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ITRS MEMS San Francisco, CA July 12, 2012 Presentation by Michael Gaitan, NIST.

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Presentation on theme: "ITRS MEMS San Francisco, CA July 12, 2012 Presentation by Michael Gaitan, NIST."— Presentation transcript:

1 ITRS MEMS San Francisco, CA July 12, 2012 Presentation by Michael Gaitan, NIST

2 MEMS Technology Working Group Akihiro Koga Arthur Morris Asif Chowdhury Brian Jamieson Buzz Hardy Chengkuo Lee Chris Apanius Chris van Hoof Christian Rembe Chuck Richardson Dave Howard Dimitrios Peroulis Dominique Schinabeck Don DeVoe Edward Chiu Fabio Pasolini Fabrice Verjus Fumihiko Nakazawa Goro Nakatani Hebert Bennett Toshiba Wispry Analog Devices SB Microsystems MEMSCAP National U of Singapore Promeus IMEC PolyTec iNEMI Jazz Semiconductor Perdue Acutronic University of MD Asian Pacific Micro ST Micro KFM Technology Fujitsu Rohm NIST Henne van Heeren Hiroshi Yamada Ingrid De Wolf Jae Sung Yoon Jim Spall Jim Mrvos Jianmin Miao John Rychcik Josh Molho Karen Lightman Kevin Chau Koji Fukumoto Marcie Weinstein Mark Crockett Mary Ann Maher Michel Brillouet Monica Takacs Patric Salomon Pete Loeppert Raj Gupta enablingMNT Toshiba IMEC KIMM Delphi Lexmark NTU Solidus Caliper MEMS Industry Group MEMStaff Sony Akustica SEMI, MEMSmart SoftMEMS LETI MEMS Industry Group 4m2c Knowles Acoustics Volant Technologies Chair: Mike Gaitan (NIST), Chair Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI) Raji Baskaran Rakesh Kumar Randy Wagner Robert De Nuccio Ron Lawes Sacha Revel Scott Bryant Shawn Blanton Stephane Donnay Steve Breit Steve Greathouse Steve Walsh Takashi Mihara Tetsu Tanaka Tony Stamper Veljko Milanovic Wei-Leun Fang Wendy Chen Xiaoming Wu Yasutaka Nakashiba Intel Global Foundries NIST ST Micro Imperial College Accutronic MANCEF Carnegie Mellon University IMEC Coventor Plexus MANCEF Micromachine Center Tohoku Univ. IBM Mirrorcle Technologies NTHU KYEC Lexmark Renesas Electronics

3 MEMS Technology Working Group Akihiro Koga Arthur Morris Asif Chowdhury Brian Jamieson Buzz Hardy Chengkuo Lee Chris Apanius Chris van Hoof Christian Rembe Chuck Richardson Dave Howard Dimitrios Peroulis Dominique Schinabeck Don DeVoe Edward Chiu Fabio Pasolini Fabrice Verjus Fumihiko Nakazawa Goro Nakatani Hebert Bennett Toshiba Wispry Analog Devices SB Microsystems MEMSCAP National U of Singapore Promeus IMEC PolyTec iNEMI Jazz Semiconductor Perdue Acutronic University of MD Asian Pacific Micro ST Micro KFM Technology Fujitsu Rohm NIST Henne van Heeren Hiroshi Yamada Ingrid De Wolf Jae Sung Yoon Jim Spall Jim Mrvos Jianmin Miao John Rychcik Josh Molho Karen Lightman Kevin Chau Koji Fukumoto Marcie Weinstein Mark Crockett Mary Ann Maher Michel Brillouet Monica Takacs Patric Salomon Pete Loeppert Raj Gupta enablingMNT Toshiba IMEC KIMM Delphi Lexmark NTU Solidus Caliper MEMS Industry Group MEMStaff Sony Akustica SEMI, MEMSmart SoftMEMS LETI MEMS Industry Group 4m2c Knowles Acoustics Volant Technologies Chair: Mike Gaitan (NIST), Chair Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI) Raji Baskaran Rakesh Kumar Randy Wagner Robert De Nuccio Ron Lawes Sacha Revel Scott Bryant Shawn Blanton Stephane Donnay Steve Breit Steve Greathouse Steve Walsh Takashi Mihara Tetsu Tanaka Tony Stamper Veljko Milanovic Wei-Leun Fang Wendy Chen Xiaoming Wu Yasutaka Nakashiba Intel Global Foundries NIST ST Micro Imperial College Accutronic MANCEF Carnegie Mellon University IMEC Coventor Plexus MANCEF Micromachine Center Tohoku Univ. IBM Mirrorcle Technologies NTHU KYEC Lexmark Renesas Electronics MEMS Industry Group MEMS TWG Subgroups: Devices, Design and Simulation, Packaging and Integration, and Testing

