Institute of Digital and Computer Systems 1 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Chapter 5 Finding Peak Performance in a Process.

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Presentation transcript:

Institute of Digital and Computer Systems 1 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Chapter 5 Finding Peak Performance in a Process Closing the Gap between ASIC & Custom

Institute of Digital and Computer Systems 2 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Overview  Process and operating conditions  Statistical process variation  Impact of process improvements on the achievable speed  Impact of different process implementations of the same technology  Difference between ASIC and custom due to process and operating conditions  Possible performance improvement in ASIC

Institute of Digital and Computer Systems 3 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Process and Operating Conditions  Standard cell libraries are characterized for two features  Operating conditions: nominal supply voltage and operating temperature;  Different process: slow (worst case), typical and fast ASIC synthesized for slow process condition: high yield at the post layout clock frequency ASIC designers typically assume w. c. process  Speed bin chips  Chips are tested and sold according to the supported speed  Operating conditions  Worst case: 100° or 125°, 90% of Vdd They can be quite realistic  Typical conditions: 25°, nominal Vdd  Worst case power consumption corresponds to highest operating conditions (high frequency, fast process, high operating voltage, low temperature)

Institute of Digital and Computer Systems 4 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Supply Voltage and Drive Strength  Larger drive current implies more speed  It can be increased by increasing the width of transistors, the supply voltage, decreasing the threshold voltage or the load capacitance  Gates with wider transistors (higher drive strength) are used to reduce the delay on critical paths  It increases the power consumption  The same happens increasing the supply voltage  It increase also the power dissipation during gate switching  Decreasing the threshold voltage, static power consumption can grow  ASIC designer can usually exploit libraries with different transistors width, decide to provide different supply voltage and choose among few libraries with different threshold

Institute of Digital and Computer Systems 5 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Higher Temperature vs. Circuit Speed  Higher temperature reduces speed  It increases wire resistance, transistor resistance and decreases the drive current  It increases power consumption  Leakage current grows  Operating conditions set at 125° is a conservative estimates for ASIC  Spot temperature can be higher than the average one  Operating temperature is limited by the ambient temperature and available cooling methods  Many embedded applications cannot use advanced cooling methods  Higher power chip dissipates more heat

Institute of Digital and Computer Systems 6 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Custom vs. ASIC Operating Conditions  Increasing the supply voltage is a common technique to over-clock custom chips  Sometimes chips in a low speed bin doesn't work using lower voltage  But this increases the power dissipation  More exotic cooling devices can be used to lower temperature and improve performance  But this generally doesn’t justify the cost of the cooling mechanism even in high-performance CPUs  They can have also high power consumption  Heat sinks and fans significantly increase the cost of a the overall system  Also packaging can affect the speed  In the 1GHz Alpha, using flip chip instead of wire bond increase by 10% the operating frequency

Institute of Digital and Computer Systems 7 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Performance Penalty Imposed by the Tight Power Constraints of ASIC Design  Lack of cheap packaging solutions  Celeron uses socketable micro-FCPGA or surfaced mount micro- FCPGA High level of power dissipation  Advanced ASIC technologies are TEPBGA or PBGA  If placed in a ASIC packaging the Celeron processor would be limited to 600MHz or 530MHz, instead of 1100MHz

Institute of Digital and Computer Systems 8 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Comparison of ASIC Process and Operating Conditions  Clock frequency for some high speed ASIC CPUs

Institute of Digital and Computer Systems 9 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Chip Speed Variation Due to Statistical Process Variation  Wafer processing  Several types of process variation  Line-to-line, batch-to-batch: difference in masks, steppers and optics  Wafer-to-wafer: distance between wafer and optics  Die-to-die, intra-die: varying illumination and lens aberration  For marketing purposes, AMD and Intel will bin processors to slower clock frequency than necessary  Sometimes over-clocking is a good idea  The variation decreases as the process matures

Institute of Digital and Computer Systems 10 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Continuous Process Improvement  Top semiconductor foundries continuously improve the process technology  Difference of performance inside the same process generation  Due also to supply voltage, chips binned to slower frequencies, process improvements, design optimization

Institute of Digital and Computer Systems 11 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Speed Difference Due to Alternative Process Implementations  Copper wiring vs. aluminum wiring  Aluminum has higher resistance and performance is lower  Silicon on insulator vs. bulk CMOS  20%-25% faster, less power  Process difference between custom and ASICs  Custom 20% - 40% faster than ASICs  ASIC foundries offer several process within a process generation  Slower, high-density, high-speed  Slower are cheaper

Institute of Digital and Computer Systems 12 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Effects of Process and Tuning  Advances in process combined with additional tuning can measurably increase the performance of a given design  Some examples

Institute of Digital and Computer Systems 13 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Process Technology for ASICs  After a process improvement, the library must be characterized again and redesigned  If not, 20% of improvement lost  ASIC may not have access to the best fabrication plants  Fabrication plants guarantee a fixed speed  Worst case design  Usually also faster chips are produced  ASIC may prefer slower chips for marketing purposes  For ASIC, the process migration is easier  It requires only to retarget the ASIC library  However custom design can take full advantage of the process

Institute of Digital and Computer Systems 14 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Potential Improvements for ASICs  ASIC designers can test chips to see if performance is better than w. c. estimate  20%-30% improvement in speed over w. c.  Speed bin  Supply voltage can be increased to speed up the chip  Higher temperature is not a good choice, because of the cost of packaging technologies

Institute of Digital and Computer Systems 15 Fabio Garzia / Finding Peak Performance in a Process23/06/2015 Thank you!