1. 2001 ITRS Factory Integration ITWG
ITRS Factory Integation TWG
2017/3/27
2001 ITRS Factory Integration ITWG
Jeff Pettinato, Intel
FITWG 2000

2. ITRS Factory Integation TWG
2017/3/27
Agenda
Scope and Factory Drivers
Difficult Challenges
Need for Integrated Solutions
Key Technology Requirements
Solutions Being Driven by Technology Requirements
Summary
FITWG 2000

3. Many International members have contributed to FI
Excellent Participation from Suppliers, IC Makers, Universities, and Research Institutes
Many International members have contributed to FI

4. ITRS Factory Integation TWG
2017/3/27
2001 Factory Integration Scope Includes Wafer, Chip and Product Manufacturing
The Factory
Wafer
Mfg.
Chip
Mfg.
Product
Mfg.
Si Substrate
Mfg.
Distribution
FEOL
BEOL
Probe/Test
Singulation
Packaging
Test
New in 2001
The Factory is driven by Cost and Productivity:
Reduce factory capital and operating costs per function
Enable efficient high-volume production with operational models for varying product mixes (high to low) and other business strategies
Increase factory and equipment reuse, reliability, and overall efficiency
Quickly enable process technology shrinks and wafer size changes
FITWG 2000

5. Factory Integration Requirements and Solutions are Expressed through 6 Functional Areas
Production Equipment
Process and Metrology equipment
Mainframe and process chambers
Wafer Handling Robots, Load Ports
Internal software & computers
Process
Equipment UI
Facilities
Cleanroom, Labs, Central Utility Building
Facilities Control and Monitoring Systems
Power, Plumbing, HVAC, Utilities, Pipes, UPS
Life safety systems, waste treatment
Factory Operations
Policies and procedures used to plan, monitor and control production
Direct factory labor
Test Manufacturing
Prober, Handler, and Test Equipment
Manufacturing processes to test wafers and chips
Material Handling Systems
Wafer and Reticle Carriers
Automated storage systems
Interbay & intrabay transport systems
Personnel guided vehicles
Internal Software & computers
Factory Information & Control
Data and Control systems required to run the factory
Decision support
Process control
Plan, Schedule, Dispatch
Computers, databases, software outside equipment
AMHS
Eqpt
(side view) DB
Management
Document
MES
MCS
Network or Bus
DSS
Controllers
Station
APC
Scheduling +
Dispatching

6. New Elements/Focus in the 2001 Factory Integration Chapter
New Factory Operations metrics as key targets for other factory functional areas to solve in an integrated fashion
1) Factory Cycle time, 2) multiple lots per carrier and single wafer processing, 3) labor efficiency, 4) time to money
Focus on e-Factory capabilities to solve Production Equipment Overall Equipment Efficiency (OEE) through
Use of Internet, process control, rich data sources, and standards
Refinement of Direct transport solutions for 300mm
Expanded facilities section with revised technology requirement and potential solutions
New Test section to address equipment & manufacturing
Introduction of a Fab factory Cost Model based on 300mm, 20k wspw, high volume factory (key focus to extend in 2002)
Discussion on 450mm wafer size timing and Mfg Paradigms

7. ITRS Factory Integation TWG
2017/3/27
2001 Difficult Challenges
> 65nm through 2007
< 65nm after 2007
Managing Complexity
Quickly and effectively integrating rapid changes in semiconductor technologies and market conditions
Factory Optimization
Productivity increases are not keeping pace with needs
Flexibility, Extendibility, Scalability
Ability to quickly convert to new semiconductor technologies while reusing equipment, facilities, and skills
Post CMOS Manufacturing Uncertainty
Inability to predict factory requirements associated with post CMOS novel devices
450mm Wafer Size Conversion
Timing and manufacturing paradigm for this wafer size conversion
Will 450mm be a scale up of 300mm or a more radical change in manufacturing technology (single wafer carriers, etc.)
FITWG 2000

