2. Module mounting possibilities (FDR and module task force proposals) & Module mounting status at Dortmund Daniel Dobos, University of Dortmund 05.03.03 – E4 ATLAS-/Si-Meeting

3. Module mounting structure bare module probing ● FE probing - 2 h ● sensor probing - 10 min flex hybrid - tested at Oklahoma test MCC ? - few min or tested at DELTA assembled module test - 3 h glue pigtail to flex hybrid 30 min + 1 h bond pigtail - 30 min glue MCC to flex hybrid 15 min + 1 night bond MCC - 1 h test flex hybrid with MCC - ?? glue flex to bare module 45 min + 1 night bond FEs to flex at Bonn 2 h

4. Flex hybrid - tests at Oklahoma ● bare flex hybrids tested for shorts and opens in industry (fast test - up to 5% error) ● attach bare flex hybrid to frame ● load passive components on flex hybrid ● visual inspection (misalignment, substrate defects, solder on pads) ● measurement of substrate, cover layer and metal thickness; trace and pad width ● wirebond and encapsulate test connections (until now rebonded at Bonn) ● test high voltage (800 V) isolation ● envelope inspection (maybe after MCC is bonded and potted) Glue pigtail to flex hybrid equipment ● 10 sets of pigtail tools (doesn't exist - construction drawings ready) ● solid adhesive film (Pyralux) (doesn't exist) ● stereo microscope (exists - maybe new or additional light source needed) ● heater (exists - Heraeus) ● glue and vacuum apparatus with accessories (exists - Paggen LABSET M- Dispenser & M- VAC-PIN)

5. Bond pigtail to flex hybrid equipment ● manual bonder (exists - bond tests on flex holder card successful) ● 50  m pure Al wires (single wires between signal pads and three wires with different length between power pads = 23 bonds) ● 17,5  m AlSi wires (three wires with different length between HV pads = 6 bonds) MCC test equipment ? ● standard pixel testsystem (exists) ● MCC test card (doesn't exist - exists at Bonn) ● low voltage source (3.5V) (exists - ?) ● we do not have any experience

6. Bond MCC to flex hybrid equipment ● manual bonder (exists - no tests with MCC made) ● 25  m AlSi wires (69 bonds)  MCC wirebonds encapsulation ? Glue MCC to flex hybrid equipment ● 10 sets of module mounting tools (doesn't exist - construction drawings ready) ● stereo microscope (exists - maybe new or additional light source needed) ● Dow Corning SE4445 silicon or Epotek 70 glue ● glue rotator (doesn't exist - easy to build) ● glue and vacuum apparatus with accessories (exists - Paggen LABSET M- Dispenser & M- VAC-PIN)

7. Flex hybrid with MCC test equipment ● visual inspection (before encapsulation) ? ● envelope inspection ? ● detached wire bonds, broken lines ● MCC power consumption with and without clock ● R/O of FIFOs and registers, parametric measurements on the I/Os ● contact each group of FE pads and additional parametric measurements ● event building with simulated events Flex hybrid with MCC tests ● TFM (Test Flex Module) board (doesn't exist - ask ?) ● power supply (exists - ?) ● programmable scanner and digital multi meter (exists - ?)  MCCExe / (Pattern generator (MCC input) & logic state analyser (MCC output) (doesn't exist - ask ?)  MCC probe card with 60 needles (doesn't exist - ask ?)  we do not have any experience

8. Flex hybrid with MCC tests TFM board MCC on flex probe card

9. Bare module probing equipment ● probe station with >6'' chuck (exists - ?) ● needle card with 48 contact points (doesn't exist - ask Theo) ● needles for two contact points (exists - ?) ● handling- and test-tool for bare modules (doesn't exist - ask Attilio) ● double low voltage source (2.0V & 1.6V) (exists - Agilent E3631A) * ● double low voltage source (+5V & -5V) (exists - self-construction) * ● multimeter (exists - HP 390A) * ● picoampermeter (exists - ?) * ● VME-crate (exists) with: * ● VME-MXI interface (exists - NI VME-MXI-2) * ● TurboPLL (exists - new PROMs needed) * ● TurboPCC (exists - new PROMs needed) * ● SCSC? or something equivalent (exist - doesn't work, ask Atillio) * ● oszilloscope & 2 differential probes- (exists - Tektronix TDS 640A, P6248 & P6246) * ● standard PC with MXI-interface (exists - e4pc06 maybe more memory needed) * ● TurboDAQ (exists - Version 3.4) * ● pulser (exists - Agilent 81110A) * * = standard pixel testsystem

10. Bare module probing tests visual inspection? FE probing (subset of standard test routines ATL-IP-QC-xxxx): ● global- & pixel register functionality ● column pairs affected by pixel defects ● pixels not answering to digital injection ● pixels with low noise (without HV to sensor) ● analogue and digital current consumption at power up, after global registry test, after digital injection scan & after noise scan ● MonLeak ? ● CrossTalk ? sensor probing: ● standard I-V measurement (ATL-IP-QP-0006)

11. Glue bare module to flex hybrid equip. ● 10 sets of module mounting tools (doesn't exist - construction drawings ready) ● stereo microscope (exists - maybe new or additional light source needed) ● Dow Corning SE4445 silicon and Dow Corning 3140/3145 ● glue rotator (doesn't exist - easy to build) ● glue and vacuum apparatus with accessories (exists - Paggen LABSET M- Dispenser & M- VAC-PIN) ● 3 different glue methods used (discussion last pixel week - wait for decision) ● heater (exists - Heraeus) Bond FEs to flex hybrid at Bonn ● automatic bonder at Bonn ● trip to Bonn when all module mounting tools are filled or we need a extra chuck at Bonn and some flex holder protection tools

12. Assembled module test equipment ● standard pixel testsystem (exists) ● 4? 241 Am sources (doesn't exist) ● flex frame support card (doesn't exist) / type0 microcable (doesn't exist) & module support card (doesn't exist) ● module cooling (doesn't exist)? Assembled module tests ● analogue and digital current consumption ● global and pixel register functionality ● digital performance of each pixel ● threshold dispersion of the whole module ● noise of the whole module ● tuning ● burn-in (maybe only on the bi-staves)

13. Summary bare module probing ● FE probing - 2 h ● sensor probing - 10 min flex hybrid - tested at Oklahoma test MCC ? - few min or tested at DELTA assembled module test - 3 h glue pigtail to flex hybrid 30 min + 1 h bond pigtail - 30 min glue MCC to flex hybrid 15 min + 1 night bond MCC - 1 h test flex hybrid with MCC - ?? glue flex to bare module 45 min + 1 night bond FEs to flex at Bonn 2 h