L0 Module Testing and Analog Cable What we built so far: –No.3 First prototype with SVX4 (L1 hybrid) –No.4 with irradiated sensor –No.5 Installed on the.

Slides:



Advertisements
Similar presentations
Mechanical/Thermal Measurements T. Bowcock, J. Carroll.
Advertisements

Status of Sensor and Hybrid Production LHCb Zurich Week T. Bowcock.
Lyon Gantry Status TEC meeting Dec D. Contardo Module production in Lyon Rigidifier test on R4 Frame tolerance effect on assembly plates Short term.
Layer 0 Grounding Requirement in terms of noise performance Grounding/Shielding studies with L0 prototype Summary Kazu Hanagaki / Fermilab.
Design Ash finished electric hybrid tracing to connector fields –Changes to allow for HCC-less and HCC running on one hybrid awaiting final confirmation.
General needs at CERN for special PCB’s Philippe Farthouat CERN.
November Vertex 2002 Kazu Hanagaki1 Layer 0 in D0 Silicon Tracker for run2b Kazu Hanagaki / Fermilab for D0 run2b Silicon Tracker group Motivation.
LHCC referees meeting, 10 October 2005Børge Svane Nielsen, NBI1 Status of the FMD LHCC referees meeting, 10 October 2005 Børge Svane Nielsen Niels Bohr.
1 Module and stave interconnect Rev. sept. 29/08.
Brenna Flaugher Oct. 31 th CDF Meeting1 RunIIb Silicon Project Successful Lehman Review Sept Workshop at LBL 10/23-10/25: Wednesday-Thursday  hybrids.
The LHCb Inner Tracker LHCb: is a single-arm forward spectrometer dedicated to B-physics acceptance: (250)mrad: The Outer Tracker: covers the large.
STATUS OF THE CRESCENT FLEX- TAPES FOR THE ATLAS PIXEL DISKS G. Sidiropoulos 1.
Performance of the DZero Layer 0 Detector Marvin Johnson For the DZero Silicon Group.
IBL Mock Up IBL Mock Up MANUFACTURING 2011/04/29 François-Xavier NUIRY Maxence CURDY Andrea CATINACCIO CERN PH/DT/PO 1.
Analog Cable Status Basic design fixed --- the latest cable has good quality. (report by Frank) Capacitance for single cable ~0.35pF/cm --- both new and.
VELO upgrade electronics – HYBRIDS Tony Smith University of Liverpool.
March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review1 M. Garcia-Sciveres LBNL & Module Assembly & Module Assembly WBS Hybrids Hybrids WBS.
17/06/2010UK Valencia RAL Petals and Staves Meeting 1 DC-DC for Stave Bus Tapes Roy Wastie Oxford University.
Mickael Frotin– 07/06/2009 Demonstrator - Assembly ECAL meeting - London.
Mickael Frotin– 15/01/2010 ECAL MACHANICAL R&D ECAL meeting - PARIS 1.
LHCf Arm2 – status of hardware upgrade in Firenze Lorenzo Bonechi 20 December 2013.
High Density Interconnect (WBS 1.4.3) Extension Cables (WBS 1.4.4) Douglas Fields University of New Mexico Douglas Fields, FVTX DOE Review November 17,
M.Oriunno, SLAC Stave cable and module options. M.Oriunno, SLAC Background - module The IBL electrical unit for data output is a single chip The use of.
CERN Rui de OliveiraTS-DEM TS-DEM Development of Electronic Modules Rui de Oliveira CERN CERN hybrid production experience (or how to stay out of trouble)
C. Haber 6-Mar-08 Integrated Stave Electrical/Mechanics/Cooling Update March 6, 2008.
Marc Anduze – 09/09/2008 Report on EUDET Mechanics - Global Design and composite structures: Marc Anduze - Integration Slab and thermal measurements: Aboud.
Silicon Meeting July 10, 2003 Module and Stave Production Status James Fast Fermilab.
Company Confidential 1 © 2005 Nokia V1-Filename.ppt / yyyy-mm-dd / Initials Silk display window assembly How to laminate display, touch sensor and metal.
PXL Cable Options LG 1HFT Hardware Meeting 02/11/2010.
Module Development Plan I believe that we are ready to proceed to a program to demonstrate a PS module based on “2.5 D” interconnections. This is based.
Ronald Lipton PMG June Layer 0 Status 48 modules, 96 SVX4 readout chips 6-fold symmetry 8 module types different in sensor and analog cable length.
Design Discussion of Mechanical / Electrical Interfaces Bill Cooper (Fermilab) (Layer 1) VXD.
