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9/11/2001 1 2001 ITRS Factory Integration ITWG Jeff Pettinato, Intel.

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Presentation on theme: "9/11/2001 1 2001 ITRS Factory Integration ITWG Jeff Pettinato, Intel."— Presentation transcript:

1 9/11/ ITRS Factory Integration ITWG Jeff Pettinato, Intel

2 9/11/ Agenda 1.Scope and Factory Drivers 2.Difficult Challenges 3.Need for Integrated Solutions 4.Key Technology Requirements 5.Solutions Being Driven by Technology Requirements 6.Summary

3 9/11/ Excellent Participation from Suppliers, IC Makers, Universities, and Research Institutes Many International members have contributed to FI

4 9/11/ Factory Integration Scope Includes Wafer, Chip and Product Manufacturing Wafer Mfg. Chip Mfg. Product Mfg. Distribution Si Substrate Mfg. The Factory FEOL BEOL Probe/Test Singulation Packaging Test The Factory is driven by Cost and Productivity: Reduce factory capital and operating costs per function Enable efficient high-volume production with operational models for varying product mixes (high to low) and other business strategies Increase factory and equipment reuse, reliability, and overall efficiency Quickly enable process technology shrinks and wafer size changes New in 2001

5 9/11/ Factory Integration Requirements and Solutions are Expressed through 6 Functional Areas Process Equipment UI Material Handling Systems Wafer and Reticle Carriers Automated storage systems Interbay & intrabay transport systems Personnel guided vehicles Internal Software & computers Production Equipment Process and Metrology equipment Mainframe and process chambers Wafer Handling Robots, Load Ports Internal software & computers Facilities Cleanroom, Labs, Central Utility Building Facilities Control and Monitoring Systems Power, Plumbing, HVAC, Utilities, Pipes, UPS Life safety systems, waste treatment AMHS Eqpt (side view) DB Document Management MES MCS Network or Bus DSS Station Controllers APC Scheduling + Dispatching DB Factory Information & Control Data and Control systems required to run the factory Decision support Process control Plan, Schedule, Dispatch Computers, databases, software outside equipment Factory Operations Policies and procedures used to plan, monitor and control production Direct factory labor Test Manufacturing Prober, Handler, and Test Equipment Manufacturing processes to test wafers and chips

6 9/11/ New Elements/Focus in the 2001 Factory Integration Chapter New Factory Operations metrics as key targets for other factory functional areas to solve in an integrated fashion 1) Factory Cycle time, 2) multiple lots per carrier and single wafer processing, 3) labor efficiency, 4) time to money Focus on e-Factory capabilities to solve Production Equipment Overall Equipment Efficiency (OEE) through Use of Internet, process control, rich data sources, and standards Refinement of Direct transport solutions for 300mm Expanded facilities section with revised technology requirement and potential solutions New Test section to address equipment & manufacturing Introduction of a Fab factory Cost Model based on 300mm, 20k wspw, high volume factory (key focus to extend in 2002) Discussion on 450mm wafer size timing and Mfg Paradigms

7 9/11/ Difficult Challenges Managing Complexity Quickly and effectively integrating rapid changes in semiconductor technologies and market conditions Factory Optimization Productivity increases are not keeping pace with needs Flexibility, Extendibility, Scalability Ability to quickly convert to new semiconductor technologies while reusing equipment, facilities, and skills Post CMOS Manufacturing Uncertainty Inability to predict factory requirements associated with post CMOS novel devices 450mm Wafer Size Conversion Timing and manufacturing paradigm for this wafer size conversion < 65nm after 2007> 65nm through 2007

8 9/11/ Integrated Solutions are Essential to Meet Needs Integrated Solutions Agile Manufacturing -Equipment Engineering Systems - EES -Single wafer control -e-Diagnostics Process Control -Fault Detection & Classification -Run to Run & Wafer to Wafer control -Integrated Metrology -Machine to machine matching Material Handling -Direct Transport AMHS -AMHS to support Send- Ahead, gating monitors, and very hot lots -Integrated Sorters, Stockers, Metrology Integrated Factory Technology Requirements New disruptive process technologies 157nm litho High K gate stack Low k dielectrics Copper processing + Operational Productivity & Business drivers Decreased Factory Cycle Time (QTAT) and time to market Improved Equipment OEE Reduction in non-product (I.e. test) wafer usage More efficient direct labor Faster factory conversion at technology nodes Goal = Meet Factory Challenges and Technology Requirements

