Gluing jigs for Demonstrator

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Presentation transcript:

Gluing jigs for Demonstrator Kari Lovise Ness, Diego Alvarez Feito, Susanne Kuehn, Maurice Marcel, Jordan Degrange CERN EP-DT-EO Demonstrator Heater Discussion CERN, 20.09.17

Positioning of silicon and flex 3 main items Positioning of silicon Positioning of flex Vacuum pickup tool 3D-printing and machining Vacuum pickup tool Silicon positioning Flex positioning

Positioning of silicon Positioning with three pins Positioning of silicon with vacuum pen Vacuum on Pick up with vacuum tool

Positioning of flex Positioning with two pins Positioning of flex with two pins In place by vacuum holes

Gluing Dots of glue Tape in areas with wire-bonding 8 hours curing UHU Endfest Tape in areas with wire-bonding PPI Tape 8 hours curing

Wire-bonding Remove frame Wire-bond jigs

Wire-bonding Pitch 80mm

Potting, transport and bending Proposal to do potting with Dymax 9001.v3.1 and bending of flex at CERN 100 transport frames in production in Bonn With space for connecting the readout board for testing

Next Test with heater and flex and flex dummies Assembled one real to validate tooling Check with company for production of 4(?) sets of tooling to distribute Distribute: tooling and dummy components

Procedure The steps for the heater assembly are: Clean jigs with isopropanol, prepare glue UHU Endfest 300 www.uhu- profishop.de/downloads/dl/file/id/190/technisches_merkblatt_uhu_plus_endfest_300.pdf, prepare tape Tape PPI 577RF (http://www.ppitapes.com/data_sheets/RD-577.pdf) Weight parts Position flex on jig (wire-bond pads touch surface of jig), vacuum on. Place tape on flex. Position bare heater on jig, vacuum on. Pick-up heater with pick-up tool. Can be place in mount. Put glue dots on flex. Remove 2nd foil from tape (min. 5 min waiting after placement) . Place heater on flex. Put weight on pick-up tool during curing. Curing (~8h), vacuum off for heater, for flex vacuum still on until curing done. Cutting of flex frame if needed for wire-bonding, alternatively keep frame. Wire-bonding. Transport. Potting Bending after cell assembly.