Presentation on theme: "Components: packaging & assembly technologies for planar interconnects Jianfeng Li, Alberto Castellazzi, Mark Johnson PEMC Group, University of Nottingham."— Presentation transcript:
Components: packaging & assembly technologies for planar interconnects Jianfeng Li, Alberto Castellazzi, Mark Johnson PEMC Group, University of Nottingham Tel: +44 (0)115 846 6890 Email: Jianfeng.Li@nottingham.ac.ukJianfeng.Li@nottingham.ac.uk Industrial partners: MTC, Dynex
Work area: new substrate/flex combination and integrated assembly processes Semi-flexible or CTE-matched laminates that can be used to deliver reliable and cost- effective planar interconnect solution ●Wire bonds and bus bars have high parasitic inductances Electrically insulating substrates that have high thermal conductivity coupled with low CTE ●Al 2 O 3, AlN and Si 3 N 4 -based substrates have either low thermal conductivity and/or low mechanical strength Schematic of a conventional power module Multiple wire bonds to achieve interconnects Combined PCB/power module manufacturing processes ●Wire bonding is a time consuming manufacturing process
Project Plans & Objectives March 2014 to January 2015: first evaluation of flex interconnect technologies ●Design optimisation of the semi-flexible or CTE- matched laminates ●Exploration of corresponding substrate materials and technologies ●Demonstration of the manufacturing processes for both the flexible PCB and the planar power modules ●Preliminary evaluation of reliability for the interconnect technologies Cross section of a conventional flexible PCB Flexible PCB in a planar power module (not including all components)
Potential Outcomes & Exploitation Plans Report on the relevant technologies Support to construct component demonstrators Publications Extension of industrial collaboration
Input from the PE Community A Buddy scheme would promote the Cross Theme activities and collaboration KTN dissemination events would help to introduce the research results to wider PE community
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