WIRE BOND PROCESS INTRODUCTION

CONTENTS ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT

封裝簡介 金線 Gold Wire 晶片Die 導線架 Lead fram

封裝流程 Wafer Saw Die Bonding toaster Wire Bonding Die Surface Coating Wafer Grinding Wafer Saw Die Bonding toaster Wire Bonding Die Surface Coating Molding Laser Mark Solder Ball Placement BGA Singulation Solder Plating Dejunk TRIM SURFACE MOUNTPKG Dejunk TRIM Packing THROUGH HOLE PKG Solder Plating TRIM/ FORMING

Wire Bond 原理 Gold wire Wedge Bond ( 2nd Bond ) Ball Bond ( 1st Bond ) pad lead

B.PRINCIPLE PRESSURE VIBRATION AL2O3 MOISTURE CONTAMINATION GOLD BALL GLASS Al SiO2 Si

銲接條件 HARD WELDING Pressure (Force) Amplify & Frequecy Welding Time (Bond Time) Welding Tempature (Heater) THERMAL BONING Thermal Compressure Ultrasonic Energy (Power)

Bond Head ASSY Low impact force Real time Bonding Force monitoring High resolution z-axis position with 2.5 micron per step resolution Fast contact detection Suppressed Force vibration Fast Force response Fast response voice coil wire clamp

X Y Table Linear 3 phase AC Servo motor High power AC Current Amplifier DSP based control platform High X-Y positioning accuracy of +/- 1 mm Resolution of 0.2 mm

W/H ASSY changeover · Fully programmable indexer & tracks · Motorized window clamp with soft close feature · Output indexer with leadframe jam protection feature Tool less conversion window clamps and top plate enables fast device

MACHINE SPECIFICATIONS (I) Eagle Bonding System Bonding Method Thermosonic (TS) BQM Mode Constant Current, Voltage, Power and Normal (Programmable) Loop Type Normal, Low, Square & J XY Resolution 0.2 um Z Resolution (capillary travelling motion)2.5 um Fine Pitch Capability 35 mm pitch @ 0.6 mil wire No. of Bonding Wires up to 1000 Program Storage 1000 programs on Hard Disk Multimode Transducer System Programmable profile, control and vibration modes MACHINE SPECIFICATIONS (I)

MACHINE SPECIFICATIONS (II) Eagle MACHINE SPECIFICATIONS (II) Vision System Pattern Recognition Time 70 ms / point Pattern Recognition Accuracy + 0.37 um Lead Locator Detection 12 ms / lead (3 leads/frame) Lead Locator Accuracy + 2.4 um Post Bond Inspection First Bond, Second Bond Wire Tracing Max. Die Level Different 400 – 500 um Facilities Voltage 110 VAC (optional 100/120/200/210/ 220/230/240 VAC

MACHINE SPECIFICATIONS (III) Eagle MACHINE SPECIFICATIONS (III) Material Handling System Indexing Speed 200 – 250 ms @ 0.5 “ pitch Indexer Resolution 1um Leadframe Position Accuracy + 2 mil Applicable Leadframe W = 17 – 75 mm @ bonding area in Y = 65mm = 17 – 90 mm @ bonding area in Y = 54mm L = 280 mm [Maximum] T = 0.075 – 0.8 mm Applicable Magazine  W = 100 mm (Maximum) L = 140 – 300 mm H = 180 mm (Maximum) Magazine Pitch  2.4 – 10 mm (0.09” – 0.39 “) Device Changeover < 4 minutes Package Changeover < 5 minutes Number of Buffer Magazine 3 (max. 435 mm)

Bonding Process

The Wire Bond Temp PREHEAT BONDSITE CU L/F200+/-10 200+/-10 AL L/F210+/-10 230+/-10 BGA 150+/-10 160+/-10 TFBGA150+/-10 160+/-10 LBGA 150+/-10 160+/-10 NOT INCLUDE DEDICATE LINE

