1. ASEK CSP-BGA (Sawing Type)
Substrate Design
Rev. :L
Date : 04/13/04”
Prepared : Damon_Hung

2. Content  Necessary Data Of Substrate Design  Substrate Structure
 Ring / Finger Placement & S/M Design Rule
 Finger Design Rule
Bonding finger width, wire quantity and wire diameter design rule
 Outer Layer Trace Design Rule & Finished Value
 Inner Layer Trace Design Rule & Finished Value
 Via Design Rule
 Dimension of Solder Ball and Pad/SM Opening
 Laminate Blind Via Design

3. Necessary Data Of Substrate Design
 Package type
 Body size
 Substrate layer number
 Bond pad number of ground / power / signal
 Staggered or inline pad design
 Actual die size or estimated min./max. die size
 Solder ball number, location and pitch
 Assigned ground/power ring number or segment location
 Bond finger number for each side of package
 Net list (pad no., net-name, ball no.)
 Power consumption (Thermal requirement)
 Electrical requirement

4. Substrate Structure
2 Layer
4 Layer

5. Ring, Finger Placement & S/M Design Rule

6. Ring, Finger Placement & S/M Design Rule
2-Side Wire bonding A D B C
4-Side Wire bonding A E B D D
Unit: mm

7. Finger Design Rule and Finished Value
ASE
Finger Design Rule and Finished Value
* The design value of finger is defined by finger top width.The top width value of this table can be manufactured by all suppliers and supplier didn’t need to do any compensation by themselves. The cycle time will be reduced. 7 2 2 3 2 2 2 2 2 2 2 2 2

8. Outer Layer Trace Design Rule and Finished Value
ASE
Outer Layer Trace Design Rule and Finished Value 8 2 2 2 3 2 2 2 2 2 2 2 2

9. Inner Layer Trace Design Rule and Finished Value
ASE
Inner Layer Trace Design Rule and Finished Value 9 2 2 2 3 2 2 2 2 2 2 2 2

10. GPP+DOUBLE IMAGE PROCESS: Finger Design Rule and Finished Value
ASE
GPP+DOUBLE IMAGE PROCESS: Finger Design Rule and Finished Value
* The design value of finger is defined by finger top width.The top width value of this table can be manufactured by all suppliers and supplier didn’t need to do any compensation by themselves. The cycle time will be reduced.
1010 2 2 3 2 2 2 2 2 2 2 2 2

11. ASE
GPP+DOUBLE IMAGE PROCESS: Outer Layer Trace Design Rule and Finished Value
1111 2 2 2 3 2 2 2 2 2 2 2 2

12. Selective Gold Process: Finger Design Rule and Finished Value
* The design value of finger is defined by finger top width.The top width value of this table can be manufactured by all suppliers and supplier didn’t need to do any compensation by themselves. The cycle time will be reduced.

13. Selective Gold Process :: Outer Layer Trace Design Rule and Finished Value

14. Finger Design Rule for Multi Bond (Double Bond,Triple Bond and Four Bond)
1414

15. Inner Layer Trace Design Rule and Finished Value2 2 2 3 2 2 2 2 2 2 2 2

16. 2 2 2 2 3 2 2 2 2 2 2 2

17. Vias Design Rule

18. Dimension of Solder Ball and Pad/SM Opening

19. The space from ball to package edge

20. Laminate Blind Via Design
ASE
Laminate Blind Via Design
2020 2 2 2 3 2 2 2 2 2 2 2 2

21. ASE Substrate Structure
1+2+1 Layer
Finger Design Rule and Finished Value : same as Laminate PTH design.
Finger Design Rule for Multi Bond (Double Bond, Triple Bond and Four Bond) : same as Laminate PTH design.
2121 2 2 2 2 2 3 2 2 2 2 2 2

22. Design Rule by Laser via - Outer layer1 4 4
<Unit : um> 4 2 #
Item
Production
Prototype 3 4 1
Blind Via Diameter 80 70 2
Blind Via land diameter
Via +150
Via +130 3
Trace width 50 40 4
Space 50 40 4 4
2222

23. Design Rule by Laser via - Inner layer1 4 4
<Unit : um> 4 2 #
Item
Production
Prototype 3 4 1
Blind Via Diameter 80 70 2
Blind Via land diameter
Via +180
Via +150 3
Trace width 50 45 4
Space 50 40 4 4
2323

24. Design Rule by Buried-Via(Inner Layer)1 4 4
<Unit : um> 4
Production
Prototype #
Item 2 3 4 1
PTH Diameter
150
100 2
PTH land diameter
Via +200
Via +150 3
Trace width 50 45 4
Space 50 40 4 4
2424

25. GENERAL LF/TF WIRE BOND DESIGN RULE
ASE
GENERAL LF/TF WIRE BOND DESIGN RULE
2525 2 2 2 3 2 2 2 2 2 2 2 2

26. 1.0 Wire Selection Rule
Bond Pad Pitch, Bond Pad Opening, Max Wire Length, Gold Wire, and Finger Pitch relationship
1.1 Max wire length is 150 mils(3810 um)
1.2 Wire diameter depends on bond pad pitch and finger pitch.

