1. Report of Technical Vice President Rolf Aschenbrenner IEEE CPMT BoG, Dallas, Nov. 2004

2. Technical Committees Currently 18 „active“ Technical Committees TC-Opto Fiber Optics and Photonics New TC Chair: Dr. Sue Law, Australian Photonics /OFTC TC-Assy IC and Package Assembly Vacant

3. TC-DIP: Len Schaper is convinced that there is no need for an own CPMT committee on Discrete and Integral Passives and would like to step down as a chair 12 TC web pages are up to date Little feedback about TC activities after two inquiries by mail Technical Committees

4. Technical CommitteeActivities 2004Activities planned for 2005 TC-M Materials TC Chair: Rajen Chanchani r.chanchani@ieee.org TC-M sponsored conferences - Advanced Packaging Materials Conference, Atlanta, March 24 - 26 - Polytronic 2004, Portland, Sept. 12 – 15 - 2004 International Symposium on Electronic Materials and Packaging (EMAP 2004), Penang, Malaysia, Dec. 5 – 7 Successful TC-M meeting at ECTC, Las Vegas, June 3 -14 attendees - Discussed topics: concerns over the long turn- around time for Transactions publications; the future Packaging Materials Conference TC-ASTR Accelerated Stress Testing and Reliability TC Chair: Mark Gibbel mark.gibbel@jpl.nasa.gov TC-Opto Fiber Optics & Photonics TC Chair: Sue Law s.law@oftc.usyd.edu.au TC-Test Electrical Tests TC Chair: Bruce Kim Bruce.Kim@asu.edu - few activities - plan to update the webpage - work with workshops

5. Technical CommitteeActivities 2004Activities planned for 2005 TC-EDMS Electrical Design, Modeling and Simulation TC Chair: Madhavan Swaminathan madhavan.swaminathan@ee.gatech. edu Workshops technically sponsored by TC EDMS: - Signal Propagation on Interconnects (SPI), Heidelberg, May - Future Directions in IC and Package Design (FDIP), Portland, Oct.. - Electr. Performance of Electronic Packaging (EPEP), Portland, Oct. - Electrical Design and Advanced Packaging of Systems (EDAPS), Kyoto, Nov. Other activities: - Yearly TC-EDMS meeting, Portland, Oct. 24 - Initiating a standardization sub-committee for package power distribution led by Ravi Kaw (Agilent), Kickoff meeting Oct. 24 - Initiating a standardization sub-committee for package IBIS and driver macro-modeling led by Paul Franzon (NC State), Kickoff meeting, Oct. 24 Workshops sponsored by TC-EDMS: - SPI - FDIP - EPEP - EDAPS, Bangalore, India, Nov (financial sponsorship needed from CPMT) TC-Therm Thermal Management and Thermo-Mechanical Design TC Chair: Tony Mak t.mak@ieee.org - TC-Therm meeting at the ECTC, Las Vegas TC-Ed Education TC-Chair: Rao Tummala rao.tummala@ee.gatech.edu - TC-Ed session is sponsored at the 54th ECTC- One TC-Ed session is planned for the 55th ECTC

6. Technical CommitteeActivities 2004Activities planned for 2005 TC-ECCC Electrical Contacts, Connectors and Cables TC Chair: Jerry Witter g.witter@ieee.org TC-DIP Discrete and Integral Passives TC Chair: Leonard W. Schaper schaper@uark.edu - no activities - work relationship with CARTS broke away - IMAPS and IPC are doing workshops on integrated passives, so there is no need for CPMT to have its own committee - Len Schaper would like to step down as chair if a successor could be fournd - Possibility: CPMT Components Committee is declared ECTC Components & RF Committee TC-Assy IC and Packaging Assembly TC Chair: Vacant TC-HDSB High Density Substrates and Boards TC Chair: Yoshitaka Fukuoka weisti.fukuoka@rose.zero.ad.jp - System Packaging Japan Workshop technically associated by TC-HDSB, Hakone, February - TC-HDSB Committee Meeting, Las Vegas, June - Plenary session in conjunction with 2004 ECTC as small workshop of TC-HDSB, Las Vegas, June - TC-HDSB Committee Meeting, Tokyo, August - Plenary Session in conjunction with 2005 ECTC as small workshop of TC-HDSB, Orlando, June TC-MEMS MEMS and Sensor Packaging TC Chair: Erik Jung erju@izm.fhg.de - TC-MEMS committee meeting at the ECTC, Las Vegas, June and at the DTIP in Montreux, June - For the ECTC a subcommittee has especially been created concerning the topic MEMS Packaging - An event especially supported by the TC- MEMS is planned to take place at an international meeting