4 Len Sheynblat, Qualcomm, Sensors System Integration Problems, MIG M2M Workshop, Spring 2012 Focus: MEMS in Mobile Devices

5 ITRS MEMS MEMS Device Technologies –Accelerometers –Gyroscopes –Microphones –RF MEMS –Emerging MEMS Technology Requirements –Device Performance –Design and Simulation –Packaging and Integration –Device Testing

6 MEMS Inertial Sensors MEMS Inertial Sensors continue to incrementally increase in performance and lower in cost. The integration of functionalities (tri axis accelerometer, gyroscope, magnetometer, and pressure sensor) towards the IMU has advanced to 9 DOF in the package. Driving down the cost of testing of the IMU continues to be a challenge.

7 Example - 9 DOF IMU Package Level ST Microelectronics Feb 12, 2012

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9 MEMS Microphones MEMS microphones are expected to incrementally increase in performance and lower in cost. As the sensitivity of microphones advances to 68 db, testing in the factory environment is an issue. Advances in the ASIC include digital output and adaptive signal processing (such as noise cancellation). Testing of MEMS Microphones with adaptive signal processing is a challenge.

10 RF MEMS RF MEMS are intended to lower the power dissipation of the radio. RF MEMS are sill in the process of increasing their reliability and lowering cost before they can be adopted in mobile devices. RF MEMS are expected to increase in performance and reliability. –The biggest challenge in RF MEMS is enhancing reliability and lifetime (# of operations) –Some of the future performance metrics have no known solutions, (e.g., signal isolation requirements)

11 Grand Challenges Difficult ChallengesPotential Solutions Integration of MEMS in the Package Standardization for MEMS packaging to support integration. Packages are needed that reduce or eliminate mechanical stress and enhancing hermeticity. Package data that can be used to accurately predict the effect of the package on device performance. Testing of MEMS More testing towards the wafer level. Validated tools to predict device device performance from wafer tests. Methodologies for Design for Test or Design for NO Test. Validated accelerated life testing for MEMS More knowledge of the physics of failure is required to develop accelerated life tests. Need to share information. Individual solutions exist but are not being generalized across the industry.

12 MEMS Manufacturing Packaging and Testing Device Fabrication MEMS Manufacturing CostR&D Investment Device and Process Development Packaging and Testing

13 ITRS and iNEMI The MEMS Technology Working Group is also affiliated with iNEMI. The iNEMI MEMS will be expanded to include consumer health applications: the "Worried Well." TWG discussions include the concept of integration node. An iNEMI project on MEMS Testing Requirements is in discussion. The focus will likely be on defining performance metrics in data sheets.

14 MEDICAL MARKET- High Potential Bubble Chart Ref: IBM Institute for Business Value, The future of connected health devices 3 BILLION POTENTIAL CUSTOMERS FOR CONNECTED HEALTH DEVICES

15 Integration Node Accelerometer Tri-Axis Accelerometer Gyroscope Tri-Axis Gyroscope Magnetometer Tri-Axis Magnetometer 6 DOF Sensor 9 DOF Sensor Pressure Sensor 10 DOF Sensor

16 Conclusions Opportunities for industrial collaboration exist around issues at the back end (packaging and test) MEMS Sensor Fusion creates challenges for testing in increasing complexity while still lowering cost. MEMS Testing requirements depend on the application (consumer electronics, automotive, medical, defense and aerospace). Our road mapping has so far been on near term (5 years). The concept of integration node might facilitate longer term road mapping of MEMS and other More than Moore Technologies.


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