Presentation is loading. Please wait.

Presentation is loading. Please wait.

2002 Factory Integration Scope Includes Wafer, Chip and Product Manufacturing Wafer Mfg Chip Mfg Product Mfg Distribution The Factory FEOL BEOL Probe/Test.

Similar presentations


Presentation on theme: "2002 Factory Integration Scope Includes Wafer, Chip and Product Manufacturing Wafer Mfg Chip Mfg Product Mfg Distribution The Factory FEOL BEOL Probe/Test."— Presentation transcript:

1 2002 Factory Integration Scope Includes Wafer, Chip and Product Manufacturing Wafer Mfg Chip Mfg Product Mfg Distribution The Factory FEOL BEOL Probe/Test Singulation Packaging Test Factory is driven by Cost, Productivity, and Speed: Reduce factory capital and operating costs per function Enable efficient high-volume production with operational models for high and low product mixes and other business strategies Increase factory and equipment reuse, reliability, and overall efficiency Enable rapid process technology shrinks and wafer size changes Faster delivery of new and volume products to the end customer Si Substrate Mfg Reticle Mfg Increasing cost & Cycle time implications

2 Factory Integration Requirements and Solutions are Expressed through 6 Functional Areas Process Equipment UI Material Handling Systems Wafer and Reticle Carriers Automated storage systems Interbay & intrabay transport systems Personnel guided vehicles Internal Software & computers Production Equipment Process and Metrology equipment Mainframe and process chambers Wafer Handling Robots, Load Ports Internal software & computers Facilities Cleanroom, Labs, Central Utility Building Facilities Control and Monitoring Systems Power, Plumbing, HVAC, Utilities, Pipes, UPS Life safety systems, waste treatment AMHS Eqpt (side view) DB Document Management MES MCS Network or Bus DSS Station Controllers APC Scheduling + Dispatching DB Factory Information & Control Data and Control systems required to run the factory Decision support Process control Plan, Schedule, Dispatch Computers, databases, software outside equipment Factory Operations Policies and procedures used to plan, monitor and control production Direct factory labor Test Manufacturing Prober, Handler, and Test Equipment Manufacturing processes to test wafers and chips

3 2002 Factory Integration Focus Areas 1.New business requirements driving changes to the factory design Combination of many different industry business models: IDM, Foundry, Joint Ventures, Collaborations, other Outsourcing, etc Faster new product delivery to customers [design to receipt] Integrating the Factory with other parts of the engineering chain (design, reticle mfg…) 2.Implications of 300mm factory sizes reaching 30k-40k wspm on facilities, AMHS, and factory control systems 3.Gaps Factory productivity/Equipment OEE and methods to improve including Equipment Engineering Capabilities (EEC) EEC includes e-diagnostic, fault detection, process control, on-line manuals, spares management etc. 4.Factory modeling needs and gaps to do design analysis, demand planning, optimization tradeoff analysis, etc. 5.Preparing for more focus in 2003 on Assembly and Test Manufacturing driven by costs & complexities

4 2002 Difficult Challenges Managing Complexity Quickly and effectively integrating rapid changes in semiconductor technologies and market conditions Need to integrate the entire product development process Factory Optimization Productivity increases are not keeping pace with needs Flexibility, Extendibility, Scalability Ability to quickly convert to new semiconductor technologies while reusing equipment, facilities, and skills Post Conventional CMOS Manufacturing Uncertainty Inability to predict factory requirements associated with different manufacturing requirements 450mm Wafer Size Conversion Timing and manufacturing paradigm for this wafer size conversion < 65nm after 2007> 65nm through 2007

5 Year of Production Wafer Diameter300mm 450mm High Volume / Low Mix Factory Requirements Factory cycle time per mask layer (non-hot lot) [1,2] (days) Factory cycle time per mask layer (hot lot) [1,2,7] (days) Number of lots per carrier (lot)One Wafer layers/day/head count High Volume / High Mix Factory Requirements Factory cycle time per mask layer (non-hot lot) [2,3] (days) Factory cycle time per mask layer (hot lot) [2,3,7] (days) Number of lots per carrier (lot)Multiple Wafer layers/day/head count Common requirements across Both Factory Types Groundbreaking to first tool move-in (months) First tool move-in to first full loop wafer out (months) Node to Node change-over (weeks) Floor space effectiveness1X Factory Operations Technical Requirements 2003 will propose adding new product cycle time to the metrics (analysis on-going) - Progress lacking in ability to run multiple lots per carrier

