Test Slab Status CALICE ECAL test slab: what is it all about?

Slides:



Advertisements
Similar presentations
Maurice Goodrick & Bart Hommels, University of Cambridge WP2.2 - Study of data paths on ECAL Slab Paths between VFE Chips and the FE Chip : Clock and Control.
Advertisements

Maurice Goodrick & Bart Hommels, University of Cambridge ECAL SLAB Interconnect Making the interconnections between the Slab component PCBs (“ASUs”) is.
11 May 2007UK DAQ Status1 Status of UK Work on FE and Off-Detector DAQ Paul Dauncey For the CALICE-UK DAQ groups: Cambridge, Manchester, Royal Holloway,
Terra-Pixel APS for CALICE Progress meeting 10 th Nov 2005 Jamie Crooks, Microelectronics/RAL.
David Bailey Manchester. Summary of Current Activities UK Involvement DAQ for SiW ECAL (and beyond) “Generic” solution using fast serial links STFC (CALICE-UK)
The first testing of the CERC and PCB Version II with cosmic rays Catherine Fry Imperial College London CALICE Meeting, CERN 28 th – 29 th June 2004 Prototype.
29 January 2004Paul Dauncey - CALICE DAQ1 UK ECAL Hardware Status David Ward (for Paul Dauncey)
1 Design of the Front End Readout Board for TORCH Detector 10, June 2010.
ECAL electronics Guido Haefeli, Lausanne PEBS meeting 10.Jan
Upgrade developments in Clermont-Ferrand Romeo Bonnefoy and François Vazeille Tilecal upgrade meeting (CERN, 13 June 2014) ● Handling tools ● Deported.
CALICE – 12/07/07 – Rémi CORNAT (LPC) 1 ASU and standalone test setup for ECAL MAIA BEE project Overview DAQ dedicated Sensor test In situ debug and maintenance.
Development of Readout ASIC for FPCCD Vertex Detector 01 October 2009 Kennosuke.Itagaki Tohoku University.
Mathias Reinecke CALICE meeting Argonne EUDET module – Electronics Integration Contents -Next prototype : architecture -HCAL Base Unit (HBU)
CALICE meeting Prague 2007, Hervé MATHEZ 1 DHCAL PCB STUDY for RPC and MicroMegas (Electronics recent developments for the European DHCAL) William TROMEUR,
21 January 2003Paul Dauncey - UK Electronics1 UK Electronics Status and Issues Paul Dauncey Imperial College London.
Maurice Goodrick, Bart Hommels 1 CALICE-UK WP2.2 Slab Data Paths Plan: – emulate multiple VFE chips on long PCBs – study the transmission behaviour.
Leo Greiner IPHC meeting HFT PIXEL DAQ Prototype Testing.
Bart Hommels Univeristy of Cambridge EUDET Annual Meeting, Ecole Polytechnique, Paris JRA3: DAQ Overview Objectives System Overview Status of.
Questions on IFPAC_SCHEMATIC. Signal Chain Preamplifier Compensation Capacitor should go to –Vs, not GND Where is resistor For compensation Network? Does.
PROGRESS ON ENERGY SUM ELECTRONIC BOARD. VXS Backplane Energy Sum 18 fADC VME64 High Speed Serial VME64 16 CH Detector Signals Crate Sum to Trigger Energy.
1 10 th October 2007Luciano Musa Considerations on readout plane IC Area (die size) 1-2 mm 2 /channel Shaping amplifier 0.2 mm 2 ADC0.6 mm 2 (estimate)
TEL62 status and plans Elena Pedreschi INFN-Pisa Thursday 08 September 2011 TDAQ WG Meeting at Mainz University.
Mathias Reinecke CALICE week Manchester DIF development – Status and Common Approach Mathias Reinecke for the CALICE DAQ and Front-End developers.
Towards a 7-module Micromegas Large TPC prototype 1 D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, M. Dixit, A. Le Coguie, R. Joannes,
Maurice Goodrick, Bart Hommels EUDET Annual Meeting, Ecole Polytechnique, Paris EUDET DAQ and DIF DAQ overview DIF requirements and functionality.
L.Royer – Calice Manchester – Sept A 12-bit cyclic ADC dedicated to the VFE electronics of Si-W Ecal Laurent ROYER, Samuel MANEN LPC Clermont-Ferrand.
LCWS Apr 2004Paul Dauncey - CALICE Readout1 CALICE ECAL Readout Status Paul Dauncey For CALICE-UK electronics group: A. Baird, D. Bowerman, P. Dauncey,
Terra-Pixel APS for CALICE Progress meeting 10 th Nov 2005 Jamie Crooks, Microelectronics/RAL.
Julie Prast, Calice Electronics Meeting at LAL, June 2008 Status of the DHCAL DIF Detector InterFace Board Sébastien Cap, Julie Prast, Guillaume Vouters.
1 19 th January 2009 M. Mager - L. Musa Charge Readout Chip Development & System Level Considerations.
Maurice Goodrick, Bart Hommels CALICE-UK Meeting, Cambridge CALICE DAQ Developments DAQ overview DIF functionality and implementation EUDET.
DHCAL Jan Blaha R&D is in framework of the CALICE collaboration CLIC08 Workshop CERN, 14 – 17 October 2008.
HaRDROC performance IN2P3/LAL+IPNL+LLR R. GAGLIONE, I. LAKTINEH, H. MATHEZ IN2P3/IPNL LYON M. BOUCHEL, J. FLEURY, C. de LA TAILLE, G. MARTIN-CHASSARD,
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
AHCAL Electronics. Status of Integration Mathias Reinecke for the DESY AHCAL developers AHCAL main and analysis meeting Hamburg, July 16th and 17th, 2009.
1 Status Report on ADC LPC Clermont-Ferrand Laurent ROYER, Samuel MANEN Calice/Eudet electronic meeting London 2008.
SKIROC status Calice meeting – Kobe – 10/05/2007.
SiW Electromagnetic Calorimeter - The EUDET Module Calorimeter R&D for the within the CALICE collaboration SiW Electromagnetic Calorimeter - The EUDET.
Marc Anduze first drawings of Ecal eudet module COPIED FROM : Marc Anduze PICTURES FROM : CALICE/EUDET electronic meeting – CERN – 12 July 07.
MADEIRA Valencia report V. Stankova, C. Lacasta, V. Linhart Ljubljana meeting February 2009.
DHCAL Acquisition with HaRDROC VFE Vincent Boudry LLR – École polytechnique.
PADME Front-End Electronics
Setup for automated measurements (parametrization) of ASD2 chip
A 12-bit low-power ADC for SKIROC
A General Purpose Charge Readout Chip for TPC Applications
ECAL front-end electronic status
CALICE DAQ Developments
14-BIT Custom ADC Board Rev. B
Calorimeter Mu2e Development electronics Front-end Review
Large Area Endplate Prototype for the LC TPC
GTK-TO readout interface status
Status of the Beam Phase and Intensity Monitor for LHCb
Status of the DHCAL DIF Detector InterFace Board
FMC adapter status Luis Miguel Jara Casas 5/09/2017.
Power pulsing of AFTER in magnetic field
C. de La Taille IN2P3/LAL Orsay
FEE Electronics progress
Front-end digital Status
EMC Electronics and Trigger Review and Trigger Plan
CALICE/EUDET Electronics in 2007
VELO readout On detector electronics Off detector electronics to DAQ
prototype PCB for on detector chip integration
UK ECAL Hardware Status
SKIROC status Calice meeting – Kobe – 10/05/2007.
HaRDROC status: (Hadronic RPC Detector Read Out Chip for DHCAL)
FEE Electronics progress
HaRDROC status: (Hadronic RPC Detector Read Out Chip for DHCAL)
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
First thoughts on DIF functionality
SVT detector electronics
Presentation transcript:

