1. New Build Up Process Neo Manhattan Bump Interconnection (NMBI) NMBI Bumped Cu Foil Process Comparison NMBI Key Features, Design Features Substrate Technical Trend LG Electronics / DMC Div. 7/24

2. LG Electronics / DMC Div. NMBI - Etched Cu Bump with Cu Foil NMBI Cu Bump(SEM) NMBI NMBI + B 2 it Cu Foil Cu Bump NMBI Mass Lam (2+2+2) NMBI 8/24

3. New Development of Core PCB Interconnect Method NMBI High Reliability compared to convention Cu plated TH, Fine Interconnection for High Density PCB A very stable electrical & Mechanical interconnect structure has been achieved Cu/Cu Metallic Connection Zoom in LG Electronics / DMC Div. 9/24

4. NMBI Photo-via,Laser-viaB 2 it(Toshiba)NMBI + B 2 it Production Process Comparison Process Cross section Diagram Min via Dia. Min Land Dia. Stacked Via Φ 150 ㎛ Φ 300 ㎛ Impossible Φ 200 ㎛ Φ 300 ㎛ Possible Less than Φ 100 ㎛ Less than Φ 200 ㎛ Possible Strong points Simplified process enables cost reduction Enables easier stacking of via Enable easier reduction of via sizes One-step batch processing of various via sizes Weak points Numerous process steps Significant time required for via formation Significant capital investment required for laser equipment Thermal excursions and surface planarization induce dimensional instability, making multi-layer build -up structures more difficult to fabricate Difficult to reduce via diameter Not possible to form via of difference size in a one-step process LG Electronics / DMC Div. 10/24

5. NMBI LG Electronics / DMC Div. 12/24

6. NMBI LG Electronics / DMC Div. 13/24

7. NMBI High Density Design Land-less Fine Pitch Pattern Fine Pitch Bump(Via) NMBI - Land-lessLaser Via Number of Lines LG Electronics / DMC Div. 14/24

8. NMBI(Key Feature) LG Electronics / DMC Div. 15/24

9. NMBI(Key Feature) LG Electronics / DMC Div. 16/24

10. NMBINMBI(Key Feature) LG Electronics / DMC Div. 17/24

11. NMBINMBI(Key Feature) LG Electronics / DMC Div. 18/24

12. 19/24 NMBI LG Electronics / DMC Div.

13. ItemConditionResultNo 1 Peel StrengthPeeling Speed 500mm/minOK 1.0kg/cm 3Pads Pull Strength90/ Pull head Speed :10mm/min 2 ｋ g/mm 2 2Insulating VoltageDC500V, 60secNo damage 4 Hot Oil (Thermal Shock) 260 ℃（ 10sec ）⇔ 20 ℃（ 20sec) 100Cycl e Conductivity Changing Ratio less than 10% Bending ±10 ％ Bending 100 Cycle 5 6 Ｖｉａ Resistance 2 ｍ Ohm/Via Conductivity Changing Ratio less than 10% Spec. 20/24 LG Electronics / DMC Div. Reliability Test Results