9 9/11/ Key Factory Operations, Production Equipment, and Facilities Technology Requirements Production Equipment Factory Operations Facilities

10 9/11/ Key Material Handling, Factory Info and Control Systems, and Test Mfg Technology Requirements Factory Info And Control Material Handling Test Mfg

11 9/11/ Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality MetricPotential Solution it is driving Hot-Lot and regular lot cycle time per mask layer (days) a) Direct transport systems integrated with schedulers for tool to tool moves, b) Agile manufacturing leveraging internet technologies, c) Innovative carrier and wafer level controlDirect transport systems Agile manufacturing leveraging internet technologies Innovative carrier and wafer level control Wafer Layers / Day / Headcounta) Fully automated material handling & data sys Multiple lots per carriera) Embedded controller standards Groundbreaking to first tool move in a) Standardized design concepts, b) Design tools including e-tools, d) More off-site fabrication First tool move-in to first full loop out a) Standard equipment interfaces to reduce integration timeStandard equipment interfaces to reduce integration time Overall Equipment Efficiency (OEE) a) Minimize MTTR by e-Diagnostics, b) Advanced Process Control, c) Equipment Engineering Systems, e) Optimized Wafer and Low movementAdvanced Process ControlEquipment Engineering Systems Capital Reuse from one node to the next a) Common main-frame and chamber interfaces, b) High exchangeability of chamber modules / parts Production Equipment Install & Qualification cost as a % of capital cost a) Earlier involvement with new technology tool designers, b) Design for tool install emphasis, c) Standard / consistent equipment connections

12 9/11/ Under Floor Full Direct Transport Central Stocker (Large Capacity) (High Throughput) Upper Ceiling OHT Branch Direct Transport Concepts for Tool to Tool Delivery – Production Need date is 2005 Concept #1: Integrated Overhead Hoist Transport (OHT) systems Concept #2: Integrated Overhead Hoist Transport (OHT) systems Conveyorized transport Back

13 9/11/ Agile Manufacturing Means… Quick turn around [*faster cycle] time for production Quick turn around time without productivity deterioration No productivity reduction even if many lots production formed with few wafers Quick capability to product, scale and technology change Quick ramp-up of equipment installation and product Assure high productivity even if low production volume Which can be Realized by… Internet technologies for B2B, Factory to Factory, Internal factory connectivity and communications Supply Chain Management (SCM) Integrated Planning, Scheduling, and Real Time Dispatching Flexible Material Handling and Data Automation Systems Single Wafer Control and Tracking Multiple lots/single wafer control in equipment module (group)

14 9/11/ Carrier and Wafer Level Control Concepts for Rapid Material Movement and Processing Process Tools Stockers OHT Loop Sorter Metro Tools Stocker robot interfaces directly with Sorters and Metro equip Concept #1: Sorter and Metrology linked with Stockers Back Concept #2: Connected Equipment Front End Modules for Rapid Wafer processing and Inspection Wafer Staging Carrier Staging Equipment Supplier A Equipment Supplier B Equipment Supplier C

15 9/11/ Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality MetricPotential Solution it is driving Hot-Lot and regular lot cycle time per mask layer a) Direct transport systems integrated with schedulers for tool to tool moves, b) Agile manufacturing leveraging internet technologies, c) Innovative carrier and wafer level controlDirect transport systems Agile manufacturing leveraging internet technologiesInnovative carrier and wafer level control Wafer Layers / Day / Headcounta) Fully automated material handling & data sys Multiple lots per carriera) Embedded controller standards Groundbreaking to first tool move in a) Standardized design concepts, b) Design tools including e-tools, d) More off-site fabrication First tool move-in to first full loop out a) Standard equipment interfaces to reduce integration timeStandard equipment interfaces to reduce integration time Overall Equipment Efficiency (OEE) a) Minimize MTTR by e-Diagnostics, b) Advanced Process Control, c) Equipment Engineering Systems, e) Optimized Wafer and Low movementAdvanced Process ControlEquipment Engineering Systems Capital Reuse from one node to the next a) Common main-frame and chamber interfaces, b) High exchangeability of chamber modules / parts Production Equipment Install & Qualification cost as a % of capital cost a) Earlier involvement with new technology tool designers, b) Design for tool install emphasis, c) Standard / consistent equipment connections

