0. Materials for the 2020 Challenges: The view of industry
Carmelo Papa
Executive Vice President,
Industrial and Multisegment General Manager
STMicroelectronics
“Materials for the 2020 Challenges”
European Parliament Brussels. July

1. Outline New materials can address societal challenges by:
boosting performances of key enabling technologies
introducing entirely new functions in systems and changing
manufacturing flow
Examples of new materials in semiconductor industry:
SiC and GaN for the new wave of power electronics
Polymers and flexible electronics for healthcare
Keep looking at advanced materials: e.g. graphene
Bridging the gap between material science and market

2. A long path from materials to applications
electric/hybrid car
From Materials to
devices to systems…
Applications
….and viceversa: problems
from applications leading
to applied and fundamental R&D
Device engineering
and industrialisation
Early device
prototypes
Fundamental
Material studies

3. Societal challenges calling for better power actuators: energy efficiency and…
Kyoto protocol on reducing
greenhouse gas emissions
126$
Oil price increase
Kyoto target -30% reduction in 2030.
European Union targets reduction of 20% energy consumption by 2020 : 100BEuro/y savings, 780MT CO2
European Community impact 16% of world demand. 27 countries, 500M people.
On 23 January 2008, the European Commission unveiled an ambitious package of proposals to to fight climate change and promote renewable energy in line with EU commitments. This Climate Action package builds on the many targets the EU set itself in 2007 for 2020 as part of the Energy Policy for the European Union including 20% reduction in greenhouse gases; 20% increase in energy efficiency, and increasing renewable energy use to 20% of total energy consumption.
> 85% of produced energy
presently derived from
hydrocarbons 3

4. ….people concentration in megacities
By 2050, 7 out of 10 people will live in megacities, offering the benefits of concentrated living but also some of the biggest public-works challenges in human history.

5. Sensors around the body
Societal Challenges in Healthcare
Healthcare spending is growing fast : currently 15% of GDP for USA,
8% of GDP for Europe
Global Healthcare spending is more than 5 Trillion Dollars per year
This spending trend is unsustainable for the future economy
To counter this trends, the Healthcare industry must change
A move towards Personal Home Diagnostic
Sensors around the body

6. Emerging Applications require Smart Integration : Moore’s Law and More than Moore
“ More than Moore ” : Diversification
“ Moore’s Law ” : Miniaturization HV
Sensors
Analog/RF
Passives
Biochips
Power
Actuators
130nm
130nm
Interacting with people
and environment
90nm
90nm
Baseline CMOS : CPU, Memory, Logic
65nm
65nm
Information
Processing
SoC and SiP mix for Higher Value Systems
45nm
45nm
32nm
32nm
22nm
22nm
As IMS R&D we innovate mainly along the “diversification” axis, by integrating new or multi-functionalities in a smart system.
The innovation along this path is characterized by the introduction of disruptive technologies and applications, as it enables to come with new entirely products which does not exist or it is not possible to develop with conventional semiconductor technologies, by System-On-Chip approach.
“Electronics on flexible foils” , being an enabling technology for smart disposable systems integration, shall be among the next disruptive technologies in the decade, after MEMS, SmartPhones and SmartPower integration, since it allows to fully achieve innovative system solutions on substrates other than silicon, that can be flexible, conformable, lightweight, transparent and cost-effective. . . . . . . V V
“Moore” approach: integrate more transistors in a chip
“More than Moore”: integrate functions in a Smart System
Innovation in More than Moore comes in disruptive steps
Beyond CMOS:
Quantum Computing,
Molecular Electronics
Spintronics 6

7. From Si Power Devices…….
The most recent Si MOSFET
at ST Microelectronics
60 um Si wafer processing
for advanced IGBTs devices 7

8. ….to SiC and GaN power devices
Better power density
Lower losses
Higher operation temperature
Higher operation frequency
Source: Yole Développement,

9. SiC and GaN power devices
2015 SiC and GaN power device TAM: $0.5B
Gallium Nitride
Silicon Carbide
SiC Program
1200 V MOSFET (Q4 2012)
SiC MOSFET vs V IGBT
64% die size reduction
Much higher switching frequency
GaN Program
650V / 15A HEMT
650V / 200A HEMT
GaN Transistor vs. 650 V IGBT
40% Power Saving
- 64% Silicon Area
1200 V IGBT
1200 V SiC
MOSFET
Source: Yole Développement, STMicroelectronics 9 9 9