The Inclusive (Measurement ) FVTX aka iFVTX sponsored by LANL-DR in FY ‘06-08 FPIX Chip Module/Hybrid Testcard Pixel Plane Assembly/Integration.
Hybrid/Analog cable PRR 2/12/2004 Layer 0 hybrid A.Nomerotski Production Readiness Review Outline  History  Design  Prototypes  Results  Documentation.
Ronald Lipton Layer 0 Status PMG Sep Status of the Layer 0 Project – emphasis on hardware status, preproduction, and preparations for shutdown work.
Baby MIND coil modules assembly the aluminium folded strip solution 1 Alexey, Philippe, Gabriella, Helder, Herman Baby Mind Magnet CERN June.
Grounding Studies Metal box sensor SVX4/hybrid Analog cable GND(20W)
Thermo-mechanical petal status Sergio Díez Cornell 23Jan 2015.
BNL Role In ITK 1.Current R&D Roles 2.Proposed Production Role 3.Activities now until TDR (early 2017) 4.Resources and Infrastructure 5.Personnel 1 D.
MFT WG5: ladder disk and global assembly Stéphane BOUVIER & Sébastian HERLANT MFT WG7: Mechanics and Thermal studies Jean-Michel BUHOUR & Emili SCHIBLER.
Stave Hybrid/Module Status. Modules Stave Module Building 2 Mechanical Chip Gluings Mechanical Wirebonding Electrical Chip Gluings Electrical Wirebondings.
A.Nomerotski,2/3/ Layer0 Status Andrei Nomerotski 2/3/2005 Outline  Introduction  Module Production  Assembly of Layer0  Electronics  System.
Proposal for the assembly of the PHOBOS ring counters (H.P. 3/20/98) I would like to propose and discuss with you an alternative layout and assembly procedure.
Possible types of module Si/W CALORIMETER CONCEPT Si/W CALORIMETER CONCEPT G.Bashindzhagyan Moscow State University June 2002 Internal structure (not in.
Construction and Status of the Origami Module Prototype C. Irmler, M. Friedl HEPHY Vienna.
PS Module Ron Lipton, Feb A bit of History During much of the conceptual design phase of the outer tracker we had focused on the “long barrel”
March 25, FVTX Monthly/Quarterly Report June, 2009 Technical Status, Cost & Schedule Melynda Brooks, LANL.
Silicon Meeting July 10, 2003 Module and Stave Production Status James Fast Fermilab.
WP7&8 Progress Report ITS Plenary meeting, 10 June 2014 LG, PK, VM, JR.
D0 PMG, May 04, 2000 Slide 1 Schedule DØ SMT Status Report.
DOE CD-2/3a Review of the BTeV Project – December 14-16, BTeV Pixel Detector Pixel Module Assembly and Half-Plane Assembly Guilherme Cardoso James.
A New Inner-Layer Silicon Micro- Strip Detector for D0 Alice Bean for the D0 Collaboration University of Kansas CIPANP Puerto Rico.
C. Haber / M. Gilchriese Integrated Stave Electrical/Mechanics/Cooling Update February 6, 2008.
1 FANGS for BEAST J. Dingfelder, A. Eyring, Laura Mari, C. Marinas, D. Pohl University of Bonn
1 1F.Bosi, M.Massa, SuperB Meeting, Isola d’Elba, May 31, 2008 Update on Thin Mechanics/Cooling R&D for the Layer 0 of the SuperB Factory F. Bosi - M.
Origami and Cooling 24th September 2012 C. Irmler (HEPHY Vienna) Joint PXD and SVD Meeting Göttingen.
SLHC SCT Hybrid (CERN 2nd July 2007)1 SLHC SCT Hybrid Concept Ashley Greenall The University of Liverpool.
PIXEL 2000 P.Netchaeva INFN Genova 0 Results on 0.7% X0 thick Pixel Modules for the ATLAS Detector. INFN Genova: R.Beccherle, G.Darbo, G.Gagliardi, C.Gemme,
Mechanical robustness & associated tension at the DSSD slant part connection Mar-5 th 2013 B2GM KEK S. Uozumi (KNU), T. Tsuboyama, N. Sato (KEK)
Noise & Grounding Andrei Nomerotski (U.Oxford) 17 July 2007.
T. Bowcock University of Liverpool
Update on Pavia MM mechanical prototype
Markus Friedl (HEPHY Vienna)
ob-fpc: Flexible printed circuits for the alice tracker
detector development readout electronics interconnects bump bonding
Superattenuator for LF and HF interferometers
Equipment for Assembly – UK Experiences
Studies of Quad Pixel Module assembly using paper laminate
Tracker Outer Barrel Silicon
Possible types of Si-sensor: SILICON CALORIMETRY FOR A LINEAR COLLIDER G.Bashindzhagyan, Il Park August Silicon sensor.
Presentation transcript:

