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C. de La Taille IN2P3/LAL Orsay

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Presentation on theme: "C. de La Taille IN2P3/LAL Orsay"— Presentation transcript:

1 C. de La Taille IN2P3/LAL Orsay
EUDET FRANCE C. de La Taille IN2P3/LAL Orsay

2 EUDET JRA3 milestones (except FCAL)
Jun 06 : Analog ASIC prototype 1 available Sept 06 : PCI card available Jun 07 : AHCAL Front-End board and modified stack ready Jun 07 : DHCAL VFE conceptual design ready Jul 07 : Analog ASIC prototype 2 available Jun 08 : Integrated ASIC available Jun 08 : final DAQ available Jan 09 : DHCAL VFE engineering design ready Jan 09 : Front end electronics infrastructure available Mar 09 : AHCAL front end boards available Jun 09 : integrated system available Dec 09 : construction complete 23 mar 2007 CdLT CERN meeting on CALICE/EUDET electronics

3 CdLT CERN meeting on CALICE/EUDET electronics
EUDET planning Sept 06 : DHCAL ASIC submitted Nov 06 : ECAL ASIC submitted Mar 07 : DHCAL front-end board designed Mar 07 : ECAL PCB R&D Jun 07 : AHCAL ASIC submission Mar 08 : DHCAL, ECAL and AHCAL ASIC production Jun 08 : ASIC tests Jun 08 : ECAL PCB production Sept 09 : mounting of ASICs and tests of ~40 PCBs Mar 09 : mounting of wafers + cosmic tests 23 mar 2007 CdLT CERN meeting on CALICE/EUDET electronics

4 EUDET funding at CNRS (hardware)
Spendings : 335 k€ Tungsten sheet : 60 k€ (LLR) Structure computing : 22 k€ (LLR) Moulds : 70 k€ (LLR) PCBs : 15 k€ (LLR) Si wafers : 60 k€ (LLR) AISC development (DHCAL) : 13 k€ (LAL+LLR) ASIC protoptypes : 95 k€ (LAL + LPCC) Has disappeared : ASIC + PCB production : 161 k€ Attributed : 185 k€ LLR : 77 k€ ECAL + 7 k€ VFE LAL : 95 k€ VFE LPC : 5 k€ VFE Committed LLR : 150 k€ 23 mar 2007 CdLT CERN meeting on CALICE/EUDET electronics

5 CdLT CERN meeting on CALICE/EUDET electronics
EUDET consumables CONSUMABLES TOTAL allocated 2006 spent dec06 allocated 1/2007 spent jul07 allocated 7/2007 CNRS/EP TOT 84,550 € 16,600 € 59,000 € 9,950 € - € 29,000 € CNRS/EP ECAL 76,950 € 9,000 € CNRS/EP FEE 7,600 € CNRS/LAL FEE 95,000 € 2,000 € 45,000 € 56,000 € 25,000 € CNRS/LPC FEE 5,000 € 23 mar 2007 CdLT CERN meeting on CALICE/EUDET electronics

6 CdLT CERN meeting on CALICE/EUDET electronics
EUDET Staff TEMP STAFF TOT allocated 2006 spent dec06 allocated 2007 spent apr07 CNRS/EP TOT 275,000 € 31,000 € 27,000 € 125,000 € - € CNRS/EP ECAL 30 12,500 € 20,000 € 50,000 € CNRS/EP FEE 24 150,000 € 18,500 € 7,000 € 75,000 € CNRS/LAL FEE 32 135,000 € 35,000 € CNRS/LPC FEE 10,000 € 23 mar 2007 CdLT CERN meeting on CALICE/EUDET electronics

7 CdLT CERN meeting on CALICE/EUDET electronics
Money spent at LAL 2006 : 2 k€ 2 k€ testboards 2007 : 50 k€ 16k€ : HaRDROC prototype 4 k€ : testboards 5 k€ : 70 more chips 5 k€ : DHCAL PCB 20 k€ : SKIROC prototype 23 mar 2007 CdLT CERN meeting on CALICE/EUDET electronics

8 CdLT CERN meeting on CALICE/EUDET electronics
EUDET : ECAL module Electromagnetic calorimeter Prototype of a (~ 1/6) module 0 : one line & one column 150 cm long, 12 cm wide 30 layers channels Test full scale mechanics + PCB Can go in test beam Test full integration + edge communications To be delivered in 2009 ©M. Anduze (LLR) Slab FE FPGA PHY VFE ASIC Data Clock+Config+Control Conf/ Clock 23 mar 2007 CdLT CERN meeting on CALICE/EUDET electronics

9 EUDET - Detector slab (2)
“end” PCB Connection between 2 PCB 7 “unit” PCB Exploded view Chip « inside » 23 mar 2007 CdLT CERN meeting on CALICE/EUDET electronics

10 AHCAL architecture To DAQ Module data concentrator 38 layers
80000 tiles Typical layer 2m2 2000 tiles Layer data Concentrator (control, clock and read FEE) FEE: 32 ASICs (64-fold) 4 readout lines / layer EUDET: Mechanical structure, electronics integration: DESY and Hamburg U Instrument one tower (e.m. shower size) + 1 layer (few 1000 tiles) 23 mar 2007 CdLT CERN meeting on CALICE/EUDET electronics

11 CdLT CERN meeting on CALICE/EUDET electronics
DHCAL architecture First detector with 2nd generation ASCIs and 2nd generation DAQ 23 mar 2007 CdLT CERN meeting on CALICE/EUDET electronics

12 DAQ Structural Overview
ASICs Front-End (FE) FE-Interface (DIF): Detector specific FE Link/Data Aggregator (LDA): Generic Data-link (FE to Off-Detector Receiver) Control-link (C+C to FE) DAQ PC Off-Detector Receiver (ODR) Control data-link (Clock, Control to FE) Data Store ASICs DIF FE LDA Control-link Data-link PC/s ODR Store 23 mar 2007 CdLT CERN meeting on CALICE/EUDET electronics

13 UK Read-out work (ECAL FE)
Slab Detector Interface (Cam) Spec + hardware DIF to Link/Data Aggregator (Cam/Man) Data aggregate, format (Man) Hardware + firmware LDA to ODR opto-link (Man, UCL) ODR (RHUL, UCL, Cam) firmware ODR to disk (RHUL) Driver software Local Software DAQ (RHUL) Full blown Software DAQ (RHUL, UCL, [IC]) DIF LDA Opto PC ODR Opto Driver 23 mar 2007 CdLT CERN meeting on CALICE/EUDET electronics


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