Free air ball is captured in the chamfer pad lead

Free air ball is captured in the chamfer SEARCH HEIGHT pad lead

Free air ball is captured in the chamfer SEARCH SPEED1 pad SEARCH TOL 1 lead

Free air ball is captured in the chamfer SEARCH SPEED1 pad SEARCH TOL 1 lead

Free air ball is captured in the chamfer SEARCH SPEED1 SEARCH TOL 1 pad lead

Free air ball is captured in the chamfer SEARCH SPEED1 SEARCH TOL 1 pad lead

Free air ball is captured in the chamfer SEARCH SPEED1 SEARCH TOL 1 pad lead

Formation of a first bond SEARCH SPEED1 SEARCH TOL 1 pad lead

Formation of a first bond IMPACT FORCE SEARCH SPEED1 SEARCH TOL 1 pad lead

Formation of a first bond Contact PRESSURE Ultra Sonic Vibration pad heat lead

Formation of a first bond Base PRESSURE Ultra Sonic Vibration pad heat lead

Capillary rises to loop height position pad lead

Capillary rises to loop height position pad lead

Capillary rises to loop height position pad lead

Capillary rises to loop height position pad lead

Capillary rises to loop height position pad lead

Capillary rises to loop height position RH pad lead

Formation of a loop RD (Reverse Distance) pad lead

Formation of a loop pad lead

pad lead

WIRE CLAMP ‘CLOSE’ Calculated Wire Length pad lead

Calculated Wire Length pad lead

SEARCH DELAY pad lead

TRAJECTORY pad lead

TRAJECTORY pad lead

TRAJECTORY pad lead

TRAJECTORY pad lead

TRAJECTORY pad lead

TRAJECTORY pad lead

TRAJECTORY pad lead

TRAJECTORY pad lead

TRAJECTORY pad lead

TRAJECTORY pad lead

2nd Search Height Search Speed 2 Search Tol 2 pad lead

Search Speed 2 Search Tol 2 pad lead

Search Speed 2 Search Tol 2 pad lead

Formation of a second bond pad heat lead

Formation of a second bond Contact pad heat heat lead

Formation of a second bond Base pad heat heat lead

pad lead

pad lead

pad lead

Tail length pad lead

pad lead

pad lead

Disconnection of the tail pad lead

Disconnection of the tail pad lead

Formation of a new free air ball pad lead

Material Leadfram Capillary Gold Wire

Leadfram (I)

Leadfram ( II )

CAPILLARY (I) Capillary Manufacturer (SPT, GAISER, PECO, TOTO…) Capillary Data ( Tip , Hole , CD , FA&OR , IC )

CAPILLARY (II)

How To Design Your Capillary CAPILLARY (III) How To Design Your Capillary TIP ..…… Pad Pitch Pad pitch x 1.3 ~ TIP Hole ..…. .Wire Diameter Wire diameter + 0.3~0.5 = H CD………Pad size/open/1st Ball CD + 0.4 ~ 0.6 = 1st Bond Ball size FA & OR….Pad pitch(um) FA >100 0,4 ~90/100 4,8,11 <90 11,15 IC type …… loop type

Gold Wire Gold Wire Manufacturer (Nippon , SUMTOMO , TANAKA…. ) Gold Wire Data ( Wire Diameter , Type , )

SPEC Pad Open & Bond Pad Pitch Ball Size Ball Thickness Loop height Wire Pull Ball short Crater Test

BPO&BPP 單位: um or Mil BPO :是指Pad內層X方向及Y方向的size,一般是取最小值為 我們的data BPO :是指Pad如左邊內層至右邊Pad左邊外層邊緣其它依此類推;或著一個Die上出現不同Pad大小那就是以兩個Pad中心距離為BPP,但是一般我們要取一個Die上最小的BPP Bond Pad Pitch Bond Pad Open Bond Pad Open

Ball Size & Ball Thickness 單位: um，Mil 量測倍率: 50X Ball Thickness 計算公式 60 um BPP ≧ 1/2 WD=50% 60 um BPP ≦ 1/2 WD=40%~50% Ball Size Ball Thickness Ball Size

Loop Heigh 單位: um，Mil 量測倍率: 20X Loop Height 線長

Wire Pull 1 Lifted Bond (Rejected) 2 Break at neck (Refer wire-pull spec) 3 Break at wire ( Refer wire-pull spec) 4 Break at stitch (Refer stitch-pull spec) 5 Lifted weld (Rejected)

