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18 July 2001 Work in Progress – Not for Publication 1 ITRS Factory Integration Technology Working Group (FITWG) Industry Presentation 18 July 2001 Michio.

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Presentation on theme: "18 July 2001 Work in Progress – Not for Publication 1 ITRS Factory Integration Technology Working Group (FITWG) Industry Presentation 18 July 2001 Michio."— Presentation transcript:

1 18 July 2001 Work in Progress – Not for Publication 1 ITRS Factory Integration Technology Working Group (FITWG) Industry Presentation 18 July 2001 Michio Honma, NEC Jeff Pettinato, Intel

2 18 July 2001 Work in Progress – Not for Publication 2 Agenda 1.Scope and Factory Drivers 2.Difficult Challenges 3.Key Technology Requirements 4.Integrated Potential Solutions: Process Control Agile Manufacturing Material Handling 5.Summary

3 18 July 2001 Work in Progress – Not for Publication 3 Factory Integration Group Regional Representatives Europe Klaus Eberhardt Richard Oechsner Claus Schneider Taiwan Hugo Chang JJ Hsu Japan Michio Honma Shoichi Kodama Toshi Uchino Hiromi Yajima US Court Skinner Jeff Pettinato

4 18 July 2001 Work in Progress – Not for Publication 4 Factory Integration Contributing Members Many International members have contributed to FI

5 18 July 2001 Work in Progress – Not for Publication 5 2001 Factory Integration Scope Includes Wafer, Chip and Product Manufacturing Wafer Mfg. Chip Mfg. Product Mfg. Distribution Si Substrate Mfg. The Factory FEOL BEOL Probe/Test Singulation Packaging Test The Factory is driven by Cost and Productivity: Reduce factory capital and operating costs per function Enable efficient high-volume production with operational models for varying product mixes (high to low) and other business strategies Increase factory and equipment reuse, reliability, and overall efficiency Quickly enable process technology shrinks and wafer size changes

6 18 July 2001 Work in Progress – Not for Publication 6 2001 Difficult Challenges Managing Complexity Quickly and effectively integrating rapid changes in semiconductor technologies and market conditions Factory Optimization Productivity increases are not keeping pace with needs Flexibility, Extendibility, Scalability Ability to quickly convert to new semiconductor technologies while reusing equipment, facilities, and skills Post CMOS Manufacturing Uncertainty Inability to predict factory requirements associated with post CMOS novel devices 450mm Wafer Size Conversion Timing and manufacturing paradigm for this wafer size conversion < 65nm after 2007> 65nm through 2007

7 18 July 2001 Work in Progress – Not for Publication 7 Factory Operations FacilitiesMaterial Handling Production Equipment Complexity Management Factory Optimization Extendibility, Flexibility, Scalability Factory Areas or Thrusts Difficult Challenges >65nm thu 2007 Example: Manufacturing rules, production size, mix Examples: Building, cleanroom, utility systems, process fluid delivery Examples: AMHS Transport, storage, ID Systems, interface standards Factory Information and Control Systems Example: MES, Computers, Networks, Process Control Example: Equipment unit, real-time process control, interface standards, Embedded Control Reuse of building, production equipment, and factory information and control systems; Factory designs that support rapid process and technology changes/retrofits; Comprehend tighter ESH/Code requirements Increased customer expectation to meet on time delivery; Increased urgency for improved factory effectiveness, High factory yield at startup; Reduce wafer and product cost; Satisfy all local regulations Rapid changes to business needs & demands; Increasing process & product complexity; Larger wafers and carriers, Increased reliance on factory information & control systems All factory areas must be integrated to solve these Difficult Challenges Includes Wafer, Chip, and Product Manufacturing Technology Requirements and Potential Solutions are expressed through these factory areas

8 18 July 2001 Work in Progress – Not for Publication 8 Key Technology Requirements and Issues 1.Production equipment is not keeping up with Overall Equipment Efficiency (OEE) and Availability targets Ex. 2001 OEE target of 83% vs. actual of 65% for bottleneck equipment 2.Process technology advances are occurring at ever faster rates; factories are expected to ramp and meet yield targets more quickly New equipment for 157nm litho, High K gate stack, Low k dielectrics, SOI, copper will be implemented in factories over the next 2-5 years 3.A 45% reduction in manufacturing cycle times by 2007 is expected for high volume high mix factories 4.Direct transport systems capability must be ready for beta tests during 2002 and HVM implementation by 2004 5.Time required to a) build/ramp new factories, or b) convert/ramp existing factories to new technologies must improve 30% by 2007 6.300mm software standards compliance is not meeting single wafer processing and intrabay AMHS needs