Test Slab Status CALICE ECAL test slab: what is it all about? Current slab status Outlook and plans 12-07-2007 CALICE Electronics, CERN

Test Slab Overview clock, controls, power data ~1500mm very front-end (VFE) chips sensors front-end (FE) board + chip Single side of a slab Investigate signal transmission over slab lengths over 1.5m clock, data, fast & slow control signals Try to estimate limits imposed by the slab PCB clock distribution, data rate, power consumption Gain experience with the current readout architecture 12-07-2007 CALICE Electronics, CERN

Test Slab Design Thin PCB, <800 mum, 8 copper layers Parallel striplines for differential signal transmission Inter-Panel Bridging Pads Straightforward panel-panel connections Many options for signal routing and readout architectures Mounting Rail Alignment Pins 12-07-2007 CALICE Electronics, CERN

Test Slab Setup slab panel 0: terminator board: resistors + wire bridges slab panel 0: FPGA chips emulating 2 front-end chips each Long, folded PCB traces for pulse transmission measurements End-Of-Slab board: Commercial Starter Kit board FPGA with Rx firmware Clock generators Connection to PC (ethernet) Measurement control firmware intermediate board: power regulators and distribution towards slab panel programmable clock distribution scheme and clock drivers 12-07-2007 CALICE Electronics, CERN

Current Slab Status Bit Error Rate automated measurement pulse transmission along 1.8m folded tracks: v = 0.4*c, attenuation = 20% (2 dB) Bit Error Rate automated measurement resolution of 10-5 dummy wires vs. loop-back slab traces including clock distribution system latest: with external DHCAL pVFE 12-07-2007 CALICE Electronics, CERN

Current Slab Status II & Plans Implemented DHCAL VHDL in slab FPGA N=1 OK, N=2 OK, now N=N+1 Extend setup by adding slab panels Determine transmission speed limits on PCB traces Investigate power consumption for transmission paths along full slab length, both for CMOS and LVDS Implement/study alternative readout architecture 12-07-2007 CALICE Electronics, CERN