6 Year of Production Wafer Diameter300mm 450mm Throughput improvement (run- rate) per year Base+4% New base +4% New base +10 to 12% Relative consumables, chemicals, gases, exhaust, emissions, utiliity <1.0X 200mm -10% -10% Bottleneck equipment OEE75%78%80%82%84%87%88%90%91%92% Average equipment OEE55%58%60%63%65%67%70%72%74%75% Relative maintenance/spares cost<1.0x 200mm <98% <98% Overall factory non-product wafer usage as a % of production <16%<15%<14%<13%<12%<11% <10%<9% % capital equipment reused from previous node Limited>90% >70%Limited>70% Wafer edge exclusion3mm2mm Production equipment lead time: - Order to move-in (Litho)12 mos - Order to move-in (other tools)6 mos - Setup to full throughput capable4 wks Production Equipment Technical Requirements (1 of 2) No significant changes to values - Progress lacking in OEE improvements, NPW reduction

7 Year of Production Wafer Diameter300mm 450mm Process/product changeover time (weeks) Production equipment install and qual cost as % of its capital cost 10%8% 6% 8%6% Process equipment availability>85%>88%>90%>92%>94%>95% Metrology equipment availability>90%92%94%>95%95%>96%>97%>98% Ability to run different recipes and parameters for each wafer PartialYes Max allowed electrostatic field on wafer and mask surfaces (V/cm) Relative capital cost of production equipment <1.3x of 200mm New base New base <1.3x of 300 mm New base Production Equipment Technical Requirements (2 of 2) No significant changes to values - Progress lacking in OEE improvements, NPW reduction

8 Material Handling Technical Requirements (1 of 2) No significant changes to values AMHS system throughput numbers include both 20k and 40k wspm factories + Good progress on AMHS single transport hardware system development Year of Production Wafer Diameter300mm 450mm Material handling total capital cost as a % of total capital cost < 3% < 2% < 3% Wafer Transport system capability Separate interbay/ intrabay Some Separate Some Direct Direct tool Direct tool to tool MTTR (minutes) (SEMI E10) Failures per 24-hour day over total system (SEMI E10) <1 <0.75<0.5 <0.3 System throughput [20k wspm Factory] ·Interbay transport (moves/hour) · Intrabay transport (moves/hour) System throughput [40k wspm Factory] · Interbay transport (moves/hour) · Intrabay transport (moves/hour)

9 Year of Production Wafer Diameter300mm 450mm Stocker cycle time (seconds) Average factory wide carrier delivery time (in minutes) Maximum factory wide carrier delivery time (in minutes) Stocker storage density (% Total WIP carrier volume / Total stocker volume) * Small stocker (%) > 25>30 >40 >50 * Nominal stocker (%)>30>35 >45>50 >60 Material handling equipment lead time (weeks) <16<14<12<11<10<9<8 Material handling equipment installation time (weeks) <8 <7 <6<5<4 System downtime required to extend system capacity when previously planned (minutes) <180<90 <60<30 <1530 Material Handling Technical Requirements (2 of 2) No significant changes to values AMHS system throughput numbers include both 20k and 40k wspm factories + Good progress on AMHS single transport hardware system development

10 Year of Production Wafer Diameter300mm 450mm Availability of mission critical system (%) 99.97% 99.98% 99.99% Mean Time to Recover for mission critical applications (minutes) <30 < Availability of the total factory system (%) 99.80% 99.90% 99.95%99.98%99.99% Peak number of AMHS transport moves supported by material control system (moves/hr) 8, % Factory information and control systems reusable for next node >93% >80% Time to create FICS industry standard (months) <12 <6 4 Lead time for solutions to conform to standards >18<9 <6 <4 FICS cost including integration as a % of capital <2% Ability to run different recipes/parameters for each wafer PartialYes Factory Info & Control Technical Requirements ? Need to assess software systems (scheduling, dispatching, etc) readiness for single transport system - Lead time to create and conform to standards needs additional progress