9 18 July 2001 Work in Progress – Not for Publication 9 Integrated Solutions are Essential to Meet Needs Integrated Solutions Agile Manufacturing -Equipment Engineering Systems - EES -Single wafer control -e-Diagnostics Process Control -Fault Detection Capabilities -Feedback & Feed forward Process Control -Machine to machine matching Material Handling -Direct Transport AMHS -AMHS for Send-Ahead wafers -Integrated Sorters, Stockers, Metrology Integrated Factory Technology Requirements New disruptive process technologies 157nm litho High K gate stack Low k dielectrics Copper processing + Improved Productivity Decreased Factory Cycle Time (QTAT) Improved Equipment Efficiency Reduction in non-product (I.e. test) wafer usage More efficient direct labor Faster factory conversion at technology nodes Goal = Meet Factory Challenges and Technology Requirements

10 18 July 2001 Work in Progress – Not for Publication 10 Process Control Potential Solutions Type 1: Fault Detection and Classification Process Equipment Step N UI Fast FDC Module Host System FDC Signal / Data FDC Control Outside of Tool Host determines actions based on type of fault Host issues control command Inside the Tool FDC Models defined / configured FDC host signals configured FDC actions may be configured External FDC Module GEM Interface Potential Solutions Needs Include: Real-time process sensors on process equipment Reporting of real-time data to host system Ability to stop processing at various intervals via host command Factory Software systems capabilities to manage areas and groups of equipment Software I/F Standards Technology Requirement Drivers: Overall Equipment Efficiency Equipment Availability Yield Particle Densities

11 18 July 2001 Work in Progress – Not for Publication 11 Process Control Potential Solutions Type 2: Run to Run Control Metrology Equipment UI Process Equipment UI Metrology Equipment Step N-1 Step N+1 Step N UI Feed Forward and Feedback Control - Use preprocess or post metrology data to adjust processing for that lot GEM Recipe Adjustment Control Parameterized recipes required Metrology data pipeline MES (Equipment Control) Factory Network EE Run to Run Control S/W & Models Recipe Recommendations Detailed wafer and chamber data required EE Network Potential Solutions Needs Include: Reporting of metro data to host system Ability to adjust key recipe parameters at various intervals via host command Relationship between end process results and adjustable process parameters Open software interfaces and standards Technology Requirement Drivers: Overall Equipment Efficiency Optimize Process Performance (for example): Litho Gate CD control (nm) Litho Overlay Control (nm) Diffusion Oxide thickness

12 18 July 2001 Work in Progress – Not for Publication 12 Process Control Potential Solutions Type 3: Integrated Metrology Integrated Process and Metro Equip. UI GEM Parameterized recipes required Host System Equip Controller Factory Network EE Integrated Metrology Module (not Bolt on) EE Network Recipe and Model Selection via remote interface EES Potential Solutions Needs Include: Hardware integration of process and metrology equipment Software integration of metrology and process equipment Single SECS/GEM interface for integrated metrology and process equipment No increase in process equipment footprint No degradation in equipment run rate or availability Technology Requirement Drivers: Factory Cycle Time per Mask Layer Interbay AMHS throughput Intrabay AMHS throughput Metrology data and detailed wafer and chamber data

13 18 July 2001 Work in Progress – Not for Publication 13 Agile Manufacturing Means… Quick turn around [*faster cycle] time for production Quick turn around time without productivity deterioration No productivity reduction even if many lots production formed with few wafers Quick capability to product, scale and technology change Quick ramp-up of equipment installation and product Assure high productivity even if low production volume Speed Product: short ramp-up time Equipment: short ramp-up time Product Quick Turn Around Time (QTAT) Cost Equipment high OEE Product yield high at ramp-up to Satisfy these Requirements…