8. Integrated Solutions are Essential to Meet Needs +
Technology Requirements
New disruptive process technologies
157nm litho
High K gate stack
Low k dielectrics
Copper processing +
Operational Productivity & Business drivers
Decreased Factory Cycle Time (QTAT) and time to market
Improved Equipment OEE
Reduction in non-product (I.e. test) wafer usage
More efficient direct labor
Faster factory conversion at technology nodes
Integrated Solutions
Agile Manufacturing
- Equipment Engineering Systems - EES
- Single wafer control
- e-Diagnostics
Process Control
- Fault Detection & Classification
- Run to Run & Wafer to Wafer control
Integrated Metrology
Machine to machine matching
Material Handling
- Direct Transport AMHS
- AMHS to support Send-Ahead, gating monitors, and very hot lots
- Integrated Sorters, Stockers, Metrology
Integrated Factory
Goal = Meet Factory Challenges and Technology Requirements

9. Key Factory Operations, Production Equipment, and Facilities Technology Requirements

10. Key Material Handling, Factory Info and Control Systems, and Test Mfg Technology Requirements

11. Potential Solution it is driving
Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality
Metric
Potential Solution it is driving
Hot-Lot and regular lot cycle time per mask layer (days)
a) Direct transport systems integrated with schedulers for tool to tool moves, b) Agile manufacturing leveraging internet technologies, c) Innovative carrier and wafer level control
Wafer Layers / Day / Headcount
a) Fully automated material handling & data sys
Multiple lots per carrier
a) Embedded controller standards
Groundbreaking to first tool move in
a) Standardized design concepts, b) Design tools including e-tools, d) More off-site fabrication
First tool move-in to first full loop out
a) Standard equipment interfaces to reduce integration time
Overall Equipment Efficiency (OEE)
a) Minimize MTTR by e-Diagnostics, b) Advanced Process Control, c) Equipment Engineering Systems, e) Optimized Wafer and Low movement
Capital Reuse from one node to the next
a) Common main-frame and chamber interfaces, b) High exchangeability of chamber modules / parts
Production Equipment Install & Qualification cost as a % of capital cost
a) Earlier involvement with new technology tool designers, b) Design for tool install emphasis, c) Standard / consistent equipment connections

12. Direct Transport Concepts for Tool to Tool Delivery – Production Need date is 2005
Central Stocker
(Large Capacity)
(High Throughput)
Conveyorized
transport
Upper Ceiling
OHT
Branch
Under Floor
Full Direct
Transport
Concept #1: Integrated Overhead Hoist Transport (OHT) systems
Concept #2: Integrated Overhead Hoist Transport (OHT) systems
Back

13. Agile Manufacturing Means…
Quick turn around [*faster cycle] time for production
Quick turn around time without productivity deterioration
No productivity reduction even if many lots production formed with few wafers
Quick capability to product, scale and technology change
Quick ramp-up of equipment installation and product
Assure high productivity even if low production volume
Which can be Realized by…
Internet technologies for B2B, Factory to Factory, Internal factory connectivity and communications
Supply Chain Management (SCM)
Integrated Planning, Scheduling, and Real Time Dispatching Flexible Material Handling and Data Automation Systems
Single Wafer Control and Tracking
Multiple lots/single wafer control in equipment module (group)

14. Carrier and Wafer Level Control Concepts for Rapid Material Movement and Processing
Staging
Carrier
Equipment
Supplier A
Supplier B
Supplier C
Process Tools
Stockers
OHT Loop
Sorter
Metro
Tools
Process Tools
Stocker robot interfaces directly with Sorters and Metro equip
Concept #1: Sorter and Metrology linked with Stockers
Concept #2: Connected Equipment Front End Modules for Rapid Wafer processing and Inspection
Back

15. Potential Solution it is driving
Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality
Metric
Potential Solution it is driving
Hot-Lot and regular lot cycle time per mask layer
a) Direct transport systems integrated with schedulers for tool to tool moves, b) Agile manufacturing leveraging internet technologies, c) Innovative carrier and wafer level control
Wafer Layers / Day / Headcount
a) Fully automated material handling & data sys
Multiple lots per carrier
a) Embedded controller standards
Groundbreaking to first tool move in
a) Standardized design concepts, b) Design tools including e-tools, d) More off-site fabrication
First tool move-in to first full loop out
a) Standard equipment interfaces to reduce integration time
Overall Equipment Efficiency (OEE)
a) Minimize MTTR by e-Diagnostics, b) Advanced Process Control, c) Equipment Engineering Systems, e) Optimized Wafer and Low movement
Capital Reuse from one node to the next
a) Common main-frame and chamber interfaces, b) High exchangeability of chamber modules / parts
Production Equipment Install & Qualification cost as a % of capital cost
a) Earlier involvement with new technology tool designers, b) Design for tool install emphasis, c) Standard / consistent equipment connections