11 Year of Production Wafer Diameter300mm 450mm Cleanroom area as a % of total site building area 17% Mfg (Cleanroom) area/Wafer starts per month (m2/WSPM) 0.34 Classification of air cleanliness in the manufacturing (cleanroom) area ISO Class 5 ISO Class 6 ISO Class 7 ISO Class 8 ISO Class 9 Power utilization (demand/installed)80%70%80% Gas and chemical purity Discussed in Yield Enhancement Chapter Power and water consumption Discussed in EHS chapter and Process Equipment sections Factory construction time (months) from ground break to all facility ready Facility capital cost as a % of total factory cost (includes equipment) 15% Production equipment install and qual cost as a % of capital cost 10%8% 6% 8%6% Facility operating cost including utilities as a % of total operating cost 13% Utility cost per total factory operating cost (%) 3% Maximum allowable electrostatic field on facility surfaces (V/cm) Facilities Technical Requirements No significant changes to values - Facilities momentum needed to reduce cycle time

12 Key Gaps: 2003 Focus areas for Factory Integration Technology Gaps that Need Attention Today Integrated intrabay readiness for 300mm Factories Ability to run different process parameters for each wafer Production equipment OEE NPW Reduction Hot Lot and normal cycle times for high mix factories Faster Product delivery Efficient Product development Better modeling capabilities Future Technology Gaps and Focus Areas Factory software systems to support Direct Transport AMHS Equipment Engineering Capabilities and Standards Engineering Chain Management Systems Impact of 157nm and Next Generation Litho on the Factory Post Conventional CMOS Manufacturing 450mm Wafer Processing

13 Integrated Solutions are Essential to Meet Needs Integrated Solutions Agile Manufacturing -Equipment Engineering Capabilities -Single wafer control Engineering Chain Mgmt Process Control -FDC, R2R, W2W control -IM and M2M matching Material Handling -Direct Transport for Send Ahead, monitors, hot lots -Integrated Sorters, Stockers, Metrology? Flexible Factory Designs -Quick ramp-up operation -Extend & Scale quickly -Convert quickly Integrated Factory Technology Requirements New disruptive process technologies Next Generation Litho 157nm litho High K gate stack Low k dielectrics Copper processing + Improved Productivity Decreased Factory Cycle Time (QTAT) Improved Equipment Efficiency Reduction in non-product (I.e. test) wafer usage More efficient direct labor Faster factory conversion at technology nodes Goal = Meet Factory Challenges and Technology Requirements

14 IDM Age Foundry/Fabless Age Collaboration Age Fab Transactions and Interlinkage will be flexible and open. Marketing IP Design Foundry IT is a must and Speed is most important Design Fab Design Marketing Foundry IP EP/BP Marketing Design Industry Business Model Is Changing

15 Engineering Chain Management Customers want new products delivered faster [design ship] The Engineering Chain integrates the development flow from design specification to customer delivery for a new product through engineering data exchange Engineering Chain = Design Reticle Process Integration Customer High Volume This is different from supply chain mgmt which focuses on efficient volume production Engineering chain management ensures customer cycle times are met, while new products are properly integrated with the process Supply Chain (O2D) Sales SCP MES Factory Shipping WO WIP Order Promise Design Commerce Data Engineering Data Engineering Chain (T2M) e-Diag Maintenance Support EE Data EES APC Recipe Eqpt. Configuration Mass Production Product Development Process Devmn t YMS Mask Devmn t Eqpt. Devmn t Eqpt. Supplier

16 Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality MetricPotential Solution it is driving Production Equipment Overall Equipment Efficiency (OEE) a)Equipment Engineering Capabilities including: e-Diagnostics, spares management, fault detection, on-line manuals to improve MTTR b)Advanced Process Control to improve output c)Integrated factory scheduling and dispatching capabilities to improve equipment utilization d)Optimized Wafer movement at equipment Ability to run different process parameters for each wafer on equipment a)Implement embedded controller standards b)MES capabilities to handle standard and non- standard operational scenarios Non-product wafers as a % of factory wafer starts a)Techniques to design equipment for reliability b)Advanced Process Control systems Hot-Lot and regular lot cycle time per mask layer for the factory a)Direct transport systems integrated with factory schedulers for tool to tool moves b)Innovative carrier/wafer level control systems

