1. Slide : 1 03-oct-2006AMICSA 2006 summary

2. Slide : 2 03-oct-2006AMICSA 2006 AMICSA 2006 in numbers 48 participants From 12 countries GR, FR, UK, NE, GE, IT, BE, USA, SWI, SWE, AU From 26 different institutions/companies DUTH/Space Research Lab, A2S, EADS Astrium, E2V (ex Atmel Grenoble), ESA, CNES, National Semiconductor, TRAD, Aurelia, NTUA, STMicroelectronics, SODERN, SRON, Fraunhofer Inst IC, IHP, IMST, NISR, TESAT, ETH, SUPAERO, Saab, IMEC, AAS, Austria Space Research Inst, Nucletudes, ISD. 17 presentations in 2 days, plenty of discussions, questions and answers

3. Slide : 3 03-oct-2006AMICSA 2006 AMICSA - Applications CMOS Image sensors Video processing chain ADC/DAC/HSSL high speed low power telecom processors (mobile & broadband) CAN transceivers TM acquisition & data handling IO control Magnetometer front end Slow sampling high resolution

4. Slide : 4 03-oct-2006AMICSA 2006 AMICSA – Technology (I/II) PROCESSES CMOS Bipolar BiCMOS Si / SiGe bulk /epi / SOI FOUNDRIES AMS (Austria) AMIS (Belgium) STMicroelectronics (France) IHP (Germany) Infineon (Germany) XFab (UK) UMC (Taiwan)

5. Slide : 5 03-oct-2006AMICSA 2006 AMICSA – Technology (II/II) EDA tools, HDL & DK Tanner Cadence Calibre (Mentor) Pspice / Hspice ADMS (Mentor) VHDL-AMS / Verilog-A Astrium UK ADC simulator MPW programmes Europractice CMP MOSIS vendor specific…

6. Slide : 6 03-oct-2006AMICSA 2006 AMICSA – Radiation effects Rad Threats (TID, SEE) leakage currents Vth shifts parasitic transistors/ latch up gate rupture data corruption (bit flips) transient pulses Mitigation Techniques (technology and function dependent) enclosed/bigger transistors guardband rings / STI / LOCOS avoid diffusion resistors in favor of oxide R epi layer / hetero-epi buried-layers low gain artificially provoked parasitic transistors DRC isolation rules SOI thinner gate oxide hardened libraries (re-size, cell-topology) ADC offset auto-zeroing (analog and digital correction) architecture hardening (open vs closed loop) redundancy and voting/comparing

7. Slide : 7 03-oct-2006AMICSA 2006 AMICSA – Future Challenges Easier selection of process, foundry, design kit & tools, rad mitigation techniques, quality level Lower cost access to design kits, manufacturing services Simulation tools. Characterising COTS (NPR,etc) Supporting EU foundries in low volume market Coordinating/reusing EU resources (e.g. rad tests, new libs/DK & IPs), preserving industry competition and individual commercial interests Finding more resources for more tech/components evaluation and qualification. Sharing results ! Maintaining good (better) communication channels (ESCC Working Groups, AMICSA 2008 ?, Harmonisation/Tech Dossiers)

8. Slide : 8 03-oct-2006AMICSA 2006 AMICSA – THANKS ! to all participants to sponsors DUTH / ESA / National Semiconductor to organizers Boris Glass and ESA Conference Bureau Professor Emmanuel Sarris and DUTH / Space research Lab team !!