L0 Module Testing and Analog Cable What we built so far: –No.3 First prototype with SVX4 (L1 hybrid) –No.4 with irradiated sensor –No.5 Installed on the support structure –No.6 has 10 chip hybrid with two sensor – very good for systematic comparison in the cable and spacer studies. –No.7 First prototype with L0 hybrid (with cut sensor) –No.8 in progress (L0 hybrid with new chip and un-cut sensor) –No.9 in progress (ditto) Characterization of single module is in good shape. 4 or 10 chip hybrid L0 hybrid

No.7 module with L0 hybrid

Goal – L0 module Simultaneous read out of multiple modules on the support structure. –No. 8 and 9 will go to the structure  B-sector because of the wider sensor. –Two for A-sector, two for B-sector would be the ideal  should we build two more for A-sector? But the cut sensor is not happy so far. Is it impossible to use the un-cut sensor for A-sector??? –Question: can we use the prototype hybrid support by UW???

Goal – Analog Cable Finalizing the analog cable design. –>500  m space under the bottom cable.  Is there such thick Kapton?  foam material suggested by Jim. –We still don’t understand the reason why we don’t see the non dependence of noise on the spacer  I propose to have ~140  m thick spacer between each cable. (The original plan was 200  m thickness, but the effective dielectric constant can be lowered.) –Electrically pre-laminated cable seems to be OK.  we need to choose the solution.

Spacer prototype

Pre-laminated or not – Analog Cable Dyconex wants to (probably) use a 3M adhesive film (APAS 1592 ?) specially designed for adhering stiffener to flex circuits –Liner: polyester, adhesive film contains polyolefin –Radiation hardness is very questionable –epoxy based adhesive would be much better in that respect company is not very keen to do this lamination job and a technical support/help from us (U Zurich) would probably become necessary prototype work on cable assembly at Sidet has made very good progress and there is no reason not to believe that it can be done very well at Sidet Quoted from Frank’s slide

assembly at Dyconex would probably make only sense if they also produce the spacer (Kapton meshes) we know that Compunetics is able to do nice kapton meshes with minimal material at very low cost having in mind the costs for the few Dyconex Kapton meshes (the ones with the holes) we ordered, it seems unlikely that they will even come close to Compunetics’ price Consequence: Spacer from Compunetics. Dyconex for only single cables (no lamination). We are very close to finalize the analog cable design. Pre-laminated or not – Analog Cable

Issues on Spacer The shape follows the analog cable. Only the difference is the length. The location, or how it should be glued on the cables. sensor ceramic spacer for bonding analog cable mesh spacer glue applied