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FEE Electronics progress

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Presentation on theme: "FEE Electronics progress"— Presentation transcript:

1 FEE Electronics progress
Mezzanine manufacture progress FEE64 testing and VHDL progress 4th December 2009

2 Mezzanine manufacture Progress
PCB manufacturer delayed through the processing due to technically challenging design. Shipped 20 to assembler ( Patronics Ltd ). 15 assembled boards delivered to DL 2/12/09. 5 assembled boards failed final quality control at Patronics. Pads had lifted after re-work. After visual inspection at DL. 10 OK for use. 1 broken track and lifted resistor 1 solder whisker between resistors ( can repair ) 3 solder on ASIC pads Assembled to copper block and found a component fouled. Mechanical workshops removing 0.2mm copper to solve the problem. Creating 5 kits with mezzanine card, mounting pins and copper block with heat conducting foam pad in place for despatch to RAL. 4th December 2009

3 FEE64 testing and VHDL progress
MIDAS control and acquisition system is under development as the VHDL evolves. Spectra taken from all four Mux readout ADCs with reference and input ground. FWHM of 3 channels. 4th December 2009

4 Clock distribution No further work has taken place.
Pcb layout to proceed after VHDL for acquisition complete. Designed for manufacture locally. Master SYNC to clock box FEE64 (sync master) Clock box FEE64 FEE64 FEE64 200Mhz clock and SYNC distribution 4th December 2009


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