10. SiC and GaN in Renewable Energy
Standard Inverter
Smart
Junction Box
Power Optimizer
Microinverter
Moving electronics into the Panel for Enhanced Photovoltaic
ST Solution
Rectifiers
(SiC, Schottky, Ultrafast)
Power Switches
(MOSFET, IGBT)
Protections
(ESD, EOS)
Control
Unit
PLM, ZigBee Transceiver
Metrology ICs
Gate Drivers
Power Modules
Auxiliary Power Supply
SCR’s
DC-AC conversion and MPPT
DC-DC conversion and MPPT
Enabling lower losses and higher currents
High efficiency full solar system
PV Inverter System 2014 TAM:
$8.8B, CAGR : 11%
23 Mu, CAGR : 63%
Source: iSuppli 10

11. SiC and GaN in Hybrid & Electric Vehicles
ST Solution
Rectifiers
Power Switches
(MOSFET, IGBT)
Protections
Control
Unit RF
Transceiver
Gate Drivers
Auxiliary Power Supply
Power Modules
PLM Transceiver
PHEV: Plug-in Hybrid Electric Vehicles
Smart Power Electronics for a dramatic reduction of C02 emission
HEV / EV Semiconductor TAM: $1.9B
CAGR : 28%
Source: Yole Développement, STMicroelectronics 11

12. Smart Systems are everywhere and require the introduction of a wealth of new materials

13. Automotive & Transportation
Flexible Electronics: a new material for Smart Systems
Ambient Intelligence
Security & Safety
Portable
Consumer
Flexible Conformable
Self Powered Autonomous
Wireless Dislocation
Cost Effective Disposable
Light Portable
Gaming & Leisure
Wearable Electronics
Healthcare
& Fitness
Human Interface
Automotive & Transportation

14. ...adding material knowledge for Flexible & Disposable Electronics
Bio-materials
Metal/Non ferrose (Al, Ti, Cu, Ag, Tg, Au, Ni)
Polimers (Non Metal/Organics/Thermoplastic)
Polimmide
PVC
COP
PET
PEN
Ceramics (Non Metal / Inorganics)
Polymers
Advantages
tenacity
low specific weight
workability
Disadvantages
low mechanic resistance
degradation over time
deformation over time
Ceramics
Advantages
Good biocompatibility
Chemical inert
High resistance to compression
Resistance to corrosion
Disadvantages
Low resistance to traction
High specific weight
Fragility
Low workability
Metals
Advantages
mechanical characteristics
higher resistance to the use
ductility
Disadvantages
Low biocompatibility
Rigidity
High specific height
Corrosion in physiological environment

15. Increasing complexity by multi-foil 3D integration on flexible substrates
The project challenge is the development of interconnection technologies for autonomous, flexible and smart system:
Interconnection technologies between flexible components and flexible foils as well as between functional foils.
Three dimensional functional foil integration to achieve multi-foil based systems, i.e. system-in-foil.
Technical Demonstrator
Energy autonomous indoor air quality sensing system capable of wireless communication of the measured data. 15 15

16. Flexible Electronics at STMicroelectronics
Application fields:
Printed sensors / Flexible ICs
Multifunctional systems on foil
Smart disposables for healthcare and ambient intelligence
Technologies:
From litho-based on wafer carriers
… to printed electronics carrier-less
To Hybrid system integration (e.g. multi-foil)
Wireless Strain Gauge Modules
for pressure and temperature
Sensors around the body
Examples:
Sensors on plastic: strain/pressure, temperature, gas and biosensors
Smart objects with RF harvesting and wireless communication
Transparent and Flexible electronics, incl. printed organics and oxides
Implantable sensors for glucose monitoring
Hybrid Si-Plastic micro-fluidic modules

