Presentation on theme: "Assembly and Packaging TWG What has changed in the last 12 months? 1."— Presentation transcript:
Assembly and Packaging TWG What has changed in the last 12 months? 1
What Has Changed In The Last 12 Months? With the continuous shrinking of device features and the emergence of new device types everything is changing. A few key changes in the last 12 months are the focus of this presentation. –Change dictated by Moores Law scaling –Copper wire bonding moving toward volume leadership –Heterogeneous integration for SiP –2.5D moves the interposer into volume manufacturing –3D integration –Thinning –Photonics getting closer to the transistors –Requirements for packaging MEMS devices 2
Single Chip Package Technology Requirement Challenges still remain for conventional single chip packaging The continuous drive to reduce cost remains one of the most challenging requirements 3
Copper Wire Bonding Is Taking Over Driven by: Strong mechanical properties Better heat dissipation Increases power ratings Thinner wire diameters It is cheaper than gold Improved process control in now delivering No reliability issues No yield issues Some vendors dont yet have this process control 4
Evolution Of Heterogeneous Integration: 2.5D a bridge to 3D Wirebond BGA FC BGA Stacked DiePoP EPS2.5D IC (Si Interposer) 3D IC die stack FO-WLP MEMs & MEMs & Wireless FO-WLP SiP Time WLCSP Heterogeneous Integration Assembly + Substrate Heterogeneous Integration IC + Assembly
The Vision Of Complex Sip Is Finally Entering The Market 6 5 Layers in the stack Processor Wide IO SDRAM 2 mobile DRAM Silicon spacer between the 2 mobile DRAM Sonys CXD5315GG Package in PlayStation Vita
Packaging is the enabling tool for More than Moore. It allows consumer products that are ever smaller, more powerful, cheaper, require less power and reliability ensuring a useful life that meets the expectation of the customer.
Why Has 3D TSV Taken So Long? The typical response is: –Cost –Competition from existing technology –Technical inertia –Supply chain maturity Truth is it has not been slow. –flip chip 30 years –copper wire bond 30 years –3D-TSV 6 years assuming 2013 for volume production 8
Why Has 3D TSV Been So Fast? It has been driven by: –CMOS shrinking can no longer keep up the pace of progress –Enabling packaging technologies are available Interposers TSV –Performance advantages are compelling Reduced power Reduced latency Increased bandwidth Reduced size 9
SnAg bumps for FC Interconnects and Cu pillar bumps for board assembly Silicon Interposer deals with a wide IO interface between devices e.g logic, memory, Fan-out interface from device to package/board high re-routing capability and TSV interconnects
Interposers Are Now In Production Interposer substrate has more than 10,000 routing connectionsInterposer substrate has more than 10,000 routing connections Compared with standard I/O connections it provides:Compared with standard I/O connections it provides: – > 100X die-to-die bandwidth per watt –one-fifth the latency –Uses no high-speed serial or parallel I/O resources.
3D Integration - TSV
3D Products Are Sampling Today Four layer stacks are sampling today. The industry is getting ready for high volume with the next generation. –Greater density –Lower latency –Higher bandwidth 13
We Are Thinning Everything What is driving this change? Thinning is delivering what the consumer wants –Thinner devices and products –Flexible devices and products –Increases functional density –Stacking needs it –It is the key to low cost TSV –High yield cost effective thinning processes are available Packaging challenges remain for cost effective handling of thinned die and wafers
We Are Thinning Everything What is being thinned? –Wafers and die –Die attach layers –Lead frames –Underfill –Package substrates –Mold caps Total package height for BGA counting solder balls is 400um down from 500um a year ago. Example: Total package height for BGA counting solder balls is 400um down from 500um a year ago.
Optical IO In-to And Out-of Package There is a drive to move photonics as close to the transistors as possible to increase bandwidth and reduce power requirement The challenges increase with each node due to large size of E to O and O to E conversion 16
MEMS Are Now Shipping For Diverse Applications Current state of the art production MEMS oscillators Sensors with ten degrees of freedom –3-axis gyro –3-axis magnetometer –3-axis accelerometer –Pressure sensor 17 These products have unique packaging challenges and new solutions are being developed. Package cost is often greater than 50% of product cost and cost remains a factor restraining broader adoption of MEMS solutions