16. Factory Information and
Continued Standardization is needed to Reduce Integration Time, Cost, and Complexity
Factory Information and
Control Systems
Factory
Network
SECS-II
GEM
HSMS
Utilization tracking
standard
Enhanced parallel
I/O standards
Carrier mgt
Process Job,
Control Job
standards
Wafer level tracking &
control standards
Carrier
ID standard
Mainstream Computer Communications stds
Manufacturing
Execution
Systems
Decision
Support
Production
equipment
Process
Control
User
Interfaces
Other
Standard for data
formats, data access,
and inter application
interfaces
APC, Fault Detection
& Classification,
Integrated metrology,
EES, e-Diagnostics
Equip Eng I/F
Utility, fluids,
exhaust, drains
hook-up
standards
Facilities Systems
Rear of production
equipment
Fab levels
Maximum
move-in
size stds
Sub-fab standards
Raised floor
height standards
Wall interface
Rear
U/I
Max
weight
standard
Standards for facilities systems
safety counter-measures
Materials supply
container standards
Standards for install
pedestals, jigs/fixture
for alignment
Work access
standards to eliminate
Ergo issues
Cleanroom Noise
Criteria standards
Vibration stds
Global
Construction
Codes
Facility electrostatic
levels stds
Sub-fab level
Cleanroom height
Cleanroom
Temperature
& RH ranges
Environment/
stds
Ceiling level
Legend:
-> Standards Exist
-> Standards Are Under Development
-> Standards Are Needed
Back

17. Potential Solution it is driving
Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality
Metric
Potential Solution it is driving
Hot-Lot and regular lot cycle time per mask layer
a) Direct transport systems integrated with schedulers for tool to tool moves, b) Agile manufacturing leveraging internet technologies, c) Innovative carrier and wafer level control
Wafer Layers / Day / Headcount
a) Fully automated material handling & data sys
Multiple lots per carrier
a) Embedded controller standards
Groundbreaking to first tool move in
a) Standardized design concepts, b) Design tools including e-tools, d) More off-site fabrication
First tool move-in to first full loop out
a) Standard equipment interfaces to reduce integration time
Capital Reuse from one node to the next
a) Common main-frame and chamber interfaces, b) High exchangeability of chamber modules / parts
Production Equipment Install & Qualification cost as a % of capital cost
a) Earlier involvement with new technology tool designers, b) Design for tool install emphasis, c) Standard / consistent equipment connections
Overall Equipment Efficiency (OEE)
a) Minimize MTTR by e-Diagnostics, b) Advanced Process Control, c) Equipment Engineering Systems, e) Optimized Wafer and Low movement

18. 1 2 3
Back

19. e-Manufacturing Hierarchy for Connectivity
ITRS Factory Integation TWG
2017/3/27
Company to Company
(E-Commerce)
Suppliers
Company A
Company B
Factory to Factory
(E-Factory)
e-diagnostics
capability
Factory A
Factory B
firewall
Within a Factory
(E-Factory)
Manufacturing
Execution System - MES
EES
Equipment/AMHS
Equipment Engineering
System
AMHS
Eqpt
(side view)
Ethernet
Process or
Metrology
Equipment
(side view)
Control
System
Material Control
System - MCS
Station
Controller
Semiconductor industry must continue to rapidly leverage mainstream technologies to reduce cost/complexity/integration time
FITWG 2000

20. Potential Solution it is driving
Translating Material Handling, FICS, and Test Manufacturing Metrics to Reality
Metric
Potential Solution it is driving
AMHS system throughput for interbay and intrabay
a) Fundamental capability that permits AMHS system to transport hot lots, gating send-aheads and hand carry
MTBF/MTTR for mission critical applications
a) Equipment Engineering Systems, b) E-Diagnostic and c) E-manufacturing capabilities
Time to create industry standards
a) Improved business processes to speed up standard cycle time, b) Use Internet for balloting/approval
Lead time for solutions to conform with standards
a) Supplier/IC Maker collaboration to develop standards and solutions in parallel, b) Automated test tools for systematic interface testing
1st Article Test Equipment integration time change from previous year
a) Standard interfaces for equipment control, b) Standards for test programs, c) Standard data formats for test results