17. Sensor & antenna embedded in a silicone contact lens
Example:Contact Lens for Early Diagnosis of Glaucoma
Application: Contact Lens for non-invasive early diagnosis and personalized treatment of Glaucoma (customer: SENSIMED AG)
ST Sensor is a strain gauge & antenna embedded in a silicone contact lens
The Sensor is capable of measuring cornea deformations due to Intra-Ocular-Pressure (IOP) variations
The IOP Sensor is a wireless sensor that acts as a transducer, antenna and mechanical support for additional read-out electronics
ST Wafer containing
contact lens sensor
The complete (Smart) System commercialized by SENSIMED includes:
Contact Lens
External antenna & data-cable
Recorder
Software
Contact lens sensor
Into the patient’s eye
Intra-Ocular Pressure
Disposable Sensor
Sensor & antenna embedded in a silicone contact lens
Telemetric chip
Press release March 24, 2010: ST to develop and supply wireless sensor for Sensimed’s Continuous Eye Pressure Monitor 17

18. Example:Diabetes Management with implantable biosensors
Application: Continuous Glucose Monitoring (CGM)
As of 2010 about 285 million people around the world, are affected by Type 2 Diabetes Mellitus disease. Complications arising from diabetes can be both Acute and long term and include hypoglycemia, Ketoacidosis, coma, renal failure, amputations, neuropathy, and retinal damage.
In the last decade Glucose sensing technology became the major research focus in diabetes management area, and 80% of biosensor market are the glucose sensors.
Source:
Over the next 10 years the cost of diabetes, heart disease, and stroke will take a tremendous toll on the national incomes of developing world countries.
According to WHO, diabetes, heart disease, and stroke together will cost about $555.7 billion in lost national income in China, $303.2 billion in the Russian Fed.; $336.6 billion in India; and $49.2 billion in Brazil.
Working Reference Counter 18

19. Example: Biosensors for healthcare & fitness
Amperometric sensors: from Glucose to Lactate monitoring
Lactate levels are related to the
anaerobic metabolism associated
with muscle contraction:
0.6 ~ 2 millimoles in resting
up to 20 or 30 mM during activity
Athletes have to stop physical activity when they reach their lactate threshold.
Aim: to avoid metabolic disorders and injured tissues during sport activities.
Monitoring of several pathologic conditions, such as the case of patients with cardiac disease and diabetes.
Multisensing of biological functions
Biological chemical sensors associated with other physical and mechanical sensors, such as ECG, accelerometers, gyroscopes, temperature, pressure, light, etc.…
It requires dedicated electronics able to acquire the signals from sensor, process them and transmit to a portable remote unit 19

20. From Healthcare to Ambient Intelligence
Multifunctional systems embedded in everyday objects:
a) Wireless sensor networks
Network of sensors embedded with low-cost electronics with RF & analog processing capability
Opportunities:
Multi-sensors integration at each sensor node
Low power (either with battery or battery-less, where possible)
b) Smart objects in packaging & textile
High volume (existing market for RFID)
Electronics on plastics, paper, textile
Gas and chemical sensors in smart objects
Flexible & streatchable electronics
associated with other functions and technology drivers:
e.g. displays, energy harvesting, ULP radios

21. Keep watching new materials, e.g. graphene
Thinnest material sheet imaginable…yet the strongest! (5 times stronger than steel and much lighter!)
Graphene is a semimetal: it conducts as good (in fact better!) than the best metals, yet its electrical properties can be modulated (it can be switched ON and “OFF”)
Record electron and hole mobilities (>×100 than Si)
Superb heat conductor (>x40 than Si)
Very high current densities (~4-8 mA/mm, equivalent to 109 A/cm2)
Applications: new devices due to ambipolar transport, excellent electrostatic confinement, integration with Si and with flexible/transparent substrates
Graphene has the potential to revolutionize numerous fields:
Electronics, materials science, chemistry, bio-sensors…

22. European « three pillars bridge » to pass across the « valley of death »
Technological
development
Pilot deployment
Pilot line
Globally competitive
manufacturing facilities
Technology
Production
Science
Products
Product development
Technological research
Competitive manufacturing
The valley of death represents the gap between “knowledge” and “market”
Americans excel in this crossing and Asians commit their energy and finances to cross it,
This valley of death remains a major hurdle for Europe
To successfully cross the KETS valley of death, we propose a three pillar bridge that we have to build together.
The first pillar "Technological research" consists of taking best advantage of European scientific excellence in transforming the ideas arising from fundamental research into technologies competitive at world level, protected by patent. This task is mainly realized by research and technology organizations. To be competitive at world level these research and technology organizations need to dispose of state-of-the-art technological facilities.
Knowledge
Market
The valley of death 22 22