronics for CALICE

EUDET module FEE : main issues Mixed signal issues Digital activity with sensistive analog front-end Pulsed power issues Electronics stability Thermal effects To be tested in beam a.s.a.p. No external components Reduce PCB thickness to < 800µm Internal supplies decoupling Low Cost and industrialization are the major goal 31 may 2007 C. de La Taille front-end electronics for CALICE

C. de La Taille front-end electronics for CALICE Read out : token ring Chip 0 Chip 1 Chip 2 Chip 3 Chip 5 events 3 events 0 event 1 event Data bus Chip 0 Acquisition A/D conv. DAQ IDLE MODE Chip 1 Acquisition A/D conv. IDLE DAQ IDLE MODE Chip 2 Acquisition A/D conv. IDLE IDLE MODE Chip 3 Acquisition A/D conv. IDLE IDLE MODE Chip 4 Acquisition A/D conv. IDLE DAQ IDLE MODE 1ms (.5%) .5ms (.25%) .5ms (.25%) 199ms (99%) 99% duty cycle 1% duty cycle 31 may 2007 C. de La Taille front-end electronics for CALICE

HaRDROC chip for DHCAL [LAL,IPNL] Hadronic Rpc Detector Read Out Chip (Sept 06) 64 inputs, preamp + shaper+ 2 discris + memory + Full power pulsing Compatible with 1st and 2nd generation DAQ : only 1 digital data output Discris Digital memory 64 Analog Channels Dual DAC Bandgap Control signals and power supplies 31 may 2007 C. de La Taille front-end electronics for CALICE

C. de La Taille front-end electronics for CALICE HaRDROC architecture Full power pulsing Digital memory: Data saved during bunch train. Only one serial output @ 1 or 5MHz or more Store all channels and BCID for every hit. Depth = 128 bits Data format : 128(depth)*[2bit*64ch+24bit(BCID)+8bit(Header)] = 20kbits Based on MAROC ASIC, but several design changes 31 may 2007 C. de La Taille front-end electronics for CALICE

C. de La Taille front-end electronics for CALICE HARDROC: digital part 31 may 2007 C. de La Taille front-end electronics for CALICE

HARDROC1: TESTBOARD with Chip On Board PCB for COB: to estimate feasability (ECAL) 6 layers, COB on Layer 5 2 steps to facilitate the bonding 31 may 2007 C. de La Taille front-end electronics for CALICE

C. de La Taille front-end electronics for CALICE Performance Good performance Power dissipation : 1.4mW/channel (unpulsed) Power pulsing tests starting. Anticipate S-curves Good sensitivity to 100fC. Can go down to 10fC 31 may 2007 C. de La Taille front-end electronics for CALICE

MEMORY FRAMES: Auto trigger mode Auto trigger with 10fC: Qinj=10fC in Ch7 DAC0 and DAC1=255 (~5fC) Ch7 BCID Header 31 may 2007 C. de La Taille front-end electronics for CALICE

C. de La Taille front-end electronics for CALICE SKIROC for W-Si ECAL Silicon Kalorimeter Integrated Read Out Chip (Nov 06) 36 channels with 16 bits Preamp + bi-gain shaper + autotrigger + analog memory + Wilkinson ADC Digital part outside in a FPGA for lack of time and increased flexibility Technology SiGe 0.35µm AMS. Chip received may 07, tests starting 31 may 2007 C. de La Taille front-end electronics for CALICE

One channel 20M 1M 200ns G=10 G=1 Analog Memory Depth = 5 G=100 G=5 12 bits ADC Gain selection 0=>6pF 3-bit threshold adjustment 10-bit DAC Common to the 36Channels T 100ns DAC output Q HOLD Preamp Ampli Slow Shaper Fast Shaper Trigger Charge measurement 3pF Calibration input input 31 may 2007 C. de La Taille front-end electronics for CALICE