21. Summary of Key Potential Solutions
Material Handling using Direct Transport
To improve factory cycle time and fab space efficiency
Agile Manufacturing Leveraging Internet capabilities
E-Factory to delivery product more quickly (cycle time)
Equipment Engineering System (EES) including E-Diagnostics capabilities
Improve Overall Equipment Efficiency, cycle time, & factory output
Advance Process Control (APC)
Continued Need for Standards to reduce integration time, cost, and complexity
Reduce integration time and complexity, enable pervasive implementation of capabilities above at lower cost

22. Some Key Messages
1. Rapid changes in process technologies, business requirements, market conditions, and accelerated ramps have made factories more complex and difficult to integrate
2. Future factories must be agile to meet rapid technology and business changes with cost effective solutions
3. Overall Equipment Efficiency must be drastically improved
Equipment at each tech node must meet throughput and uptime metrics
Solutions to improve utilization must be developed and implemented
4. Standards have been effective in 300mm. Cycle time to create and deploy must be drastically reduced for the future
5. Integrated Solutions are essential to meet needs
6. e-Factory concepts are being developed to solve complexity, integration and OEE issues
Leverages the internet and rich data sources to achieve pervasive process control, fast lot cycle times, on-line equipment repair, and rapid lot delivery using factory wide scheduling and dispatching

23. Backup Area

24. Understanding & Managing Factory cost is a Key Focus for 2002+ (Fab Capital Cost Breakdown)
Baseline Model from
2001 Roadmap
Production Equipment = 80% of Total Capital
$2,160M for $2.7B factory
Process and Metrology equipment
Mainframe and process chambers
Wafer Handling Robots
Load Ports
Installation, but not qualification
Software & computers within the equipment
Facilities = 15% of Total Capital
$405M for $2.7B factory
Cleanroom, Labs, Central Utility Building
Facilities Control and Monitoring Systems
Support buildings (Café, office, parking)
Power, Plumbing, HVAC, Utilities, Pipes, UPS
Life safety systems, waste treatment
Includes site prep, but not land and off-site dev costs
Process
Equipment UI
Assumptions
Total Capital Cost = $2.7B
Total Capacity = 40k wspm
300mm wafer size
130nm technology
Material Handling Systems = 3% of Total Capital
$81M for $2.7B factory
Wafer and Reticle Carriers
Carrier ID readers
Automated storage systems
Interbay & intrabay transport systems
Personnel guided vehicles
Software & computers within the equipment
Factory Information & Control = 2% of Total Capital
$54M for $2.7B factory
Manufacturing execution systems
Decision support systems
Process Control systems
Planning systems, Schedulers, Dispatching
Material Control, document management systems
Computers, databases, software outside equipment
AMHS
Eqpt
(side view) DB
Management
Document
MES
MCS
Network or Bus
DSS
Controllers
Station
APC
Scheduling +
Dispatching

25. Factories Must be Better integrated to solve Difficult Challenges
Factory Areas or Thrusts
Factory
Operations
Material
Handling
Example: Manufacturing rules, production size, mix
Facilities
Examples: Building, cleanroom, utility systems, process fluid delivery
Examples: AMHS Transport, storage, ID Systems, interface standards
Factory Information and Control Systems
Example: MES, Computers, Networks, Apps
MCS, APC, etc
Production
Equipment
Example: Equipment unit, real-time process control, interface standards, Embedded Control
Technology Requirements and Potential Solutions are expressed through these factory areas
Complexity
Management
Factory
Optimization
Extendibility,
Flexibility,
Scalability
Difficult Challenges
Reuse of building, production equipment, and factory information and control systems; Factory designs that support rapid process and technology changes/retrofits; Comprehend tighter ESH/Code requirements
Increased customer expectation to meet on time delivery; Increased urgency for improved factory effectiveness, High factory yield at startup; Reduce wafer and product cost; Satisfy all local regulations
Rapid changes to business needs & demands; Increasing process & product complexity; Larger wafers and carriers, Increased reliance on factory information & control systems