Discoloration of Passitivation

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Presentation transcript:

Discoloration of Passitivation Before wire bonding Discoloration of passitivation under wire bonds occur during wire bonding process. With old UCSB TOB bond shapes, it occurs under both channel and bias bonds With different bond geometries, discoloration smaller/bigger It is not clear what this discoloration is caused by, if it is potentially dangerous, or if it will get worse with time Dots and metal lines do not appear with bonding only; appears to be HV effect After wire bonding Bias Ring Guard Ring

Channel Bonds After wire bonding, the channel wires have divots that match to locations of passitivation edges on sensor Bonds looked at previously looked more pocked. Not clear if caused by powering module for ~8 hours

FNAL vs. UCSB FNAL UCSB FNAL bonds towards back of bond pad UCSB bonds towards front of bond pad Strength of discoloration appears to be correlated with nearness of bond feet and height of bond wire New bond shapes result in much less discoloration