DPNC Daniel La Marra Activities in the Electronics Group « GrElec »

18/12/ Electronic Highlights GrElec in 2012  3+1 Electronics Engineers  Daniel La Marra  Stéphane Débieux  Yannick Favre  Alessandro La Rosa IBL  2 Technical Assistants  Gabriel Pelleriti  Javier Mesa 2

18/12/ Electronic Highlights Projects Highlight  ATLAS (LHC)  IBL (upgrade phase )  ABCn130 (upgrade phase2 2022)  Neutrinos  MICE (production)  Astrophysique  LOFT  POLAR 3

18/12/ Electronic Highlights IBL : Local support - stave 4

18/12/ Electronic Highlights IBL : Dressed module with flex 5

18/12/ Electronic Highlights IBL - Loading procedure 6

IBL : Test bench for PCB/Flex Saver production  Purpose : Full production test : ~80 PCB savers, 500 Flex savers  Details : 320 signals / PCB saver : automatic test for short & open circuit on each signal FPGA firmware development for signals stimulus & PC communication (Yannick) PC software development for checking & reporting (Yannick) Test execution (Gaby) Saver under test Checked OK for ID=1 PC interface Flex savers PCB saver Xilinx Stimulus Board HW interface 18/12/ Electronic Highlights7

IBL : IST & beam pipe EMI qualification  Purpose : Screening qualification against ElectroMagnetic Interference  Measurement : Transfer impedance + Screening attenuation vs frequency : Tube under test inserted into a copper tube for environment insensitivity IBL Support Tube (IST) qualification (carbon fiber + Ag glue + end rings) Beam pipe shielding methods investigation & qualification  Hardware : Vector Network Analyzer [100KHz-4GHz] IST Beam Pipe VNA Copper tube enclosure Good shielding Bad shielding Tubes under test 18/12/ Electronic Highlights8

18/12/ Electronic Highlights ABCn-130 : Main improvements ABCn-250New ABCn-130 Technology:250nm130nm # channels: Data rate:40 Mbit/s80 Mbit/s Data flow :VariableFixed (data rate increase) TX Chain (chip to chip) Hardware token signalSoftware Xon/Xoff (more flexibility) Single Event Upset Protection noneConfiguration choice : - Watchdog or - 3X Flip Flop + vote or - Hamming code # buffer levels:12 (L0 & L1 triggers) 9

ABCn-130 : Layout (not final) Submission Scenarios 18/12/ Electronic Highlights Chip size 7900 um x 6700 um  Independent of HCC  Regular MOSIS MPW on 4 th February 2013 (reachable for ABC130, not for HCC)  Shared Engineering run with the NA62/TDCpix submission (forecast 1Q 2013, may be very close to the MOSIS MPW date, but with some flex.)  With HCC :  Engineering Run, attached to HCC schedule Preferred scenario 10

DBB : Digitizer & Buffer Board  Context : MICE experiment (RAL/UK) Electron Muon Ranger detector (EMR) Part of a collaborative team with the Front End Board Board & FPGA design + test : Stéphane Débieux 18/12/ Electronic Highlights11 Mice experiment EMR

DBB : Overview 18/12/ Electronic Highlights12 2 Gigabit transceivers Altera Stratix II FPGA Power Supply : 3 DC/DC LVDS Connections to FEB Connectors for DBBs daisy-chain DAQ SMA Connectors DIP switch for Board ID Connector for FPGA programming

DBB : Current status 18/12/ Electronic Highlights13  Further tests in the lab qualified the DBB for production  54 boards to be produced identically to the first 6 prototypes  2 to 3 months delay expected for the production, delivery in March/April 2013

LOFT : Large Observatory For x-ray Timing  Context : Matter in neutrons Stars & close to black hole event horizon ESA program, launch Wide Field Monitor : high resolution Large Area Detector : 10m² of detector 2-30keV : 6 panels 7x3 modules/panel 4x4 Front End Electonics/modules => 2016 FEE overall : DPNC/ISDC design responsibility  FEE : ~130x70mm Very low noise Silicon Drift Detector technology (used in ALICE) 14 ASICs per FEE, 16 channels/ASIC Chip On Board technology, very small pads (39µ) Bonding: ASIC to SDD (17µ), Through PCB Bonds, ASIC to PCB PCB: Flex-Rigid technology FEE Module Back End Electronics Panel SDD (bottom) 18/12/ Electronic Highlights14

LOFT : Large Observatory For x-ray Timing  FEE Prototype 2012 : Large PCB for measurements access, Small SDDetector Proto, EMC & HV constraints Components: 4 ASICs, linear regulators, digital interfaces, HV/MV filters Labview interface Board Design Schematics + Layout: Yannick Components & ASIC mounting/bonding: Gaby, Maarten Tests : in progress at BOLOGNA SDD location ASIC Trough PCB hole for bonding 75um PCB trace width 39um square pads 18/12/ Electronic Highlights15

POLAR : An instrument to measure Gamma Ray Bursts polarization  2 layers flex with stiffener: Design made by PSI Schematics and Layout was imported into our Cadence tools Modification with close relationship with the mechanics group Added a rigid part (stiffener) Length changed 18/12/ Electronic Highlights16

POLAR : An instrument to measure Gamma Ray Bursts polarization 18/12/ Electronic Highlights17  News in this design: Very small via between 2 layers Hole: 0.09mm Pad: 0.15mm

18/12/ Electronic Highlights Conclusion  This year was going on with some works initiated last year or even before:  IBL  ABCn130  MICE  There was also new works for several different projects like:  LOFT  POLAR  But we also started some studies for new projects like:  NA61 (neutrinos)  DAMPE (astrophysics)  JEM-EUSO (astrophysics) 18