This is the new logo for the XC4000X family

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Presentation transcript:

This is the new logo for the XC4000X family This is the new logo for the XC4000X family. It represents both the XC4000XLA and the XC4000XV.

XC4000X Advancements over Existing Products 50% Less Power Run-time Price Speed Capacity This foil overviews the key changes from the XC4000XL/XC40125XV to the new XLA and XV devices. We are doubling Speed (this is best case chip to chip timing) and capacity. Prices, Power, and Runtime (with 1.5) are all cut roughly in half. 2x More

XC4000X Series 4000XLA 4000XV 4000XL Next Generation Doubles Density & 208 MHz 4000XLA 4000XV I/O Performance 96 MHz 4000XL Here are the members of the 4kX families and their capacity/performance limits. Again note the 500K density and the 200 MHz speeds. 180K 500K System Gates Next Generation Doubles Density & Performance of Industry leading XC4000XL

XC4000XLA Doubles System Speeds 208 MHz 133 MHz 96 MHz System Speed = 1 / (Clk-Out + Setup + Hold)

XC4000X Series Internal Performance 314 MHz 172 MHz 108 MHz This foil shows some examples of XLA/XV internal performance. The prescaled counter represents the register to register performance through one level of logic. The 32-bit Adder performance shows arithmetic performance. This is determined by the carry chain. Dual-Port RAM shows the performance of the Select-RAM.

50-70% Less Power Consumption The XC4000XLA has much lower power dissipation than the XC4000XL. This is do to the combination of a complete relayout and the move from 0.35 micron TLM to 0.25 micron 5LM. The typical net is much shorter and will have much lower capacitance. Charging and discharging the capacitance of the nets is the major consumer of dynamic power. The additional benefit of lower voltage in the XV devices lowers the power even more.

XLA Die Size Reduction Results in Lowest Cost XC4000XL 0.35 micron process 3 Layers of Metal Relative Die Size = 1 XC4000XLA Ultra dense process 5 Layers of Metal Relative Die Size = 0.35 The die size of the XC4000XLA is 65% smaller than the equivalent XL device. The reasons for this are: 100 Man months of effort in optimizing the layout A complete relayout from first generation 0.35 micron process technology to state-of-the-art 0.25 micron technology The major benefits are: We can offer much lower prices to customers. Optimized interconnect allows higher performance and lower power dissipation

4000XL to 4000XLA Price Comparison This shows the massive price reductions possible in going from the XL to the XLA. This is book pricing. The slowest cheapest devices are cut by over 50%. The -09 XL to -09 XLA reduction is more than 80% XC4062XL/AHQ240

XC4000X Series FPGAs Double Performance & Capacity while cutting Power & Run-times in half XC4000XLA Family: Fastest 3.3V FPGAs 208 MHz Chip-Chip Speeds XC4000XV Family: 500,000 System Gates Doubles Industry Capacities Advanced 0.25 5LM process

Appendix

XC4000XLA Family 4013XLA 4020XLA 4028XLA 4036XLA Logic Cells 1,368 1,862 2,432 3,078 System Gates* 30,000 40,000 50,000 65,000 Max. RAM bits 18K 25K 33K 42K Max I/O 192 224 256 288 4044XLA 4052XLA 4062XLA 4085XLA Logic Cells 3,800 4,598 5,472 7,448 System Gates* 80,000 100,000 130,000 180,000 Max. RAM bits 51K 62K 74K 100K Max I/O 320 352 384 448 20-30% of CLBs as RAM

XC4000XLA Packaging Leadership 4013XLA 4020XLA 4028XLA 4036XLA 4044XLA 4052XLA 4062XLA 4085XLA PQ/HQ160 HQ160 PQ/HQ208 HQ208 PQ/HQ240 HQ304 BG256 BG352 BG352 BG432 BG560 The smaller die of the XLA also allows bigger parts to go into smaller packages. All packages are completely footprint compatible. In addition, we will be announce a family of 1.0mm BGAs for the XLA. New with XLA

XC4000XV Family 40110XV 40150XV 40200XV 40250XV CLB Array 64 x 64 72 x 72 84 x 84 92 x 92 Logic Cells 9,728 12,312 16,758 20,102 System Gates 220,000 300,000 400,000 500,000 HQ240 HQ240 BG352 BG352 BG432 BG432 BG432 BG432 BG560 BG560 BG560 BG560

XC4000X Competitive Leadership 500K 208 MHz 100% 100% bigger 87% faster 46% less power 250K 111 MHz 54% Rel. Power (Clk-Out + Setup + Hold) Xilinx 4000X-07 Altera FLEX 10K-1

Altera 3.3 Volt Die is 44% larger Xilinx XC4062XLA Logic Cells = 5472 Relative Die Size = 1 Altera EPF10K100A Logic Cells = 4992 Relative Die Size = 1.44 Because the 10KA family was designed with first generation 0.35 micron technology and the XLA is designed with state-of-the-art 0.25 micron technology, the XLA die sizes are much smaller. In this case, we looked at the 4062XLA vs. the 10K100A and found the 10K100A to be 44% larger in die size. In most cases the XC4062XLA will hold more logic than the 10K100A. With the XLA family we can offer similar or lower prices than Altera 10KA devices and maintain a much higher level of profitability. Source: Actual die size comparison of optimized .35u products

XC4000X I/O Performance This foil shows the estimated increase in I/O performance from the XC4000XL to the XC4000XLA and XV. The existing -08 chip to chip performance with the global clock is 96MHZ. The XLA/XV global clock I/O performance will go to 133MHz. Using the Fast Clock users will be able to get 208MHz chip to chip performance.