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Thermo-mechanical petal status Sergio Díez Cornell 23Jan 2015.

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Presentation on theme: "Thermo-mechanical petal status Sergio Díez Cornell 23Jan 2015."— Presentation transcript:

1 Thermo-mechanical petal status Sergio Díez Cornell 23Jan 2015

2 Petal thermo-mechanical “project”  “Deliverables” at the end of 2016: 14 petal cores of several flavors, 2 of them thermo- mechanical and the rest for module mounting 23 Jan 2014 2

3 Facings and bus tapes  Bus tapes at Liverpool, ready for co-curing  T. Jones merged.dxf files of bus tape with CAD files for facesheets: Found a 1.4 mm misalignment of locking point pin, which he was planning to use for alignment: Need to double check this again! Still go ahead for this round of petals? Edges of bus tape (>2 mm of Kapton will still make up for the misalignment. Cutting tool (at DESY) will get overall shape correct Not so much worried about bonding pads, only interested in the power lines for these prototypes 23 Jan 2014 3

4 Honeycomb  Both CF and N636 honeycombs in hand at DESY  First petal in CF  Second petal in N636 Issues with N636 grinding due to epoxy content, also observed in the past by Liverpool Several companies even refused to do it!  Both the CF and N636 will be milled in-house at DESY (same approach as petalets) 23 Jan 2014 4

5 Pipes  Tool for pipe bending manufactured and already used at DESY successfully  Pipes undergoing brazing of StSt fittings (did that already for the petalets)  Barely enough pipes for 5 petals, would join common order 23 Jan 2014 5

6 High T conductivity foam  Allcomp foam in hand at DESY, enough for ~10 petals  Allcomp K9 130 ppi 0.23 g/cc, 20 W/m·K min (measured ~ 0.22 g/cc, 40 W/m·K by Allcomp on our piece)  Gluing of pipe into foam? Pre-sealing foam (BNL’s approach)? Follow petalet approach (glue dispensing with syringe on foam)? No strong preference from my side 23 Jan 2014 6

7 E breaks  Will not be included for now 23 Jan 2014 7

8 Top and bottom closeouts  Top and bottom closeouts already manufactured at DESY (4 sets)  Diameter for E break too tight! Caused some cracking in several samples Will adjust to 2.3 mm OD in next round, since E breaks will not be included  Slight bending on the longest part We still need to characterize the extent of it  Annealing of PEEK as suggested by our US colleagues  Simplified annealing procedure, since we don’t have a climate chamber (or an autoclave) that goes so high in T  Slowly increase T up to 149 and then to 200 23 Jan 2014 8

9 C-channels  CF C-channels already in hand, maufactured at Liverpool by T. Jones and L. Poley  Just received them, not yet characterized, but they look nice and flat  Were they measured in Liverpool?  Enough for 1 petal  Next set of C-channels to be manufactured in PEEK at DESY, any objections to that? 23 Jan 2014 9

10 Locking points  Being worked out at Valencia, see David’s slides for details 23 Jan 2014 10

11 Core gluing  Set of tool currently under manufacture or under design  Based on precision pins for alignment among them and the petal facesheets  In manufacture: Main base plate (+ lid) and mirrored base plate  All tools align against this one Top and bottom closeouts gluing tools Facing cutting tool  Finishing the design: Foam gluing tool HC gluing (if any) C-channel gluing tools  No clear solution for locking points gluing, manual procedure for now 23 Jan 2014 11

12 Core gluing tools 23 Jan 2014 12

13 Dummy sensors, hybrids, ASICs  Dummy sensors  6” (plain) wafers in hand next week at IMB-CNM (Barcelona)  Laser cutting undergoing final tests (straight cuts)  Sandblast cutting being investigated too  Dummy ASICs with heaters  Currently in fabrication at IMB-CNM, delivery in < 2 weeks  Dummy hybrids  A few R0 H1 hybrids already in hand at Freiburg  Tooling for R0 in manufacture at Freiburg  Given the delays due to the accident at the foundry, it doesn’t seem feasible to have all flavors in hand in reasonable timescale for TM  I suggest FR4 dummies once the design of all flavors is finished If agreed, should Zeuthen do it? 23 Jan 2014 13

14 DCDC (power board) and EoP dummies  Manufactured in FR4  Status? 23 Jan 2014 14

15 Open issues  Mechanical characterization of petal cores  Should we follow Valencia’s recipe from previous core (~2009)? Where? I would rather do it at DESY and Valencia I have to figure out if we have the necessary equipment at DESY  Thermal characterization  Figure it out soon Where? I guess DESY?  Assembly of dummies  Tools?  Manual? I guess this is the more realistic approach  Industry approach for petal core manufacture investigated at Valencia  Will need raw materials for that  DESY can provide N636 HC and (a bit of) Allcomp foam  Other materials? Joint order? 23 Jan 2014 15


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