16 9/11/ Back Factory Information and Control Systems Factory Network SECS-II GEM HSMS Utilization tracking standard Enhanced parallel I/O standards Carrier mgt standard Process Job, Control Job standards Wafer level tracking & control standards Carrier ID standard Mainstream Computer Communications stds Manufacturing Execution Systems Decision Support Systems Production equipment Process Control standards User Interfaces Other Systems Standard for data formats, data access, and inter application interfaces APC, Fault Detection & Classification, Integrated metrology, EES, e-Diagnostics Equip Eng I/F -> Standards Exist -> Standards Are Under Development -> Standards Are Needed -> Standards Exist -> Standards Are Under Development -> Standards Are Needed Utility, fluids, exhaust, drains hook-up standards Facilities Systems Rear of production equipment Fab levels Maximum move-in size stds Sub-fab standards Raised floor height standards Wall interface standards Rear U/I Max weight standard Standards for facilities systems safety counter-measures Materials supply container standards Standards for install pedestals, jigs/fixture for alignment Work access standards to eliminate Ergo issues Cleanroom Noise Criteria standards Vibration stds Global Construction Codes Facility electrostatic levels stds Sub-fab level Cleanroom height standards Cleanroom Temperature & RH ranges Environment/ stds Ceiling level Continued Standardization is needed to Reduce Integration Time, Cost, and Complexity Legend:

17 9/11/ Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality MetricPotential Solution it is driving Hot-Lot and regular lot cycle time per mask layer a) Direct transport systems integrated with schedulers for tool to tool moves, b) Agile manufacturing leveraging internet technologies, c) Innovative carrier and wafer level controlDirect transport systems Agile manufacturing leveraging internet technologiesInnovative carrier and wafer level control Wafer Layers / Day / Headcounta) Fully automated material handling & data sys Multiple lots per carriera) Embedded controller standards Groundbreaking to first tool move in a) Standardized design concepts, b) Design tools including e-tools, d) More off-site fabrication First tool move-in to first full loop out a) Standard equipment interfaces to reduce integration timeStandard equipment interfaces to reduce integration time Capital Reuse from one node to the next a) Common main-frame and chamber interfaces, b) High exchangeability of chamber modules / parts Production Equipment Install & Qualification cost as a % of capital cost a) Earlier involvement with new technology tool designers, b) Design for tool install emphasis, c) Standard / consistent equipment connections Overall Equipment Efficiency (OEE) a) Minimize MTTR by e-Diagnostics, b) Advanced Process Control, c) Equipment Engineering Systems, e) Optimized Wafer and Low movementAdvanced Process ControlEquipment Engineering Systems

18 9/11/ Back

19 9/11/ Manufacturing Execution System - MES Equipment/AMHS Within a Factory (E-Factory) Factory to Factory (E-Factory) Company to Company (E-Commerce) Factory A Company A Factory B Company B Suppliers Equipment Engineering System e-diagnostics capability Process or Metrology Equipment (side view) Control System Station Controller AMHS Eqpt (side view) Material Control System - MCS Ethernet EES e-Manufacturing Hierarchy for Connectivity firewall Semiconductor industry must continue to rapidly leverage mainstream technologies to reduce cost/complexity/integration time

20 9/11/ Translating Material Handling, FICS, and Test Manufacturing Metrics to Reality MetricPotential Solution it is driving AMHS system throughput for interbay and intrabay a) Fundamental capability that permits AMHS system to transport hot lots, gating send-aheads and hand carry MTBF/MTTR for mission critical applications a) Equipment Engineering Systems, b) E-Diagnostic and c) E-manufacturing capabilities Time to create industry standards a) Improved business processes to speed up standard cycle time, b) Use Internet for balloting/approval Lead time for solutions to conform with standards a) Supplier/IC Maker collaboration to develop standards and solutions in parallel, b) Automated test tools for systematic interface testing 1st Article Test Equipment integration time change from previous year a) Standard interfaces for equipment control, b) Standards for test programs, c) Standard data formats for test results