17 Translating Material Handling, FICS, and Test Manufacturing Metrics to Reality MetricPotential Solution it is driving Number of transport types in the factory a)Direct tool transport using conveyors b)Direct tool transport using overhead hoist AMHS system throughput for interbay and intrabay a)Electrical, mechanical, and control systems for transport types: OHS, OHT, RGV, AGV, PGV b)Improved Scheduling/Dispatching for direct tool transport, hot lots, send ahead wafer, etc. Time to create industry standards a)Monthly or Continuous voting cycles to approve b)Use Internet for balloting/approval c)Dedicated resources for development Lead time for solutions to conform with standards a)Develop standards and applications in parallel b)Automated test tools for compliance verification Groundbreaking to first tool move in a)Standardized design concepts b)Design tools including e-tools c)More off-site module construction

18 Continued Standardization is needed to Reduce Integration Time, Cost, and Complexity Process Equipment UI Material Handling Systems Production Equipment Interfaces Automation data interfaces Facilities hook-up Carriers Production Equipment AMHS interfaces Automation data interfaces Facilities hook-up ESD Facilities Height, weight, temperature Equipment Hook-up Safety AMHS Eqpt (side view) Factory Information & Control E-Factory standards (EEC, APC, etc.) Equipment Data Interfaces Company Data Interfaces Security Customer / Supplier Partner Not an exhaustive list Test Equipment Automation data interfaces AMHS interfaces Facilities hook-up ESD Security Firewall

19 Potential Solutions driving R&D Agenda Engineering chain management models, data integration and interface standards Factory capacity planning and supply chain management systems integrated with actual factory data Internet based Manufacturing and Engineering systems Advanced Factory/Mfg Modeling Tools and Capabilities Equipment Engineering Capabilities (EEC) e-diagnostic, fault detection, advanced process control, on-line manuals, spares management, etc. Scheduling, Dispatching, and MES integration for Direct Transport AMHS Additional Industry Standards for Equipment, AMHS, Facilities, and Information/Control Systems

20 Key Messages 1.Improving the Factorys Cost, Productivity and Speed is essential 2.Business strategies, market demands, and process technology changes continue to make factories difficult to integrate 3.More focus must be spent on new product development and high mix factory cycle times 4.Gaps in Production Equipment OEE, Factory NPW usage, and Factory modeling must be improved. 5.e-Factory concepts are being developed to solve complexity, integration and equipment OEE issues 6.Standards have been very effective in 300mm, but must be implemented more consistently in some areas 7.More focus must be given to Post-Fab manufacturing (Assembly, Test, etc.) to improve productivity

21 No Significant 2002 Changes to ESD Requirements Facilities Technology Requirements Test Manufacturing Technology Requirements Was Maximum allowable electrostatic charge on devices nC V nC V nC V 1.0 nC 100V 1.0 nC 100V 0.5 nC 50V 0.5 nC 50V 0.1 nC 10V 0.25 nC 25V 0.25 nC 25V nC V nC V nC V 1.0 nC 100V 1.0 nC 100V 0.5 nC 50V 0.5 nC 50V 0.1 nC 10V 0.25 nC 25V 0.25 nC 25V Is Maximum allowable electrostatic charge on devices Facility electrostatic levels stds The SEMI ESD Task force is currently working on a new document to define facility electrostatic levels. First ballot expected March Change color to blue – under development Facilities Standards No data available to support changing the values in the tables SEMI ESD Task Force working on a document for electrostatic compatibility in the factory – most likely data source for changes Production Equipment Technology Requirements


Download ppt "2002 Factory Integration Scope Includes Wafer, Chip and Product Manufacturing Wafer Mfg Chip Mfg Product Mfg Distribution The Factory FEOL BEOL Probe/Test."

Similar presentations


Ads by Google