1. A multi-chip board for X-ray imaging in build-up technology Alessandro Fornaini, NIKHEF, Amsterdam 4 th International Workshop on Radiation Imaging Detectors Alessandro Fornaini, Ton Boerkamp, Jan Visschers - NIKHEF Rui de Oliveira - CERN

2. Hybrid Pixel detectors Xray Bumps Single photon counting Semiconductor sensor High purity, single crystal (Si, GaAs,..) CMOS electronics Pixel diode Single pixel Read Out cell 300 - 600  m 55  m 1

3. Hybrid Pixel detectors (2) Problem: size limitations! Sensor size: not a problem (~15 cm diam. high res. Si) CMOS chip size: max. 25 x 25 mm 2 due to reticle size of wafer stepper (Medipix2: 0.25  m technology, area 14 x 16 mm 2 ) Non-standard production techniques (“stitching”) to circumvent this but: 1)Expensive 2)Yield inversely proportional to chip area! (due to density of point defects and contaminations) 2

4. Our solution: tiled array of chips Medipix2 setup: Muros2 3.3V PC with Medisoft4 and NI DIO card Muros2 interface Chipboard with 2 X 4 tiled ASIC chips Medipix2 512 x 1024 Pixels Si sensor, 28 x 56 mm 2 Bump bonded Bias 3

5. Other tiled arrays SystemPixel size [  m 2 ] Circuit size [mm 2 ] Sensor area [mm 2 ] Array (circuits per sensor) Pixels per circuit Total # of pixels Omega3 / LHC1 50 x 5006.4 x 8.0 307 1x6 2048 12 k Alladin RAL-UK 150 x 1509.6 x 9.6 645 1x7 4096 29 k Atlas CERN 50 x 4007.2 x 8.0 990 2x8 2880 47 k LHCb CERN 50 x 42512.8 x 13.6 984 1x7 8192 57 k Medipix255 x 5514.1 x 14.1 1590 2x4 65536 524 k 4

6. Medipix2 setup 8 Medipix2 ASIC chips, 14 X 16 mm 2 1 High Res. Si sensor, 28 X 56 mm 2 Chipboard in Chip-on-Board technology Interface card to PCI DIO card (Muros2) Sensor bias voltage supply (commercial) PC with HS DIO board (commercial)

7. Medipix2 Interconnectivity Medipix2 chip #N Medipix2 chip #N+1 Common single-ended CMOS bus: shutter, mode control, reset, polarity and analog signals (test input, DAC output) Serial Daisy Chain Token passing protocol (LVDS) 160 Mhz CLK 1 Mbit data per chip 160 Mhz  160/N tot frames/sec LVDS ( Low Voltage Differential Signal ) Reduce: noise generation, noise sensitivity, interconnectivity Better performance for large arrays DATA CLK ENABLE 5

8. Routing Top layer metal 1, 2: Vdd, Gnd and LVDS token ring 160 Mhz! Layers 3, 4, 5 metal: Common CMOS bus 1 36 8 72 54 Connector Pitch of wirebonds = 120  m, NO FANOUT Interconnection: High Density Interconnect (HDI) technology Chip-on-Board (COB) technology 6

9. Interconnections From: IPC/JPCA-2315 Design Guide for High Density Interconnects (HDI) High Density Interconnect (HDI) Build-up technology Staggered Micro-Via’s (photolitographic etching) 7

10. Box Medipix 2 Pixel Sensor Capacitor GND VDD-LVDS VDD VDDA Vbias Beryllium Foil Controls FET switch Peltier Cooler clock data token Gnd busX busY busX VDD VDDA VDDL GND < 6 mm Multilayer board 9 layers (4 metal, 5 build-up) 8

11. Test Pulse FET switch DAC 1 DAC 2 to input analog test Medipix2 chip FPGA Muros2 Medipix2 chipboard 9

12. Multilayer board (2) 5 built-up layers: 15  m Cu 50  m Kapton Metal 1: 100  dual tracks for LVDS line Metal 1,2: Gnd Metal 3, 4, 5: 50  tracks for CMOS bus 4 layers:Standard Printed Wire Board 70  m Cu 350  m Epoxy Metal 6: Vdd Metal 7: Vdd-LVDS Metal 8: Vdda Metal 9: Gnd 1.6 mm total thickness, area 53 x 110 mm 2 10

13. Via’s and Tracks dimensions 1840 micro-via’s 366 through via’s 80 SMD capacitors 8 CMOS FET’s Width [  m] Clearance [  m] Pitch [  m] CMOS Track 60 50110 LVDS Track 80 70150 Micro-via 180 70250 Through-via 350150500 Capacitor clock data token spare VDDA micro via's & Bond Pads through via 11

14. Chipboard layout Chip bond pads Decoupling capacitors Power bars LVDS pairs FET switch, capacitors Test points 12 1 cm

15. Vbias connector SCSI-5 connector 2 x 4 Medipix2 chip array Chipboard layout 13 1 cm

16. … and the actual chipboard SCSI-5 connector Vbias connector 2 x 4 MPix2 chip array Power bars LVDS pairs 14 1 cm

17. Power bars LVDS pairs 15 1 cm

18. 16 1 cm

19. Status 16 prototypes boards produced at CERN Connectivity tests performed on 3 boards: NO DESIGN ERRORS! But: production defects (1 short, 2 connections  easily solvable) Work in progress! Currently: - Evaluating different glues - Gluing and wire bonding - Testing LVDS line with 8 Medipix2 chips (no sensor) mounted on the chipboard Planning (~ 1 month): Testing connections with MPix2 chips Critical: communication speed tests (160 Mhz?) 17

20. Conclusion 16 Medipix2 2 x 4 chipboards have been produced. Testing is still going on but up to now results are very promising A 2 x 2 sensor will be mounted and tested. We expect to have a 2 x 4 multichipboard running in ~ 6 months 18

22. Tiled array: chips boundary Chip separation: 220  m (4 pixels) Sensor: pixels at boundary 55 x 55  m 2  55 x 165  m 2 55  m 220  m 165  m NO DEAD AREA but: non uniformity (resolution, overflow)