21 9/11/ Summary of Key Potential Solutions Material Handling using Direct Transport To improve factory cycle time and fab space efficiency Agile Manufacturing Leveraging Internet capabilities E-Factory to delivery product more quickly (cycle time) Equipment Engineering System (EES) including E- Diagnostics capabilities Improve Overall Equipment Efficiency, cycle time, & factory output Advance Process Control (APC) Improve Overall Equipment Efficiency, cycle time, & factory output Continued Need for Standards to reduce integration time, cost, and complexity Reduce integration time and complexity, enable pervasive implementation of capabilities above at lower cost

22 9/11/ Some Key Messages 1.Rapid changes in process technologies, business requirements, market conditions, and accelerated ramps have made factories more complex and difficult to integrate 2.Future factories must be agile to meet rapid technology and business changes with cost effective solutions 3.Overall Equipment Efficiency must be drastically improved Equipment at each tech node must meet throughput and uptime metrics Solutions to improve utilization must be developed and implemented 4.Standards have been effective in 300mm. Cycle time to create and deploy must be drastically reduced for the future 5.Integrated Solutions are essential to meet needs 6.e-Factory concepts are being developed to solve complexity, integration and OEE issues Leverages the internet and rich data sources to achieve pervasive process control, fast lot cycle times, on-line equipment repair, and rapid lot delivery using factory wide scheduling and dispatching

23 9/11/ Backup Area

24 9/11/ Understanding & Managing Factory cost is a Key Focus for (Fab Capital Cost Breakdown) Process Equipment UI Material Handling Systems = 3% of Total Capital $81M for $2.7B factory Wafer and Reticle Carriers Carrier ID readers Automated storage systems Interbay & intrabay transport systems Personnel guided vehicles Software & computers within the equipment Production Equipment = 80% of Total Capital $2,160M for $2.7B factory Process and Metrology equipment Mainframe and process chambers Wafer Handling Robots Load Ports Installation, but not qualification Software & computers within the equipment Facilities = 15% of Total Capital $405M for $2.7B factory Cleanroom, Labs, Central Utility Building Facilities Control and Monitoring Systems Support buildings (Café, office, parking) Power, Plumbing, HVAC, Utilities, Pipes, UPS Life safety systems, waste treatment Includes site prep, but not land and off-site dev costs AMHS Eqpt (side view) Assumptions Total Capital Cost = $2.7B Total Capacity = 40k wspm 300mm wafer size 130nm technology DB Document Management MES MCS Network or Bus DSS Station Controllers APC Scheduling + Dispatching DB Factory Information & Control = 2% of Total Capital $54M for $2.7B factory Manufacturing execution systems Decision support systems Process Control systems Planning systems, Schedulers, Dispatching Material Control, document management systems Computers, databases, software outside equipment Baseline Model from 2001 Roadmap

25 9/11/ Factory Areas or Thrusts Factory Operations Material Handling Example: Manufacturing rules, production size, mix Facilities Examples: Building, cleanroom, utility systems, process fluid delivery Examples: AMHS Transport, storage, ID Systems, interface standards Factory Information and Control Systems Example: MES, Computers, Networks, Apps MCS, APC, etc Production Equipment Example: Equipment unit, real-time process control, interface standards, Embedded Control Technology Requirements and Potential Solutions are expressed through these factory areas Complexity Management Factory Optimization Extendibility, Flexibility, Scalability Difficult Challenges Reuse of building, production equipment, and factory information and control systems; Factory designs that support rapid process and technology changes/retrofits; Comprehend tighter ESH/Code requirements Increased customer expectation to meet on time delivery; Increased urgency for improved factory effectiveness, High factory yield at startup; Reduce wafer and product cost; Satisfy all local regulations Rapid changes to business needs & demands; Increasing process & product complexity; Larger wafers and carriers, Increased reliance on factory information & control systems Factories Must be Better integrated to solve Difficult Challenges


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