First BoG Meeting of IEEE CPMT in 2004 Report on Conference-Related Matters Ricky Lee VP-Conferences Las Vegas, Nevada, USA June 5, 2004

Presentation Outline 1.CPMT Sponsorship Options offered to 2004 Conferences 2.Summary of 2004 Conferences 3.Newly Proposed CPMT Sponsorship for 2005 Onwards Conferences for Approval

CPMT Sponsorship for 2004 Option #1: Financial Sponsorship A pre-conference loan (USD ) may be provided by CPMT. 2.The conference organizers should make a budget plan showing a 15% (or more) surplus (Note: this is a budget plan only). 3.The benefits of the conference include full access to CPMT Newsletter, Call for Papers in CPMT Transactions, use of IEEE and CPMT logos, one-sheet publicity items, IEEE book indexing of conference proceedings, participation of Book Broker Program to IEEE Xplore, listing on CPMT website, and use of IEEE server for web content After receiving the pay-back of pre-conference loan (if any), CPMT will share the actual surplus/loss with other co-sponsors (if any).

CPMT Sponsorship for 2004 Option #2: Fixed Fee for Services The conference may request any portion of the full services from CPMT with a negotiated price. 2.Typically, for publication-related benefits, the service fee starts from USD3000.

CPMT Sponsorship for 2004 Option #3: Per-Attendee-per-Day Overhead Based on the total registration, the conference pays for CPMT services on a per-attendee-per-day basis. [e.g., 100 people register for 2 days and 100 people register for 1 day; if the negotiated overhead is USD10 per-attendee-per-day, then the total charge paid to CPMT is USD10 x (100 x ) = USD3000] 2.The amount of services provided by CPMT depends on the negotiated amount of overhead. 3.The conference can build this overhead in the registration fee.

CPMT Sponsorship for 2004 Option #4: Exceed Break-Even Overhead The conference set up a break-even point based on the registration head-count. [e.g., The conference organizers estimate, if there are 100 full registrations, then the conference will not lose money] 2.If the actual head-count of registrations exceed the estimated break- even point (or equivalent, considering partial registrations), then the conference pays for CPMT services based on the head-count exceeding the break-even point, either with a fixed fee per head or with a fixed percentage of registration fee per head. [e.g., the break-even point is 100 full registrations; if the actual head-count of full registrations is 150 and the negotiated overhead is USD60 (or 20% of full registration fee) per head, then the total charge paid to CPMT is USD60 x ( ) = USD3000 (or Full registration fee x 20% x 50)] 3.The amount of services provided by CPMT depends on the negotiated amount of overhead.

Summary of 2004 Conferences Conference TitleTimeLocationSponsorship Int'l IEEE Confer on Asian Green Electronics (AGEC) January 5-9Shenzhen, China20% over IEEE/CPMT 20th Semiconductor Thermal Measurement & Management Symposium (SEMI- THERM) March 9-11San Jose, CA, USA100% 1st International Workshop in Nano Bio-Packaging (NanoBioPack) March 22-23Atlanta, GA, USA50%/50% 5th International Symposium on Quality Electronic Design (ISQED) March 22-24San Jose, CA, USA50%/50% 9th International Symposium & Exhibition on Advanced Packaging Materials March 24-26Atlanta, GA, USA50%/50% 2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference & Workshop (ASMC) May 4-6Boston, MA, USA 25%(CPMT)/25%/ 50% 8th IEEE Workshop on Signal Propagation on Interconnects (SPI'04) May 9-12 Heidelberg, Germany50%/50%

Summary of 2004 Conferences Conference TitleTimeLocationSponsorship 5th Int'l Conference on Thermal, Mechanical and Thermo-mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE May 9-12Brussels, Belgium(semi-Tech) 27th International Spring Seminar on Electronics Technology (ISSE) May 13-16Sofia, Bulgaria50%/50% 2004 IEEE 54th Electronic Components & Technology Conference (ECTC'04) June 1-4Las Vegas, NV, USA50%/50% 2004 ITHERMJune 1-4Las Vegas, NV, USA100% 7th IEEE International Academic Conference on Next Generation Microsystem Packaging Research and Education June 28-30Shanghai, China20% over 100 6th IEEE Conference on High Density Microsystem Design and Packaging and Failure Analysis (HDP'04) June 30-July 3Shanghai, China20% over th International Electronics Manufacturing Technology Symposium (IEMT, collocated with SEMICON West) July 14-16San Jose, CA, USA50%/50%

Summary of 2004 Conferences Conference TitleTimeLocationSponsorship Polytronic 2004: 4th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics September 12-15Portland, OR, USA50%/50% 2004 IEEE Holm Conference on Electrical Contacts (HOLM) September 20-23Seattle, WA, USA100% 7th VLSI Packaging Workshop of Japan (VLSI Pkgng) November 30 - December 2 Kyoto, Japan20% over 100 6th International Conference on Electronic Materials & Packaging (EMAP) December 5-7Penang, Malaysia20% over 100 6th Electronics Packaging Technology Conference (EPTC'04) December 8-10Singapore(under negotiation)