7. Technical CommitteeActivities 2004Activities planned for 2005 TC-NANO Nano Packaging TC Chair: Rao Tummala rao.tummala@ee.gatech.edu - TC-NANO meeting at the ECTC, Las Vegas TC-PEP Power Electronics Packaging TC Chair: Douglas Hopkins d.hopkins@ieee.org - TC-PEP is regrouping - Tried to find support for a 3rd bi-annual workshop on power packaging, but found little support TC-RF+W RF and Wireless TC Chair: Craig A. Gaw c.a.gaw@ieee.org - Primary activity (during the past years as well): work with ECTC‘s Components & RF committee to increase the number of submissions to ECTC in the RF & microwave area, TC-RF+W put out a call for papers for an ECTC session focused on „RF & Microwave Component-Like Modules“; increased submissions during the past years For the first time the „Components & RF“ subcommittee and TC-RF+W was given 3 sessions at the ECTC 2004 - durng the past years joint meeting at ECTC of TC- RF+W and the ECTC „Components & RF“ committee to plan the next ECTC conference (10- 12 attendees) -TC-RF+W co-chair, Manos Tentzeris, has presented a short –course on RF & microwave packaging at the ECTC for the past several years TC-SP Systems Packaging TC Chair: Erich Klink eklink@de.ibm.com - 2004 IEEE Systems Packaging Japan Workshop, 2/2 – 2/4 - 2005 IEEE Systems Packaging European Workshop (1/31-2/2) - 3s Workshop, Atlanta, Sept.

8. Technical CommitteeActivities 2004Activities planned for 2005 TC-WLP Wafer Level Packaging TC Chair: Michael Töpper michael.toepper@izm.fhg.de - TC-WLP meeting at the ECTC - Call for the special WLP section in the Transactions IEEE-CPMT „Advnced Packaging“ planned for 2005 will be publsihed Q4/2004 - Special WLP section in the Transactions IEEE- CPMT Advanced Pacakging - TC-WLP meeting at the ECTC 2005 - Workshop WLP TC-EM Electronics Manufacturing TC Chair: Walter J. Trybula w.trybula@ieee.org TC-EM has supported the following activities: - ECTC conference (professional development courses were offered during the meeting with TC-EM people teaching one of them) - IEMT conference, San Jose, July, was held in conjunction with SEMI (professional development courses were offered during the meeting with TC-EM people teaching one of them) - IEEE Litho Workshop, Whistler, July TC-GEMP Green Electronics, Manufacturing and Packaging TC Chair: Hansjörg Griese griese@izm.fhg.de - Asian Green Electronics Conference IEEE/CPMT, Invited Talk and Tutorial, Hong Kong, Shenzen, China, January - ISEE 2004, IEEE/CS, Phoenix, USA - Magel 2004, June, La Rochelle, France - PB Free Summit, IEC, April, Geneva, Schwitzerland - HDI 2004 IEEE/CPMT, July, Shanghai, China - Workshop EcoDesign, Jan., Wuxi, China - Electronic Goes Green 2004, Sep., Berlin, Germany - FED-Congress, Sept. 04, Neu-Ulm, Germany - Europe Electronic Technology Colloquium, March, Polonia, Spanien - IPC/JEDEC Lead-Free Electronics Conference, Oct., Frankfurt, Germany - Intl. Symposium on Remanufacturing and EcoDesign, Oct., Seoul, Korea - Conf. on Business Impacts of WEEE and RoHS, Oct. Singapore - TC Meeting at EGG 2004, Sept. Berlin - Asian Green Electronics Conference IEEE/CPMT, Invited Talk and Tutorial, Shanghai, China, March - ISEE 2005, IEEE/CS, New Orleans, USA - Environmental Congress, Tokyo, Japan - Workshop EcoDesign, Wixi, China - Workshop at Electronica/Productronica/Semicon, Shanghai, China - ECO DESIGN 2005 IEEE/CPMT, Tokyo, Japan, Dec., - Tutorial - TC Meeting: 12/06/04 at ECO DESIGN, Tokyo

9. TC-M MaterialsECTC, Las Vegas TC Therm Thermal ManagementECTC, Las Vegas, and Thermo-Mechanical Design TC-HDSB High Density SubstratesECTC, Las Vegas, and Boardsand Tokyo, August TC-MEMS MEMS and Sensor PackagingECTC, Las Vegas and DTIP, Montreux Annual TC Meetings

10. TC-Nano Nano PackagingECTC, Las Vegas TC-RF+W TC RF and WirelessECTC, Las Vegas TC-WLP Wafer Level PackagingECTC, Las Vegas TC-EDMS Electrical Design,Portland, October Modeling and Simulation TC-GEMP Green Electroncis,EGG 2004, Berlin, Sept. Manufacturing and Packaging

11. Motion In case that a new topic comes up it should not directly be transformed into a technical committee but become a task force for the first three years. If the task force results to be successful a decision should be taken whether the task force becomes a technical committee or not.

12. Mr. Griese from the NEMI Roadmap Committee Environmentally Concious Electronics presented a 48 paper report about the actual situation of the activities Len Schaper from the NEMI Roadmap Committee Passive Components reported no recent involvement with the NEMI effort due to lacking funding Erik Jung from the NEMI Roadmap Committee Packaging reported a first draft in order to incorporate companies into the NEMI Roadmap Nemi Activities