1. WELCOME TO M&P TC MEETING Materials & Processes Technical Committee Meeting May 27, 2015, Wednesday 7:00 - 8:00 AM Room 511, Sheraton San Diego Hotel & Marinna

2. Agenda Introduction All CPMT M&P TC Chair/vice-chair M J Yim TC Activities 2015-2016 & Monthly newsletters M J Yim ECTC M&P Subcommittee Diptarka Majumdar/Bing Dang IEEE CPMT Advanced Packaging Materials (APM) Symp. 2016 Other Conferences and activities Open for anything else Attendees (in random order): Eric Perfecto, Diptarka Majumdar, Bing Dang, Kwang- Lung Lin, C.R. Kao, Tanja Braun, Yoichi Taira, M. J. Yim (chair), Jim Morris, Bill Chen, Chin C. Lee (past Chair), Rama & Kimberly (visit from Brewer Science).

3. http://cpmt.ieee.org/technology/105-tc-materials-a-processes-.html 2015-16 CPMT TC Chair/Vice Chair Chair MJ Yim (Intel) Vice-chair Dongwook Kim (Qualcomm) TC – M&P chair/vice-chair webpage updated by Marsha Past ChairCC Lee (UC Irvine) Past Vice-chair Daniel Lu (Henkel China)

4. 2015-16 CPMT M&P Committee CPMT M&P TC Member list (as of 2015) USA: 25 Taiwan: 3 China: 3 Japan: 3 Germany:1 Korea: 1 Singapore: 1 Total: 37 By 2015: >45 By 2016: >50 Increase committee member Increase more Asia/Europe member

5. Communications: A newsletter that covers all the news related to Materials. The Chair, Vice Chair, and Executive Committee members routinely communicate through e-mail and telephone. General membership receives announcements for conferences, workshops and symposia. The highlights of the Materials Conference are summarized in the CPMT newsletter. Meetings: TC-5 Committee meets every year during the ECTC Annual Meeting. TC-5 Committee will try to meet once a year outside of US. The committee chair communicates with the Board of Governor. The TC chair attends special meetings called by the TC Vice President to determine the future roadmap of the society. A teleconference call or material webinar will be conducted when warranted. Web Assets : http://sites.ieee.org/cpmt-tc5/ The site is primarily used for general announcements, committee newsletters and conference details.http://sites.ieee.org/cpmt-tc5/ Conferences: Materials-related sessions during ECTC (TC-5 sponsors) International Materials Conference (IEEE-CPMT (TC-5) co-sponsors) held every alternate year International conferences on specific Materials (from time to time) (TC-5 sponsors) International Conference on Electronic Materials and Packaging – every year in Asia (rotates between Singapore, South Korea, Japan) Publications: The Proceedings of Electronic Components and Technology Conference The Proceedings of Materials Conference (TC-5 co-sponsors) The Transactions of CPMT – TC-5 contributes the technical papers, reviews potential papers for publication and acts as associate editors The proceedings of Electronic Materials and Packaging (TC-5 co-sponsors) Collaborative Efforts: Actively collaborating with IMAPS, American Ceramic Society, American Society of Metals, Society of Plastic Engineers and Materials Research Society There is a new push to start new collaborative international events. Volunteers : TC-5 has approximately 50 volunteers each year (37 as of 2015 list), consisting of the Executive Committee, the conference officers, the session chairs, paper reviewers and associate editors. TC-5 will try to reach out to international members by holding the technical committee meeting once outside of US. 2015-16 M&P TC Committee Activities Current activities/formats written in TC-5 webpage

6. CPMT-M&P News Letter Status MJ Yim CPMT-M&P TC Web Administrator

7. 2015 --- (To be uploaded from Ning Cheng Lee @Indium) 2014 October 2014 News Letter Microstructure variation – electric currentMicrostructure variation – electric current (Kwang-Lung Lin @ National Cheng Kung Univ.) Sept 2014 News Letter CPMT MP TC Newsletter Sept 2014-Micro pillar compression 2014CPMT MP TC Newsletter Sept 2014-Micro pillar compression 2014 (C. R. Kao @ National Taiwan Univ.) May 2014 News Letter CPMT MP TC Newsletter May 2014 DW KIM – FinalCPMT MP TC Newsletter May 2014 DW KIM – Final (DW Kim @ Qualcomm) 2013 December 2013 News Letter Silver flip-chip technology posterSilver flip-chip technology poster (CC Lee @UC Irvine) November 2013 News Letter 2013_Saint-Venant_CPMT_Materials_TC_1206132013_Saint-Venant_CPMT_Materials_TC_120613 (E. Suhr @Portland State Univ.) October 2013 News Letter IEEE CPMT-TC5 Materials and Process-MJ Yim-Oct-Newsletter-2013IEEE CPMT-TC5 Materials and Process-MJ Yim-Oct-Newsletter-2013 (MJ Yim @Intel) August 2013 News Letter CMPT MP TC Newsletter Aug 2013 (Paik)CMPT MP TC Newsletter Aug 2013 (Paik) (KW Paik@KAIST) Need more contribution from M&P members on monthly newsletter to facilitate networking and sharing. => Bimonthly or Quarterly newsletter Need volunteer for web administrator from members. Uploaded Newsletter and Contributors

8. 2015 ECTC: M&P Subcommittee ChairDiptarka Majumdar/Bing Dang Number of abstract submissions receivedPrimary89 Secondary82 Number of abstracts accepted for presentationOral35 Poster15 SessionsChairDateTime Adhesives, Underfills, TIMsLejun WangMay 278:00 AM Tieyu Zheng Novel Materials & ProcessesIvan ShubinMay 291:30 PM Mikel Miller 3D Materials & ProcessingMyung Jin YimMay 281:30 PM Bing Dang Solders & BondingKwang-Lung LinMay 298:00 AM Dwayne Shirley SubstratesDong Wook KimMay 271:30 PM Frank Wei

9. IEEE CPMT Advanced Packaging Materials (APM) Symp. 2016 Conflict in 2015 with major packaging events in China Decided to push out to 2016. Time/date is TBD, but Shenzhen or Suzhou is recommended for hosting place. Tim Chen will be general chair. 17 th Int’l Conference on Electronic Materials and Packaging (EMAP) 2015 Sept 1, Sept. 4, 2015 Portland State Univ., Portland, OR, USA. Prof. Sung Yi is general chair.