1. First UCSB TEC Module (Pictures)

2. First UCSB TEC Module (Bias Ring)
Due to angle and height differences, it is difficult to bond the bias return between PA and sensor.
Nearby channel #512 bond limits bonding space

3. First UCSB TEC Module (Noise)
Faults
Two sensor opens
Channel 27
PH sensor DB
Channel 408
PH due to bonding
Bonding fixture needs slight fine tuning to hold securely
Channel 302
Open APV-PA
One Sensor opens
Channel 306
Noisy
Channels 407,409
Due to PH in bonding
Grade B (1.1% bad channels)

4. First UCSB TEC Module (Charge Injection)

5. First UCSB TEC Module (IV)
Slightly than higher bias current due to pinhole formed during bonding