14 18 July 2001 Work in Progress – Not for Publication 14 Key Potential Solutions Full Automation Equipment Engineering System Fundamental technology Single Wafer Control Multiple lots/single wafer control in equipment module (group) Process Control Fault Detection and Classification Run to Run Integrated Metrology Direct Transportation Real Time Scheduling (RTS) Supply Chain Management (SCM)

15 18 July 2001 Work in Progress – Not for Publication 15 AMHS MES MCS Operators still watch the tool to confirm its health status and do miscellaneous things Suppliers Manufacturing Execution System Equipment Engineering System FAX and telephone be replaced by Internet MES No more operator this side New! e-Diag Capability What will Equipment Engineering Systems (EES) replace?

16 18 July 2001 Work in Progress – Not for Publication 16 Manufacturing Execution System - MES Equipment/AMHS Within a Factory (E-Factory) Factory to Factory (E-Factory) Company to Company (E-Commerce) Factory A Company A Factory B Company B Suppliers Equipment Engineering System e-diagnostics capability Process or Metrology Equipment (side view) Control System Station Controller AMHS Eqpt (side view) Material Control System - MCS Ethernet EES e-Manufacturing Hierarchy firewall

17 18 July 2001 Work in Progress – Not for Publication 17 (EE) The e-Business structure for manufacturing

18 18 July 2001 Work in Progress – Not for Publication 18 Carrier Level integrated Flow and Control Type 1: Sorter and Metrology with Stockers End View Sorter Metro Tools OHT Loop Stocker Stocker robot loads Sorters and Metro equipment Loadports Metro Process Tools Stockers OHT Loop Sorter Metro Tools Stocker robot interfaces directly with Sorters and Metro equip Potential Solutions Require: Standardized Intrabay Operation Integrated Software When Solutions Are Needed: Research Required by 2001 Development Underway by 2002 Qualification/Production by 2003

19 18 July 2001 Work in Progress – Not for Publication 19 Potential Solutions Require: I/F Standard (H/W, S/W) Standardized EFEM Software Integrated Wafer level APC Standardized Intrabay Operation Wafer Level Integrated Flow and Control Type 2: Connected EFEM When Solutions Are Needed: Research Required by 2002 Development Underway by 2004 Qualification/Production by 2005 Wafer Staging Carrier Staging Equipment Supplier A Equipment Supplier B Equipment Supplier C Conceptual Only

20 18 July 2001 Work in Progress – Not for Publication 20 Potential Solutions Require: System controller of Equipment Group Wafer Dispatcher Module structure of equipment Standardized I/F Standardized Width Modular Process Steps High Speed Wafer Transfer Standardized Intrabay Operation Wafer Level Integrated Flow and Control Type 3: Expanded EFEM When Solutions Are Needed: Research Required by 2003 Development Underway by 2005 Qualification/Production by 2006 Conceptual Only Standard Tool Widths

21 18 July 2001 Work in Progress – Not for Publication 21 Potential Solutions Require: Ultra High Speed Wafer Transfer Target M/C to M/C 7sec. Wafer Level Dispatching Wafer Level Integrated Flow and Control Type 4: Continuous EFEM (Revolving Sushi Bar) When Solutions Are Needed: Research Required by 2007 Development Underway by 2010 Qualification/Production by 2013 Target 450mm Single Chamber Process Tool Stocker Metrology Tool Conceptual Only Single Wafer Transport Multi-Wafer Carrier Level Transport

22 18 July 2001 Work in Progress – Not for Publication 22 ….. Supporting System Mfg. System Planning System E-Mfg. Agile-Mfg. Direct Transport Wafer Level Control E- Diagnostic Suppliers SCM Users SCM - Supply Chain Management EES The Next Generation Factory Concept

23 18 July 2001 Work in Progress – Not for Publication 23 Summary 1.Advances in process technology are occurring at ever faster rates 2.Equipment suppliers must deliver stable equipment running new process technologies with very high Overall Equipment Efficiency (OEE) 3.Agile manufacturing systems are needed to quickly ramp new process technologies into high volume production and to achieve cycle time goals 4.Process control and machine to machine matching are needed to get high yields at startup and reduce cycle time 5.Open standards are a Key Part of Potential Solutions 6.We invite and encourage you to participate in FITWG activities to convert these plans to reality


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