1. Hybrid Issues

2. Hybrid Panel Bonding Shape/layout Traceablility Metrology
No bond off/pull test areas on hybrid
Add >2x2 mm2 area in 130 nm hybrids
Solder on pads
Fixed solder resist, only pick-and-place SMDs, moved SMDs away from bonding areas in 130 nm hybrids
Bonding clearances
Changed solder resist
Top metal contamination
Changed etch order so top layer last
Traceablility
Bad numbering of panels
Added numbering to new panels
Need id # on hybrid
Add scratch area to 130 nm hybrids, big enough for bar code
Shape/layout
Panel not flat
Need to add metal back to FR4, add 2 more side holes in 130 nm hybrids
Tabs not flat after reflow, ends don’t vac down
Metalized , lengthen, wider tabs needed
Mis-drilled alignment holes
Added specs/modified panel
Can’t glue full panel at once
Need to increase hybrid spacing, put locating pin inline for 130 nm hybrids
Vacuum leakage from extra mounting holes
Need to know what people use
Metrology
Location for metrology, fiducial markers
Need suggestions to add to 130 nm panel, add touchdown points on hybrid

3. Hybrid toolings Hybrid glue stencil 8 way vacuum jig
Remove mounting holes for leak improvement
Need more screw down points for panel edge
Does it need cooling, like secondary cold plate? Or are fans sufficient?
~50 W per panel, “cold” plate (peltier?) could be used in burn in for accelerated ageing
Hybrid pickup tooling
Hard to keep edges of ESD plastic clean, hard to get ground flat
Need to change plastic faces with grindable metal. Is ESD an issue?
Hard to see if pins all the way down
Could connect landing pads and add simple continuity test