1. D0 PMG, May 04, 2000 Slide 1 Schedule DØ SMT Status Report

2. D0 PMG, May 04, 2000 Slide 2 Ladder and Wedge Production p Axial detectors (3-chip): –Ladders being retrofitted due to grounding problem –Finishing last few ladders needed p 2 o detectors (9-chip): –Production paced by HDI availability –can restart at >8/week when HDIs received –Sensor supply not pacing production, original order complete this month »Overall supply of +2 deg. after yield may fall short »50 additional wafers entered into system for reorder »Fallback for spares: ] use sensors with higher bias resistance p 90 o detectors (6-chip): –87(/144) sensors built so far –Paced by Micron delivery, 13 delivered in so far in May p F Wedges (14-chip): –Production in progress, paced by testing –Micron order complete, ~18 spare on shelf –Eurisys order is late. »Waiting for 25 sensors to clear customs »Next batch this month p H Wedges (6-chip): –~180 half wedges produced to date –Sensor delivery on schedule –Glued 25 full wedges of which ~15 grade A –changed encapsulant to more flexible material to avoid stresses on bonds –Concentrating on full wedge production and disk assembly

3. D0 PMG, May 04, 2000 Slide 3 High Density Interconnect (HDI) p 9-chip hdi’s –All Be pieces needed received. –37 (34 + 3) hdi’s sent to Promex for stuffing »10 passed - ladders built »27 developed surface bubbles: ] 23 now repaired and are under test, 4 not recovered –40 HDIs at now Promex for assembly –34 flex circuits still needed from Compunetics –pacing 9 chip ladder production p F-wedge HDI’s –All components for HDI’s in hand: Be, jumpers, flex –23 HDI’s at Fermilab for wedge production –50 recently stuffed under test –26 HDI’s at Promex p H-wedge hdi’s –All flex in hand –60 being laminated –30 received from Silitronics; 20 at Fermilab

4. D0 PMG, May 04, 2000 Slide 4 Production Status

5. D0 PMG, May 04, 2000 Slide 5 Production Status for first half cylinder p All detectors for 1st 1/2 cylinder produced –not all tested, but OK assuming yields hold up p 4 flavors of 9-chip ladders; current status: “short tails”

6. D0 PMG, May 04, 2000 Slide 6 Barrel / Disk Assembly p 69/72 ladders installed in first barrel p May have to reground some ladders p Installation of ladders for second barrel started; 6 installed ladder installation radially outward. p First ring assembled ~5/10/2000 p Oversight on cable placement, need to reinstall some wedges p Behind schedule, but lag can be made up rapidly Barrels p Installed 4 wedges on first ring, pORC needed p CMM programming and use of rotary table understood p Mechanical assembly of first ring in the next few weeks. p Not a schedule issue H Disks Assembly Note: We haved changed our plans from the original schedule which assumed immediate integration of the 1st barrel/disk module - we will perform readout separately F Disks p Half cylinder cut p cable cut-outs being made at outside (water jet) shop p Preparing for fit-up of H disk supports in Sci-Fi

7. D0 PMG, May 04, 2000 Slide 7 Readout and Cabling Low Mass Cables p Readout system being prepared for full readout of barrel / disk assembly p Start with 1st F ring (rather than barrel) p Need pORC ~ next week p First test with full assembly and cooling p Channels read out limited by interface card supply, have 4, hope for 15 in June p Supply of cards for 1st half cylinder installation and testing will be insufficient, increase pre- production number? Readout p Low mass cables must be installed before move to D0. p Cable production data from Honeywell : p 820 cables started, 166 produced, 360 needed for first 1/2 cylinder (including spares) p delivery expected at 56/week p ~4 week post processing and testing p First half cylinder done ~ end of July p Cables may be pacing item in delivery to D0, watch carefully