1. Ronald Lipton PMG June 7 2005 Layer 0 Status 48 modules, 96 SVX4 readout chips 6-fold symmetry 8 module types different in sensor and analog cable length

2. Ronald Lipton PMG June 7 2005 L0 Status Layer 0 consists of: –48 sensor/analog cable/readout modules of 8 types 7 and 12 cm sensors x 4 analog cable lengths SVX4 readout chips, BeO hybrids Digital jumper cables –Carbon Fiber Support structure –Readout Components Junction cards/twisted pair cables/adapter cards –Installation components Supports attached to the Run2a SMT structure Tooling to install and align Layer 0 and extract the Run2a beampipe hybrid Analog cable SVX4 sensor Pitch Adapter

3. Ronald Lipton PMG June 7 2005 Module Quality All modules are built 8 of each type (6 needed) Require: <1.5 mA current no pinholes <4 bad or noisy channels Have one good spare for each type (one marginal)

4. Ronald Lipton PMG June 7 2005 Component Status Modules – done Digital jumper cables – done (spares still being assembled at KU) Carbon Fiber Support structure – done Readout Components –Junction cards – done –Twisted pair cables – done –Adapter cards – done Installation components being fabricated –Supports attached to the Run2a SMT structure –Tooling to install and align Layer 0 and extract the Run2a beampipe

5. Ronald Lipton PMG June 7 2005 Module Installation 48 to install, started June 2 Problems with the stability of the CMM slowed the start Two sets of fixtures. Plan to install two modules/day (north+south). Procedure –Remove vacuum, electrical test of previously installed modules –Glue on foam spacers –Measure locations of previously installed sensors –Glue on next sensor/hybrid pairs –Allow to cure overnight Scheduled for 6 weeks –Six facets (3 inner, 3 outer) –Stop after inner layer is complete for ~2 week electrical test –Assumes 1 additional day/facet for rotation and alignment

6. Ronald Lipton PMG June 7 2005 Module Installation

7. Ronald Lipton PMG June 7 2005 System Tests and Grounding Layer 0 performance depends on the grounding scheme developed for Run2b –Carbon fiber cocured with kapton ground mesh –Low inductance connections to sensors and hybrids –Isolation of adapter card grounds to break ground loops –Minimum gap between analog cables and conductors (mesh spacers) A series of system tests have been performed with pre-production modules beginning last fall. –Used mechanical prototype support structure (electrically good) –Installed 10 modules (in stages). Good overall noise performance Effects of digital signals on hybrid coupling to analog cable (negligible at 396ns bandwidth) Pedestal splitting (also negligible at 396ns bandwidth) Verified need for low impedance grounding –Checked that there is no effect of adding modules on adjacent facets, opposite ends –Tested effect of a signal generator on CF support

8. Ronald Lipton PMG June 7 2005 Full System Tests Two parallel efforts: Full system test at Sidet –Plan to read out full Layer 0 with final electronics. 10 electrical modules already read out –First stage inner layer only end of June –Found timing problems – addressed by sequencer firmware changes Hybrid strings installed at Dzero, test crate 79 –Testing with conditions similar to operations Use real DAQ with Trigger Framework –Preparation and exercising of online software –See similar timing problems which still need to be addressed –Test crate progress slow – have now resolved interference with normal data taking – should make faster progress ungrounded

9. Ronald Lipton PMG June 7 2005 Dzero Installation Tooling Layer 0 is installed by bringing the detector in through the EC beam pipe, a carbon fiber installation pole is passed through the SMT, picks up Layer 0 and guides it through the SMT. Carbon fiber insertion tools –Half of “long tool” built, second, tapered half should take ~2 weeks Stages and support tables designed, stages have been received Alignment and coupling tooling –Reuse parts used for aperture survey last Fall –Junction card support being fabricated –Layer 0 to SMT couplings partially fabricated, some redesign to provide more compliance in supports Need to fabricate Layer 0 to insertion tool coupling sections Expect to begin Lab 3 tests in the beginning of July

10. Ronald Lipton PMG June 7 2005 Installation Sequence Long tool inserted Through SMT Layer 0 connected to tool L0 partially inserted in SMT Layer 0 in installed position

11. Ronald Lipton PMG June 7 2005 Cabling Run 2a Support DJ cables in insertion position DJ cables in installed position Junction Cards (12/side) Twisted pair cables (not shown)

12. Ronald Lipton PMG June 7 2005 Cabling Preparation –Decable and remove H disks –Remove outer H disk low mass cables –Install adapter cards, LV wire gauge transitions, temperature monitor interface cards on horseshoe Installation –Connect DJCs to junction card/twisted pair assembly and secure to junction card ring Test readout –Connect 12 temperature monitor cables –Insert and recable inner H disks 4 ch. Adapter Card at HorseShoe

13. Ronald Lipton PMG June 7 2005 Schedule Summary

14. Ronald Lipton PMG June 7 2005 Schedule (April 05 update) Milestones we are watching: Begin module installation (June 2) –Completion of inner layer (June 21) Two weeks of testing –Completion of module installation (July 27) Four weeks of testing Complete and ready to move (Sept 16) D0 Installation –Test fixtures at Lab 3 (June 20-July 20) –Modify and complete (July 21-Aug 30) Ready for mechanical installation Aug 30 We assume that Layer 0 needs to be available at the start of the shutdown