1. Origami and Cooling 24th September 2012 C. Irmler (HEPHY Vienna) Joint PXD and SVD Meeting Göttingen

2. Origami PCBs 3 types of 3-layer Origami PCBs: –backward (-z), short tail –center (ce), for central sensor, long tail –forward (+z), routed along slanted sensor, complex shape 2TWEPP 2012, C. Irmler (HEPHY Vienna)19th September 2012 -z ce +z

3. Origami PCB – connector area Many connections and vias No space for additional hole Need to fulfill electrical design rules Crosstalk Voltage drop 3C. Irmler (HEPHY Vienna)24th September 2012

4. Pitch Adapters All available in single- and double-layer designs Which type shall we use? Depends on wire bonding Proposal: –PA0: double-layer –PA1/PA2: single-layer Pad size vs. flexibility 4TWEPP 2012, C. Irmler (HEPHY Vienna)19th September 2012 Bond pads of single-layer PAs

5. Origami cooling concept 5C. Irmler (HEPHY Vienna)24th September 2012 Cooling pipe Single cooling pipe for several ladders –Half layer connected –Little space for connections –Outer  1.6 mm Custom fixture to hold the pipe

6. Cooling contact – pipe on APV25 chips Requirements: Re-mountable cooling coil (no glue …) Easy and safe mounting (bond wires …) Electrically isolating Radiation hard material Avoid stress at sensor Efficient heat transfer –large contact area –adjust height differences of APVs –thermally conductive gap pads 624th September 2012C. Irmler (HEPHY Vienna)

7. Thermal simulations Thermally conductive gap Pads Heatload/APV: 0.35W Coolant temperature: -20°C Tube: stainless steel AISI 316L, wall 50μm Gap pad: 86/125 Keratherm λ [W/mK]: 1.5W/mK Very soft, 1mm thick Radiation hardness?  Will be tested in October 24th September 2012C. Irmler (HEPHY Vienna)7

8. Pipe fixture – first concepts Prototype 'big' screw clamp One part clamp Screws Too bulky Structure is fragile and the contact surface is small Large force necessary to snap tube into the clamp 24th September 2012C. Irmler (HEPHY Vienna)8

9. Pipe fixture – improved design Hinge clamp: PEEK G450 micro water jet cutting –fabrication tolerance: 0.01mm –Max. wall thickness:20mm –Min. inner radius:0.1mm Disadvantage: 2 parts First prototypes delivered Used on 2-DSSD module 24th September 2012C. Irmler (HEPHY Vienna)9

10. Tube fixture Displacement simulation Necessary displacement UX = -0.4mm Acting force 1.4N 24th September 2012C. Irmler (HEPHY Vienna)10

11. 2-DSSD Module before attaching pipe 11TWEPP 2012, C. Irmler (HEPHY Vienna)19th September 2012 Top and bottom views (w/o cooling pipe)

12. Cooling pipe mounting Clamp bases glued onto Origami PCB Keratherm strips placed onto APV chips Pipe put into camp bases Clamps closed 12C. Irmler (HEPHY Vienna)24th September 2012

13. Final module with cooling pipe 13C. Irmler (HEPHY Vienna)24th September 2012 Ready for beam test

14. First experiences with hinge clamp Attaching of clamp fairly easy –handling of small cap, slightly dangerous –could be lost Pipe used for alignment –need a secure procedure for ladder production Strength of Clamp lower than expected –opens when using 1 mm thick pads –proper function with 0.5 mm thick pads –cap can slide off  needs to be secured Annekathrin is working on a new single part clamp 14C. Irmler (HEPHY Vienna)24th September 2012

15. Performance cooling contact Performed one source run with CO2 cooling Currently no temperature sensors at the 2-DSSD module –will attach one on inlet and outlet, respectively Monitored bias currents of sensors –decreased from ~10µA down to ~2µA –indicates proper cooling contact The thermal conductivity of pad seems to be sufficient  further tests required. 15C. Irmler (HEPHY Vienna)24th September 2012

16. 2-DSSD Origami Module Performance So far the module works well Even though shorts due to bonding problems Ready for beam test in October 16C. Irmler (HEPHY Vienna)24th September 2012 preliminary

17. Improved version of one part clamp 17C. Irmler (HEPHY Vienna)24th September 2012 Material: PEEK Improved shape Requires less force to insert pipe Prototypes will be ordered soon Clamp force –2 versions: ~3N ~5N R=0.8mm

18. Summary First prototypes of hinge clamp received Mounted onto 2-DSSD Origami module First experiences –easy to mount, but consists of 2 small parts –could be stronger Improved design of spring clamp 2-DSSD Module –cooling pipe attached –ready for beam test. 18C. Irmler (HEPHY Vienna)24th September 2012

19. Thank You 19C. Irmler (HEPHY Vienna)24th September 2012

20. Spare Slides 20C. Irmler (HEPHY Vienna)24th September 2012

21. Thermally conductive Gap Pad Responsible for Origami cooling: Annekatrin Frankenberger Selection of thermally conductive materials with different properties. 21C. Irmler (HEPHY Vienna)24th September 2012 86/125 Keratherm 2000S40 Bergquist 575-NS Parker Chomerics Sil Pad 800 Bergquist λ [W/m K] 1.52.01.21.6 Hardness [Shore 00] 103070Shore A 91 Thickness [mm] 0.5 - 50.5 – 3.10.5 – 2.50.1 Silicone xx--x Radiation hardness ???x  Gamma irradiation tests (@ Mol in October)

22. Thermal simulations Thermally conductive Gap Pads Heatload/APV: 0.35W Coolant temperature: -20°C Tube: stainless steel AISI 316L, wall 50μm Gap pad: Sil Pad 800 Bergquist λ [W/mK]: 1.6W/mK Hardness Shore A: 91 Thickness: 0.1mm  good contact? Adjusting unevennes? 24th September 2012C. Irmler (HEPHY Vienna)22