Ball Short 單位: gram or g/mil² Ball Shear 計算公式 Intermetallic（IMC）有75%的共晶,SHEAR STRENGTH 標準為＞6.0g/mil²。 SHEAR STRENGTH＝Ball Shear/Area (g/mil²) Ball Shear = x; Ball Size = y; Area = π(y/2) ² x/π(y/2) ² = z g/mil²

Shear Failure Modes 12 12 (A) Unsheared (D) Ball bond-bonding pad interface separation (typical Au to Al) Wire Full ball attached to wire-except for regions of intermetallic voiding Bond shoulder Shearing ram Ball separated at bonding pad- Ball interface-residual intermetallic (and sometimes portion of unalloyed ball and metal) on pad in bond interaction area Interfacial contact ball bond weld area Ball bond Bonding pad C C h Ball bond L C C L Bonding pad Test specimen Test specimen Specimen clamp Specimen clamp (B) Wire (ball top and/or side) shear (E) Bond pad lifts Shearing ram Wire Residual pad on ball ball-pad interface remains intact Minor fragment of ball attached to wire Interfacial contact ball bond weld area Ball sheared too high (off line, etc.)only a portion of shoulder and ball top removed Pad metallization separates from underlying surface Ball bond C C C Bonding pad C L L Bonding pad Test specimen Test specimen Specimen clamp Specimen clamp (C) Below center line shear, ball sheared through (typically Au to Au) (F) Cratering Shearing ram Residual pad and substrate attached to ball,ball-pad interface remains intact Major portion of ball attached to wire Bonding pad lifts, taking portion of underlying substrate material with it Ball bond Interfacial contact- ball bond weld area intact C C Ball bond L C C L Bonding pad Bonding pad Test specimen Test specimen Specimen clamp Specimen clamp 12 12

Crater Test

Calculate (I) (Total Actual Production Times – Total Repair Time ) UP Time = Total Actual Production Time Total Repair Time DOWN TIME RATE= Total Actual Production Times Total Operator Actual Repair Time MTTS (MEAN TIME TO STOP ) = Total Operator Repair Frequency Stoppages Total Actual Production Times – Total Operator Repair Time MTBS (MEAN TIME BETWEEN STOP)= Total Operator Repair Frequency Stoppages Total Technical Actual Repair Times MTTA (MEAN TIME TO ASSISTANCE ) = Total Technical Repair Frequency Stoppages

Calculate (II) Total Actual Production Times – Total Technican Repair Times MTBA (Mean Time Between Assistance) = Total Technical Repair Frequency Stoppages Total Actual Production Times – Total Technician Repair Time MTBF(Mean Time Between Failure)= Total Change Parts Repair Frequency Stoppage 規格寬度 規格上限 - 規格下限 CP ( 製程能力指標) = = 製程寬度 6 σ( 公差) (上限 or 下限 ) - 平均值 CPK = 三個公差

Quality 正常品 Material Problem 1st Bond issue (Peeling , Ball Lift , Off Center) 2nd Bond issue (滑針，縫點脫，short tail ) Looping Fail (wire snake wire，sweep wire loop base bent )

正常品

Material Problem

Bonding Ball Inspection Ball Detection With Ball Wire Pad Size Missing Ball Wire Broken

Bonding Ball Inspection (cont.) Ball Measurement Pad Center Ball Center Ball Size Ball Placement (X,Y) Ball Off Pad

1st Bond Fail ( I ) Peeling

1st Bond Fail (II) Ball Lift Ball Lift

1st Bond Fail ( III ) Neck Crack

1st Bond Fail (IV) Off Center Ball Off Center

1st Bond Fail (V) Smash Ball Smash Ball

Bonding Weld Inspection Weld Detection Lead With Weld Wire Capillary Mark Missing Weld Wire Broken

2nd Bond Fail ( I ) 滑針

2nd Bond Fail ( II ) 縫點脫落 縫點脫落

Looping Fail(Wire Short I) Wire Sweep Wire Short

Looping Fail(Wire Short II) Loop Base Bend Wire Short

Looping Fail(Wire Short III) Excessive Loop Wire Short

THE END