C. de La Taille front-end electronics for CALICE SPIROC overview Silicon Photomultiplier Integrated Read Out Chip A-HCAL read out Silicon PM detector G = 3 E5 to 1 E6 Same biasing scheme as TB 36 channels Charge measurement (15bits) Time measurement (< 1ns) Compatible with old & new DAQ Many SKIROC, HARDROC, and MAROC features re-used Submission foreseen june 11th 31 may 2007 C. de La Taille front-end electronics for CALICE

SPIROC: One channel schematic 50 -100ns 50-100ns Gain selection 4-bit threshold adjustment 10bit DAC T 15ns DAC output Q HOLD Slow Shaper Fast Shaper Time measurement Charge measurement Fast ramp 300ns 12-bit Wilkinson ADC Trigger Depth 16 Common to the 36 channels 8-bit DAC 0-5V Low gain Preamplifier High gain Preamplifier Analog memory 50pF 5pF 0.1pF-1.5pF Conversion 80 µs READ Variable delay IN IN test Discri 31 may 2007 C. de La Taille front-end electronics for CALICE

Acquisition Channel 0 Conversion ADC + readout Ecriture RAM Channel 1 ValidHoldAnalogb 16 RazRangN Chipsat 16 ReadMesureb 16 Acquisition NoTrig gain Trigger discri Output Wilkinson ADC Discri output ExtSigmaTM (OR36) StartAcqt SlowClock Hit channel register 16 x 36 x 1 bits TM (Discri trigger) 36 BCID 16 x 8 bits Channel 0 gain Trigger discri Output Wilkinson ADC Discri output Conversion ADC + Ecriture RAM StartConvDAQb 36 ValGain (low gain or high Gain) TransmitOn readout RamFull OutSerie 36 EndReadOut EndRamp (Discri ADC Wilkinson) StartReadOut FlagTDC Rstb Channel 1 Clk40MHz ..… ADC ramp Startrampb (wilkinson ramp) RAM OR36 … StartRampTDC TDC ramp ChipID Chip ID register 8 bits 8 ValDimGray DAQ ASIC ValDimGray 12 bits 12

C. de La Taille front-end electronics for CALICE On-going R&D : ADCs Performance (measured): Resolution: 10 bits Consumption: 35 mW Conversion time: 0.25 µs (@ 40MHz) Integrated cons.: (35mW * 0.25µs)/200ms= .044µW Characteristics: Technology: CMOS SiGe 0.35µm Power supply: 5V (digital: 2.5V) Clock frequency: 40 MHz Differential architecture 10 stages - 1.5 bit/stage Die area: 1.2 mm2 Noise (measured): < 0.47 LSB @ 68% C.L. +0.85 -0.70 Integral NL LSB Differential NL +0.56 -0.46 LSB est-ce que la conso tient compte du power pulsing ou non ?? 31 may 2007 C. de La Taille front-end electronics for CALICE

C. de La Taille front-end electronics for CALICE Conclusion Several large dynamic range ASICs developped for CALICE physics prototypes ECAL W-Si calorimeter : FLC_PHY3 = 104 channels in beam, dynamic range 0.1-600 MIPS AHCAL Tile-SiPM calorimeter : FLC_SiPM = 103 channels installed, beam in summer 06 DHCAL GEM/RPC 3 major second generation ASICs for technological prototypes submitted HARdROC submitted for DHCAL RPCs SKIROC submitted for ECAL Si-W SPIROC for AHCAL SiPM Power pulsing, Zero-suppress, Auto-trigger, 2nd generation DAQ… System aspects not to be forgotten Power supplies ! Mechanics, reliability… 31 may 2007 C. de La Taille front-end electronics for CALICE

C. de La Taille front-end electronics for CALICE Next steps Complete physics prototype Add and test DHCAL, complete physics program Test effect of em shower on ASIC Measure performance of 2nd generation ASIC On testbench in different labs DHCAL ECAL, AHCAL Test 2nd generation DAQ (UK) Design Very Front-End boards with integrated ASICs ECAL board with FLC_PHY4 DHCAL board with HARDROC Design EUDET module(s) (demonstrator) Finalizing Si detectors is now in the critical path (dimensions, layout, AC/DC) 31 may 2007 C. de La Taille front-end electronics for CALICE