2003 Conferences not in the 2004 List Conference TitleTimeLocation International IEEE Conference on the Business of Electronic Product Reliability and Liability (EPRL) January 13-14Shenzhen, China International Conference on Electronic Packaging (ICEP)April 16-18Tokyo, Japan Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)May 5-7Cannes, France Inter-Society Packaging Conference (InterPACK)July 6-11Maui, Hawaii, USA 9th International Workshop on Thermal Investigations of ICs & Systems (Therminic) September 24-26Aix-en-Provence, France IEEE International Symposium on Semiconductor Manufacturing (ISSM) September 30- October 2 San Jose, CA, USA IEEE Electrical Performance of Electronic Packaging (EPEP)October 27-29Princeton, NJ, USA 5th International Conference on Electronics Packaging Technology (ICEPT) October 28-30Shanghai, China

CPMT Sponsorship for 2005 Onwards Following is a relatively brief proposal for a simplified Conference financial relationship scheme that Marsha and I have put together after incorporating the inputs of Jim Morris (Past VP, Conferences), Paul Wesling (VP, Publications) and Ricky Lee (VP Conferences). We want to keep this very simple and offer very few options for consideration by the conferences. Since the CPMT began implementing the new policy requiring a financial relationship with all its conferences, considerable ill-will has been generated in Regions 8 (Europe, Middle East, Africa) & 10 (Asia/Pacific) which could potentially compromise our globalization efforts. Issues that have come up from Regions 8 & 10 include : - Some cultures feel that conferences should not make money and surpluses should be zero. - Some countries do not allow surpluses to be returned to IEEE in the US. - Conferences feel CPMT is interfering; trying to take control. - Conferences don't see value CPMT provides The following approach would go into place as we abolish the "technical sponsor only" category. ADVANTAGES: - Simple to understand and administer. - Minimizes issue of sending "payment" to US/IEEE; paying fees/expenses less controversial. - Helps to ensure offset of expenses to CPMT. Comments on this proposal are welcomed. This proposal does not require Board vote but certainly warrants a period of open discussion and is open for constructive changes. Once we are done we will run this by you again with $xxx inserted as real proposed fees.

CPMT Sponsorship for 2005 Onwards OPTION #1: Traditional Financial Co-sponsorship - CPMT shares percentage of surplus. - Must budget a surplus of 15% (or other amount to be decided) - CPMT (and IEEE) must review and approve budget - Minimum percentage of financial sponsorship 25% OPTION #2: Administration Fee #1 (Option 2-1) - $XXX Franchise Fee for use of CPMT name and logo and expenses associated with conference publications acquisition. (TBD) - Includes access to CPMT mailing list (at fee charged independently by IEEE Conference Services; as per current process.) - Includes promotion by CPMT in Newsletter, on Home Page, etc. - Includes acquisition of Conference Proceedings for inclusion IEEE Xplore - Fee included as expense in budget Conference budget. - No CPMT budget approval needed. Administration Fee #2 (for conferences with no proceedings ) (option 2-2) - $XXX Franchise Fee for use of CPMT name and logo (TBD; flat fee suggested.) - Includes access to CPMT mailing list (at fee charged independently by IEEE Conference Services; as per current process.) - Includes promotion by CPMT in Newsletter, on Home Page, etc. - Fee included as expense in conference budget. - No CPMT budget approval needed.

2005 Conferences for Approval Motion #1: To approve 100% sponsorship of the 1st Workshop on Display Materials: Selection, Behavior, Performance (DM’2005), tentatively scheduled for April 2005, Santa Cruz, CA. Endorsed by Materials TC Chairs: Ephraim Suhir, University of California at Santa Cruz., and Designed Nanomaterials (DNM), Inc., Los Altos, CA Bernd Michel, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany S.T. Lee, City University of Hong Kong, Kowloon Tong, Kowloon, Hong Kong Content: The objective of the Workshop is to address the state-of-the-art, technical advances and hurdles, application trends and the major unsolved materials related problems in small and large display technologies, with an emphasis on the selection, characterization, and short- and long-term performance of the employed materials. It will be the first comprehensive and multifaceted symposium on the functional (optical and electrical), mechanical and environmental behavior and performance of materials used in display technologies. The symposium will provide a forum to discuss the materials behavior and performance in various types of displays: liquid crystal displays (LCDs), organic light emissive devices (OLEDs), organic electroluminescent displays (OELEDs), flexible displays (FOLEDs and FOELEDs), and other possible types of flat panel displays. We intend to bring together materials, mechanical, optical, electrical, reliability, industrial and manufacturing engineers, as well as applied physicists and chemists, to discuss and advance experimental and theoretical methods, techniques and approaches aimed at the understanding the materials behavior in, and mechanical (physical) design, packaging, and reliability evaluations and optimization of, display assemblies, structures and systems.

2005 Conferences for Approval Motion #2: To approve 50% co-sponsorship of the First International Workshop on 3S Electronic Technologies, cosponsored by GaTech PRC, tentatively scheduled for Fall 2005, Atlanta, GA. Approved by Systems Packaging TC Chair: Rao R. Tummala, PRC, Georgia Institute of Technology Content: This workshop reviews the latest R&D and manufacturing status of each of the three electronic technologies (SOP, SIP, SOC) around the world. It will also attempt to compare and contrast SOC, 3D stacking, SIP, SOP and MCM. Motion #3: To approve 50% co-sponsorship of the Organic Microelectronics, cosponsored by the American Chemical Society tentatively scheduled for April 2005, in the northeastern US. Approved by Materials TC Chair: TBD Content: This workshop focuses on electroactive microelectronic organic materials and applications. This would include light emitting materials for displays, semiconducting materials for transistors and circuits and photoactive materials for photovoltaics. These would be all invited papers and would bring together the worlds experts in this area