1. Hybrid Integrated Circuit
Outer Barrel
Hybrid Integrated Circuit
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

2. Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
OUTLINE
OB Module assembly
Ongoing activities
tools for:
- modules pre-alignment and shipping
- laser soldering test with 1 and 14 chips
- pALPIDE_fs chip
Summary
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

3. Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
OB Module assembly: material
Dummy chip
6 modules have been produced
- 1 with carbon plate
- 5 without carbon plate
50 µm thick
size 15 mm x 30 mm
Dummy FPC
designed as in TDR1 to accommodate 7 x 2 chips
holes metalized
no coverlay at the bottom
produced by Nuova Eurotar
FPC layer stack up
Cover-sheet 25 µm
Copper 50 µm
Kapton µm
First version of FPC
210,6 mm
30,1 mm
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014 3

4. Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
OB Module assembly 1 3 C A B 4
2-5 A B A
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014 4

5. OB Module assembly Accuracy of chips x,y position: < 8 um (average)
Modules without carbon plate
Front view
Chip: 15 mm x 30 mm
300 um thick
Back view
2 modules already shipped to Cagliari
Modules with carbon plate
Front view
Carbon plate K13D2U 75gsm (≈ 40µ)
Thickness 0,11-0,12mm Weight 1,22g
Back view
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014 5

6. OB Module assembly Weight 4,4 g
Production of 10 dummy modules (without carbon plate) for development of the stave assembly procedure is on going as scheduled:
4 modules already shipped to Torino
6 modules completed by the end of March: 64 dummy chips needed
Time manufacturing: 2 hours + curing time
Tools developed and assembly procedures: accuracy of chips x,y position < 5 um (average)
Weight 4,4 g
the pick up tool must be used for all modules handling operations
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

7. Ongoing activities: tools for modules prealignment and shipping2
by Silvia
Alignment station 1
Module box
foam
dummy module
Next 6 modules will be shipped by end of March
Pins for module
pre alignment
references holes for Module box 3 4
Half stave modules
Conductive carrying case for shipping half stave modules 1 2 3 4 5 6 7
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

8. Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
Ongoing activities: tools for laser soldering test
Preparation of two single chip assemblies with glue and adhesive tape in order to define the procedure for a fully equipped dummy modules to solder at CERN 1
Daisy chain FPC in copper 2
Macor grid
Mechanical screws
for chip-fpc alignment
Ball pick up tool
Vacuum tool 3 4
Quartz window
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

9. Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
Ongoing activities: tools for HIC laser soldering test
The pre-fixed module is then placed on the tool for the laser soldering interconnections 1
Reference pins 2 3 4
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

10. Ongoing activities: production of the new FPC
FPC elaborated on the layout design for the IB module
220,4 mm
30,1 mm
M. Sacchetti
FPC layer stack up
Cover-sheet 25 µm
Copper 50 µm
Kapton µm
The production of the dummy FPCs for 14 chips was commissioned to Nuova Eurotar company.
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

11. ball pick up tool for pALPIDE_fs chip
Ongoing activities:
ball pick up tool for pALPIDE_fs chip
Third ball pick up tool designed
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

12. Cosimo Pastore, ITS-MFT mini-week, 12 March 2014
SUMMARY
6 modules have been produced: 2 to develop the jig to pick up the module and 4 for development of the stave assembly procedure. Next step is to produce 6 modules by the end of March.
The modules prealigned will be shipped to Torino by mean an ad hoc tool which will be ready by the end of March.
As soon as possible the solder test with 1 chip will be done.
The production of the dummy FPCs for 14 chips was commissioned to Nuova Eurotar company.
The ball pick up tool for the pALPIDE chip will be ready by the end of March.
Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

13. Back slide

15. Metalized hole diameter i = 1,…,7X Y i2 i3
Nominal
Measured X
210,6
210,6030 Y
30,1
30,1270 L
180,6
180,6744
Distance (i) i = 1,…,6
30,1167
30,1131
30,1155
30,1069
30,1079
30,1145
Metalized hole diameter i = 1,…,7
0,21
0,2629
0,2659
0,2673
0,2661
0,2634
0,2646
0,2632
Measures in mm
CHIP 8
CHIP 1
CHIP 2 i1
CHIP 1
CHIP 2 i1 15

16. Module assembly procedure
Gluing procedure to fix the FPC on the chips 8
Adhesive mask 9 10 11

17. Module assembly procedure
FPC
FPC 150 µm thick
Chip 50 µm thick
Carbon plate 120 µm thick
Glue: Ecobond 40 µm thick
Modules without carbon plate
Modules with carbon plate
Does the module plate help for handling and testing?