1. Updates on the Silicon Tracker 2S Module
1,4 mm & 4,0mm
versions

2. Previous CAD models used as a starting point

3. Previous 4,0mm module
Previous 1,4mm module

4. Issues with previous models

5. Previous 1,4 mm module
Sensors
Difference in distance between hybrid board and sensors causes issues with wire bonding; difficult, poor reliability
Hybrid Board
Previous 4,0 mm module
Hybrid Board
Sensors

6. Main Changes

7. To bring sensors to equal distance from hybrid board, new contact pads are used

8. Upper sensor
Hybrid Board
’S-shaped’ contact pads allow sensors to be distanced evenly relative to hybrid board
Lower sensor
Contact pad for 1,4mm module
Contact pad for 4,0mm module

9. Other additions

10. A new layer of Kapton was added to insulate high voltage sensor surface from PGS, it extends over the edges of the sensors
¡High voltage surfaces!

11. A strip of Kapton tape underneath the contact pads helps minimize the distance needed between pads and sensors..

12. Modelling and materials

13. Modules with different distances between sensors share most components
Main idea:
Modules with different distances between sensors share most components
4,0mm Bridge Assmebly
Main difference between 4,0mm and 1,4 mm version is the ’Bridge Assembly’
1,4mm Bridge Assmebly

14. Possible changes to the ’Bridges Assembly’
If we use TPG for the bridge stiffener, do we need the PGS layer between stiffeners and sensors?

15. Main contributors to over all weight
Item
Weight in grams
Sensors
9.02
Frame
7.74
Hybrid Boards
3.24
Optolink (on service board)
3.00
Contact Pads
2.21
DC-DC Converter (on service board)
2.07
PGS Layers
0.54
ASICs (on hybrid boards)
0.46
Connector 16-pin (on service board)
0.29
Screws
0.28
High Voltage related (Kaptons)
0.19
Main contributors to over all weight
Complete module weight estimated to be 29,03 grams

16. Small changes possible to save weight / reduce material costs..

17. Two 2s Module types studied: 4,0mm module for end cap geometry, 1,4mm for barrel geometry
Changes made to facilitate wire bonding
Danger of discharges from high-voltage surfaces minimized
Still to be resolved: Choice of materials for the Bridge Assembly i.e. just TPG or with PGS..
Need feedback from thermal and stuctural DEA study on this configuration
Summary

18. We’ll start modelling a complete rod for the models, try positioning + cooling contact layouts
First quotations from TPG suppliers received, waiting for samples..
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