27. 1.3 For Stagger Bond Pad Layout（Stagger Bond Pad wire diameter depend on finger pitch）.
1.3.1 Finger pitch >=140 um, Wire diameter choose 1.0 mils. Max wire length is 3556 um
(140 mils).
1.3.2 Finger pitch < 140 um, Wire diameter choose 0.9 mils. Max wire length is 3302 um
(130 mils).
1.4 Special definition：When pad pitch > 100 um and Max wire length < 130 mil, 0.9 mils
gold wire is allowed for cost down.
Note : Control wires length the same as possible in the four sides. (No matter the inner and outer finger)

28. 2.0 Wire Layout Design Rule
Distance of wires criteria ,Cross Pad and finger criteria control .
1. If wire B ≦ wire A, wire B can't cross adjacent bonding pad of wire A
(當wireB的線長小於等於wireA時，wireB不可橫跨相鄰wireA的鋁墊)
2. If wire C ≧ wire B, wire C can cross adjacent bonding pad of wire B, but need to
have one wire diameter space between wire C and wire B.
(當wire C的線長大於wire B的線長時，wire C可以橫跨wire B的鋁墊，但wire C
和wire B之間需有一倍線徑的距離。)
Same finger layer or same ring layer is equal to the same wire length.
(同弧的手指或同一ring視為相同線長) C A B 2 2 1

29. 5 3 0° 4 3. Cross adjacent Finger : not allowed. (銲線不可橫跨同排相鄰的手指)
4. Wire to wire distance > 1 wire diameter (Min). (線與線間距>1倍線徑)
5. Finger (Inner/Outer) direction must be parallel to wire direction as possible. The max
angle θ < ± 15°.
(手指方向儘可能與金線平行，如不行時必須控制在15度內。)
Best
Bad
Bad 5 3 θ 0° 4
Note 5 : When two dies use same substrate, the single finger could be bond different wire for
different die.The Finger direction must be set the center of the angle which make up
by the different wire.
(當同一基板套用不同Die時, 單一手指可能被不同die的線連接, 此手指方向必須坐落在
兩線夾角的中間)

30. 6. Trace can not exposed in the front of finger
6. Trace can not exposed in the front of finger. Straight trace from the edge of the Solder
mask > 150um.
(Trace不可在Finger前端露鍍金. Finger前端的Trace必須在拒銲劑邊界150 um後才
能轉彎) 6

31. Wire Alignment of inner and outer finger
Wire Alignment of inner and outer finger. ( For both single and staggered pad )
7. Follow select wire table (1.1) choose finger Pitch. (請依據表1.1來選擇finger pitch)
8. For product which is fine pitch or the max wire length over 120 mils, all corner’s 1st
（2nd）fingers must have 2（1.5）times finger pitch than normal finger pitch.
( 一般finger pitch 的選擇請依照線長線徑的選擇表。針對Fine Pitch及線長超過120
mils的產品，各角落第1個（第2個）finger 的pitch必須有一般 finger pitch 2（1.5）
倍的距離。）
Bad 7 8
Best

32. (內手指的兩側與相鄰長線之距離必須 >1 倍線徑)
9. distance between Inner finger and adjacent wire >1 wire diameter (Min).
(內手指的兩側與相鄰長線之距離必須 >1 倍線徑)
Bad
Best

33. Wire angle of inner finger (內手指線之角度)
10. For Fine pitch product (BPP<=60um), the shorter wire of the front finger angle
(Non-include the Power/Ground Ring) must equal or less than the calculated value
from the formula which W/B project team provided.
( 針對Fine Pitch產品(BPP<=60um), 前手指線(不含Power/Ground Ring)其最小
角度必須依W/B專案組所提供之公式計算出。)

34. 8. If C >= 800um, B can be > A/2
Inner pad wires cross outer pad wires rules (內鋁墊線需跨外鋁墊線之規則)
11. If C is small than 800um, the cross point must be smaller than half of inner pad
wire length.
( 當前後手指Pitch小於800um時，交叉點必須小於內層鋁墊金線的一半。)
12. If C is larger or equal to 800um, the cross point can be larger than half of inner
pad wire length.
( 當前後手指Pitch大於等於800um時，此時交叉點可以大於等於內層鋁墊金線
一半。) A A C B B C
7. If C < 800um, B < A/2
8. If C >= 800um, B can be > A/2
Note: Don’t let wires cross each other as possible as you can, even the wires are in different
pad level.
(即使是不同鋁墊層的線，也儘可能不要讓線彼此交錯。)

35. 3. Device Design Rule
Pad Size Layout
PAD Size
Device Size A

36. 4 Ground/ Power Ring Rule
Bonding ring width/space design rule
GROUND
POWER1
POWER2
POWER3 A B C
17 mils D
If bonding rings without S/M cover between, the length of wire which bond to outermost ring must <= 130 mil.
(若ring和ring間不蓋上S/M時，則打至ring的線長不得大於130mil)

37. 5.Finger Layout Rule
In-line Finger Rule
Inline type
Loop type

38. Outer finger and Inner finger relation rule (without S/M cover)
Stagger Finger Rule
Outer finger and Inner finger relation rule (without S/M cover)
(前後手指相關規則)(無S/M蓋上時)
X: Finger pitch between Inner finger and outer finger (X direction)
(X:前手指到外手指線中心之X方向距離)
Y: Space between Inner finger and Outer finger (Y direction)
(Y:前、後手指之Y方向距離)
If Y <300um, should let X> (Finger top width) + (Wire diameter)
(如果Y小於300um，X必須大於手指top width加上線徑)
If Y ≧300um, may let X no limit
(如果Y大於等於300um ，則X不限制) X Y
Outer finger
Inner finger

39. 6.Solder Mask Design RuleC B D A
Note: Cover solder mask as possible If the solder mask cover area (D) larger then 150um
(如果拒銲劑可覆蓋寬度(D)大於150um，則儘可能的覆蓋拒銲劑。)