Pixel Upgrade Status and Plan G.M. Bilei Firenze Mar. 6 th 2013

Introduction and news The Pixel project is progressing pretty much according to the plan ROC PSI46dig / TBM08 submission was done in early January expect wafers (6) back in first half of April plan to order 24 additional wafers (delivery mid May) (enough for 3-4 wafers for each production center) Digital Test Boards will be produced by PSI (requested 15 for INFN) - Need to identify for each consortium one contact person to become expert in maintaining them and support the consortium. Look for volunteer High rate Test Beam at FNAL with digital ROC this summer - Good opportunity to contribute and learn. As INFN we should participate.. Pixel TDR Document now available, one per institute. Firenze G.M. Bilei2

2013 Pixel activities and goals Many tasks to accomplish in 2013: CO 2 cooling plant & piping Install extra LV-power cables for BPIX layer 1 (CAEN  PP1) Submission of digital TBM & ROC (PSI46dig) for Pilot System Production masks for PSI46dig ROC (BPIX Layer 2-4, FPIX) Production of Pilot System and integration into present FPIX Production of BPIX Supply Tubes & Mechanics for installation tests Installation test without beam pipe BPIX Supply Tube protoytpe with sector test of all electrical boards Preseries digital pixel modules with full functionality (sensor, HDI, cables, BB) High rate test pixel test beam at FNAL Firenze G.M. Bilei3

INFN plan and objectives for 2013 Complete construction of 8 old modules with analog ROC at IZM - All parts are available. IZM delivery very soon - Complete setups and qualification of INFN production centers Evaluate, qualify together with KIT the Selex BB process and reassess cost. Select Bump Bonding vendor (IZM, Selex) by September at latest. Set up new readout systems for digital ROC in the lab and get experience Construction of few prototypes of new digital pixel modules Preparation for mass construction (new readout cards, database, software analysis etc.) Possibly participate to the FNAL high rate test beam in summer Firenze G.M. Bilei4

INFN draft Pixel schedule INFN Pixel activities JanFebMarAprMayJunJulAugSepOctNovDec Analog Module Bump Bonding at IZM Construction and qualification 8 Analog Modules INFN and KIT Bump Bonding R&D at SELEX Qualification of Selex modules INFN Selection of Bump Bonding Vendor Digital Module Bump Bonding Construction and qualification of 10 digital modules Digital ROC and TBM HDI for digital modules Sensors Digital Test Boards Test Beam FNAL Firenze G.M. Bilei5 Milestone INFN Gruppo I Pixel Upgrade 1/12/2013 Realizzazione primi prototipi nuovi moduli Pixel Upgrade con ROC Digitale

Overall schedule Pixel Construction 6Firenze G.M. Bilei

Pixel Construction TDR milestones 7Firenze G.M. Bilei

Firenze G.M. Bilei 8 Half Layer 22 faces 8 modules/faces =176 modules Needs  250 modules allowing for 80% yield and 15% spares Contribution to 50% of BPix layer 3 Draft INFN Plan 2011 Start setting up Production ~ 8 old analog modules 2013 Production of few new modules 2014 Start mass production 2015 End module prod & integration 2016 Commissioning and Installation

Module construction flow chart Sensors test ROC Test after dicing TBM and HDI testing Company Bump bond Glue/bond TBM to HDI Test before glue HDI to sensor module characteri- zation Burn-in X-ray calibration Pisa Catania Bari Perugia Perugia/Pis a Half Layer Assembly and testing Bare Module test SiN-rails glue Bond ROCs to HD Glue HDI to bare module Module testing Padova

Pixel Construction Costs as TDR Firenze G.M. Bilei10 INFN contribution to construction 803 Ke (963 KCHF) UK contribution on FED withdrawn. Currently 690 KCHF are missing

INFN Pixel Upgrade spending profile 11